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LM3S6618-EQC50-A2

Texas Instruments

LM3S6618-EQC50-A2 by Texas Instruments

Texas Instruments' LM3S6618-EQC50-A2 is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. Operating at up to 8.192 MHz, it features 38 I/O lines, PWM channels, and ADC channels for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,085 parts In-Stock

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3,085

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Digiode

USA . 2,626 parts In-Stock

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2,626

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Distributors (Availability)

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AZTECH Wire

Italy . 860 parts In-Stock

1+ parts

$16.915

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860

$16.915

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One Stop Electronics

USA . 691 parts In-Stock

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$20.000

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691

$20.000

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Parana Technologies

USA . 158 parts In-Stock

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$41.564

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158

$41.564

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ChromeModa Solutions

Germany . 3,517 parts In-Stock

1+ parts

$46.701

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$38.295

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3,517

$46.701

$38.295

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IDEA Electronic Components Group

UK . 2,281 parts In-Stock

1+ parts

$46.701

100+ parts

$44.366

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$42.031

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2,281

$46.701

$44.366

$42.031

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Corphita

USA . 4,003 parts In-Stock

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4,003

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DigiPath Technology Company

USA . 1,067 parts In-Stock

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$42.106

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$42.106

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Microchip USA

USA . 136 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S6618-EQC50-A2 microcontroller by Texas Instruments. Crafted with precision and quality in mind, this versatile device is designed to meet the demands of a wide range of applications. With its advanced technology and reliable performance, this microcontroller offers unparalleled value and benefits to customers. Whether you're working on industrial automation, consumer electronics, or automotive systems, this product delivers the speed, efficiency, and reliability you need to bring your ideas to life. Trust Texas Instruments for cutting-edge solutions that drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for packaging, ensuring the safety and protection of the microcontroller.

Maximum Supply Voltage: 2.75 V

Allows for safe operation within a specified range, preventing potential damage from overvoltage.

Bit Size: 32

High bit size provides sufficient processing power for complex tasks and calculations.

Maximum Clock Frequency: 8.192 MHz

High clock frequency enables fast and efficient operation of the microcontroller.

RAM Bytes: 32768

Generous RAM size allows for storage of data and instructions, improving overall performance.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller without the need for specialized equipment.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Technical Specifications

Microcontrollers LM3S6618-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

38

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6618-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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