Loading...

LM3S6432-EQC50-A2

Texas Instruments

LM3S6432-EQC50-A2 by Texas Instruments

Texas Instruments' LM3S6432-EQC50-A2 is a 32-bit microcontroller with 32768 bytes of RAM and 98304 ROM words. Operating at up to 0.032 MHz, it features 43 I/O lines, PWM channels, and ADC channels for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,936 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,936

-

-

-

-

Digiode

USA . 3,277 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,277

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 874 parts In-Stock

1+ parts

$15.808

100+ parts

-

1k+ parts

-

10k+ parts

-

874

$15.808

-

-

-

One Stop Electronics

USA . 1,525 parts In-Stock

1+ parts

$35.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,525

$35.000

-

-

-

Parana Technologies

USA . 364 parts In-Stock

1+ parts

$37.559

100+ parts

-

1k+ parts

-

10k+ parts

-

364

$37.559

-

-

-

DigiPath Technology Company

USA . 623 parts In-Stock

1+ parts

$41.357

100+ parts

-

1k+ parts

-

10k+ parts

-

623

$41.357

-

-

-

IDEA Electronic Components Group

UK . 1,240 parts In-Stock

1+ parts

$42.201

100+ parts

$40.091

1k+ parts

$37.981

10k+ parts

-

1,240

$42.201

$40.091

$37.981

-

ChromeModa Solutions

Germany . 1,060 parts In-Stock

1+ parts

$42.201

100+ parts

$34.605

1k+ parts

-

10k+ parts

-

1,060

$42.201

$34.605

-

-

Microchip USA

USA . 2,626 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,626

-

-

-

-

Corphita

USA . 604 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

604

-

-

-

-

Overview

Unleash the power of innovation with the Texas Instruments LM3S6432-EQC50-A2 microcontroller. Crafted with precision and expertise, this device offers unrivaled performance and reliability for a wide range of applications. Whether you're looking to enhance your industrial processes, optimize your control systems, or streamline your automation solutions, this microcontroller delivers the value and efficiency you need. Trust in Texas Instruments to provide cutting-edge technology that pushes boundaries and transforms possibilities. Elevate your projects with the LM3S6432-EQC50-A2 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 2.75 V

Optimal voltage level for stable and safe operation.

Package Shape: SQUARE

Square shape allows for efficient use of space on a PCB.

Bit Size: 32

Provides sufficient processing power for a wide range of applications.

Power Supplies (V): 2.5,3.3

Supports multiple voltage options for flexibility in design.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK

Flatpack design simplifies the manufacturing and assembly process.

Minimum Supply Voltage: 2.25 V

Ensures reliable performance even at lower voltage levels.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Designed to operate in harsh cold environments.

Terminal Finish: TIN

TIN finish provides good conductivity and corrosion resistance.

ADC Channels: YES

Ability to convert analog signals to digital, essential for sensor interfacing.

Terminal Position: QUAD

Quad terminal position allows for secure connection on the PCB.

ROM Words: 98304

Large ROM capacity for storing program instructions.

Maximum Seated Height: 1.6 mm

Low profile design saves space and allows for compact PCB designs.

Width: 14 mm

Compact width for efficient use of board space.

Maximum Clock Frequency: 0.032 MHz

High clock frequency for quick processing capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient reflow soldering during manufacturing.

Peak Reflow Temperature °C: 260

Can withstand high-temperature soldering processes.

Length: 14 mm

Compact length for space-constrained designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient and high-speed processing.

RAM Bytes: 32768

Sufficient RAM capacity for data storage and manipulation.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals for secure soldering connections.

Nominal Supply Voltage: 2.5 V

Stable nominal voltage level for consistent performance.

PWM Channels: YES

Pulse Width Modulation channels for precise control over output signals.

ROM Programmability: FLASH

Flash programmable ROM for easy firmware updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB layouts.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates good resistance to moisture during storage and handling.

Speed: 50 rpm

Operating speed of 50 rpm for efficient data processing.

No. of I/O Lines: 43

Sufficient number of I/O lines for interfacing with external devices.

Technical Specifications

Microcontrollers LM3S6432-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

43

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6432-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20