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LM3S6420-IQC25-A2

Texas Instruments

LM3S6420-IQC25-A2 by Texas Instruments

LM3S6420-IQC25-A2 by Texas Instruments is a 32-bit microcontroller with 32768 RAM bytes and 98304 ROM words. It operates b/w -40 to 85 °C, has a clock frequency of 0.032 MHz, and offers 46 I/O lines for industrial applications.

Median Price

$15.424

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 151 parts In-Stock

1+ parts

-

100+ parts

$13.710

1k+ parts

$12.270

10k+ parts

$11.540

151

-

$13.710

$12.270

$11.540

Verical

USA . 106 parts In-Stock

1+ parts

-

100+ parts

$17.137

1k+ parts

$15.338

10k+ parts

$14.425

106

-

$17.137

$15.338

$14.425

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 40 parts In-Stock

1+ parts

$13.500

100+ parts

$8.438

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-

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40

$13.500

$8.438

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-

Digiode

USA . 4,817 parts In-Stock

1+ parts

$14.468

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4,817

$14.468

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Vyrian

USA . 7,493 parts In-Stock

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DigiKey Marketplace

USA . 76 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 40 parts In-Stock

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Dan-Mar Components

USA . 40 parts In-Stock

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40

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Distributors (Availability)

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Ampacity Inc.

Singapore . 32 parts In-Stock

1+ parts

$12.950

100+ parts

-

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32

$12.950

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Corphita

USA . 4,424 parts In-Stock

1+ parts

$13.707

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$13.707

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Parana Technologies

USA . 2,174 parts In-Stock

1+ parts

$36.421

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$36.421

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DigiPath Technology Company

USA . 70 parts In-Stock

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$40.104

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70

$40.104

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ChromeModa Solutions

Germany . 2,395 parts In-Stock

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$40.922

100+ parts

$33.556

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2,395

$40.922

$33.556

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IDEA Electronic Components Group

UK . 619 parts In-Stock

1+ parts

$40.922

100+ parts

$38.876

1k+ parts

$36.830

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619

$40.922

$38.876

$36.830

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QUARKTWIN TECHNOLOGY LTD

USA . 20,480 parts In-Stock

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Microchip USA

USA . 5,106 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Perfect Parts

USA . 45 parts In-Stock

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45

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Overview

Experience the cutting-edge technology of the Texas Instruments LM3S6420-IQC25-A2 microcontroller, a high-quality product designed to meet your industrial needs. With its advanced features and reliable performance, this microcontroller is perfect for a wide range of applications. Trust in Texas Instruments' reputation for excellence and innovation to deliver exceptional value and benefits to your projects. Upgrade to the LM3S6420-IQC25-A2 today and discover the advantages of superior quality and precision engineering in every aspect of your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 2.75 V

Suitable for low voltage applications, making it energy efficient.

Package Shape: SQUARE

Provides a compact form factor, ideal for applications with space constraints.

Bit Size: 32

Offers high computational power and processing capabilities.

Power Supplies (V): 2.5,3.3

Compatible with common voltage supplies, making it versatile for various applications.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other devices.

Package Style (Meter): FLATPACK

Facilitates easy placement and soldering during the manufacturing process.

Minimum Operating Temperature: -40 °C

Operates reliably in harsh environments with extreme temperatures.

ADC Channels: YES

Allows for analog to digital conversion, enabling the microcontroller to interface with analog sensors.

ROM Words: 98304

Provides ample memory for storing program instructions and data.

RAM Bytes: 32768

Offers sufficient memory for data storage and manipulation during program execution.

Technology: CMOS

Utilizes low power consumption and offers high noise immunity, enhancing overall performance.

ROM Programmability: FLASH

Allows for reprogramming of the memory, enabling flexibility for updates and modifications.

PWM Channels: YES

Enables pulse width modulation outputs, useful for controlling motor speeds and LED brightness.

Moisture Sensitivity Level (MSL): 3

Indicates the level of moisture sensitivity during solder reflow, ensuring proper handling and storage.

Technical Specifications

Microcontrollers LM3S6420-IQC25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6420-IQC25-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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