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LM3S628-EGZ50-C2T

Texas Instruments

LM3S628-EGZ50-C2T by Texas Instruments

LM3S628-EGZ50-C2T by Texas Instruments is a 32-bit microcontroller with 48 terminals, 8192 bytes of RAM, and a max clock frequency of 0.032 MHz. It is suitable for industrial applications requiring a high-speed RISC microcontroller with PWM channels and ADC capabilities. Operating temperature ranges from -40 to 105 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,755 parts In-Stock

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Digiode

USA . 3,965 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 519 parts In-Stock

1+ parts

$8.503

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519

$8.503

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One Stop Electronics

USA . 943 parts In-Stock

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$24.000

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943

$24.000

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Parana Technologies

USA . 271 parts In-Stock

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$41.444

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$3,848.680

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$37.299

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271

$41.444

$3,848.680

$37.299

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DigiPath Technology Company

USA . 2,183 parts In-Stock

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$45.635

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2,183

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ChromeModa Solutions

Germany . 2,576 parts In-Stock

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$46.566

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$38.184

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2,576

$46.566

$38.184

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IDEA Electronic Components Group

UK . 814 parts In-Stock

1+ parts

$46.566

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$44.238

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$41.909

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814

$46.566

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$41.909

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Corphita

USA . 3,162 parts In-Stock

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Microchip USA

USA . 1,464 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S628-EGZ50-C2T microcontroller by Texas Instruments. Designed for industrial-grade applications, this powerful 32-bit chip carrier offers a wide range of features including ADC channels, PWM channels, and ROM programmability. With a maximum clock frequency of 0.032 MHz and a minimum operating temperature of -40°C, this microcontroller provides reliable performance in any environment. Trust in Texas Instruments' reputation for quality and innovation, and experience the value and benefits that the LM3S628-EGZ50-C2T brings to your projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and space in product design.

Maximum Supply Voltage: 3.6 V

Support for a higher supply voltage allows for flexibility in power requirements for various applications.

Package Shape: SQUARE

Square package shape helps in efficient space utilization on the PCB layout.

Bit Size: 32

32-bit architecture provides high performance and processing capabilities for complex applications.

Power Supplies (V): 3.3

Stable power supply of 3.3V ensures reliable operation of the microcontroller.

No. of Terminals: 48

Ample number of terminals provide versatility for connecting to various components and peripherals.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers protection and easy handling during assembly and operations.

Minimum Supply Voltage: 3 V

Support for a low minimum supply voltage allows for operation in power-constrained environments.

Maximum Operating Temperature: 105 °C

Wide operating temperature range makes the microcontroller suitable for industrial applications with varying environmental conditions.

Minimum Operating Temperature: -40 °C

Ability to operate at low temperatures enables usage in extreme environments without compromising performance.

ADC Channels: YES

Integrated ADC channels enable analog signal processing and sensor interfacing for diverse applications.

Terminal Position: QUAD

Quad terminal position facilitates easy and organized connection of external devices for enhanced functionality.

ROM Words: 32768

Large ROM memory size of 32768 words allows for storing program codes and data for extensive applications.

Maximum Seated Height: 1 mm

Low seated height makes the microcontroller suitable for compact and slim device designs.

Width: 6.875 mm

Narrow width facilitates space-efficient placement on the PCB layout.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 0.032 MHz ensures swift data processing and real-time operation.

Length: 6.875 mm

Compact length contributes to the overall small footprint of the microcontroller on the PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature specification ensures reliable performance in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers high-speed processing and efficient use of resources for optimized performance.

RAM Bytes: 8192

Generous RAM size of 8192 bytes allows for efficient data storage and manipulation during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the energy efficiency and reliability of the microcontroller.

Terminal Form: NO LEAD

No lead terminal form supports surface mount technology for easy and reliable soldering onto the PCB.

Maximum Supply Current: 110 mA

Moderate supply current requirements of 110 mA ensure efficient power usage and minimal heat dissipation.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V ensures stable and consistent operation of the microcontroller.

PWM Channels: YES

Integrated PWM channels enable precise control of digital signals for applications like motor control and LED dimming.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility to reprogram the microcontroller for firmware updates and customizations.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for compact layout and high-density integration of external connections.

Speed: 50 rpm

Operational speed of 50 rpm ensures efficient data processing and signal handling for real-time applications.

No. of I/O Lines: 28

Adequate number of I/O lines enable interface with external devices and peripherals for versatile functionality and communication.

Technical Specifications

Microcontrollers LM3S628-EGZ50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

28

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S628-EGZ50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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