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LM3S6100-EQC25-A2

Texas Instruments

LM3S6100-EQC25-A2 by Texas Instruments

Texas Instruments LM3S6100-EQC25-A2 is a 32-bit Cortex-M3 microcontroller with 100 terminals, operating at -40 to 85°C. It features 16384 bytes of RAM, 65536 ROM words, and PWM channels for industrial applications requiring high-speed processing and ADC capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,581 parts In-Stock

1+ parts

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5,581

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Digiode

USA . 1,002 parts In-Stock

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1,002

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 293 parts In-Stock

1+ parts

$8.849

100+ parts

-

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293

$8.849

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One Stop Electronics

USA . 1,493 parts In-Stock

1+ parts

$10.000

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-

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1,493

$10.000

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Parana Technologies

USA . 1,701 parts In-Stock

1+ parts

$65.967

100+ parts

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1,701

$65.967

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DigiPath Technology Company

USA . 701 parts In-Stock

1+ parts

$72.638

100+ parts

$66.827

1k+ parts

-

10k+ parts

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701

$72.638

$66.827

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ChromeModa Solutions

Germany . 1,106 parts In-Stock

1+ parts

$74.120

100+ parts

$60.778

1k+ parts

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1,106

$74.120

$60.778

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IDEA Electronic Components Group

UK . 379 parts In-Stock

1+ parts

$74.120

100+ parts

$70.414

1k+ parts

$66.708

10k+ parts

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379

$74.120

$70.414

$66.708

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Corphita

USA . 4,825 parts In-Stock

1+ parts

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4,825

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Microchip USA

USA . 133 parts In-Stock

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133

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Overview

Unlock the power of innovation with the LM3S6100-EQC25-A2 microcontroller by Texas Instruments. Designed with cutting-edge technology and superior quality, this device offers unparalleled performance for a wide range of applications. From smart appliances to industrial automation, this microcontroller delivers reliability and efficiency like no other. Experience seamless integration, advanced features, and exceptional value with the LM3S6100-EQC25-A2. Elevate your projects and stay ahead of the competition with this industry-leading solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 2.75 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making this microcontroller energy-efficient.

Package Shape: SQUARE

The square package shape makes it easier to mount and align the microcontroller on a circuit board, improving overall circuit layout.

Bit Size: 32

A 32-bit microcontroller offers higher computational power and can handle more complex tasks compared to lower bit size microcontrollers.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages gives flexibility in designing and compatibility with various power sources.

No. of Terminals: 100

Having a high number of terminals allows for more connectivity options and peripheral attachments, enhancing the versatility of the microcontroller.

Package Style (Meter): FLATPACK

Flatpack package style provides a thinner profile, saving space on the circuit board and allowing for compact designs in electronic devices.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage ensures reliable operation even in low-power situations, making this microcontroller suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environments and temperature fluctuations, increasing its durability.

CPU Family: CORTEX-M3

Belonging to the Cortex-M3 family indicates that this microcontroller is optimized for low power consumption, high performance, and efficient code execution.

Minimum Operating Temperature: -40 °C

The wide temperature range allows this microcontroller to operate in extreme cold conditions, making it suitable for industrial and automotive applications.

ADC Channels: YES

Analog-to-digital converter (ADC) channels enable the microcontroller to interface with analog sensors and signals, expanding its capability to measure and control analog inputs.

Terminal Position: QUAD

Quad terminal position provides a stable and secure connection on the circuit board, minimizing the risk of signal loss or disconnection.

ROM Words: 65536

With a large ROM size, this microcontroller can store a significant amount of program code, allowing for more complex algorithms and functions to be executed.

Maximum Seated Height: 1.6 mm

The low seated height makes it easier to design slim and compact electronic devices with this microcontroller, providing flexibility in product design.

Width: 14 mm

The compact width of the microcontroller enables space-efficient integration on the circuit board, ideal for applications with limited board real estate.

Maximum Clock Frequency: 0.032 MHz

The high clock frequency allows for fast processing speed, quick response times, and efficient execution of instructions in real-time applications.

Length: 14 mm

The small length of the microcontroller contributes to its compact form factor, making it suitable for miniaturized electronic devices and IoT applications.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this microcontroller meets the required standards for reliability, durability, and performance in harsh industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers efficient instruction execution, low power consumption, and high performance, making it suitable for a wide range of applications.

RAM Bytes: 16384

Having a large RAM size allows the microcontroller to store and process data quickly, enhancing its multitasking capabilities and overall performance.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and reliable operation, making this microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form offers mechanical stability, ease of soldering, and secure connections on the circuit board, ensuring reliable performance.

Nominal Supply Voltage: 2.5 V

The specified nominal supply voltage indicates the standard operating voltage for this microcontroller, ensuring compatibility with most power sources and systems.

PWM Channels: YES

Pulse width modulation (PWM) channels allow precise control of analog signals and power management, enabling this microcontroller to drive motors, LEDs, and other peripherals efficiently.

ROM Programmability: FLASH

ROM programmability with flash memory enables easy reprogramming of the microcontroller, firmware updates, and field customization, offering flexibility and adaptability in product development.

Terminal Pitch: 0.5 mm

The fine terminal pitch enables high-density integration on the circuit board, saving space and enabling complex designs with multiple components in a limited area.

Speed: 25 rpm

The specified speed may refer to the processing speed or communication rate of the microcontroller, indicating its capability to handle tasks quickly and efficiently.

No. of I/O Lines: 30

With a sufficient number of input/output lines, this microcontroller can interface with external devices, sensors, and peripherals, enabling versatile connectivity and functionality.

Technical Specifications

Microcontrollers LM3S6100-EQC25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

30

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6100-EQC25-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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