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LM3S610-IQN50-C2

Texas Instruments

LM3S610-IQN50-C2 by Texas Instruments

Texas Instruments LM3S610-IQN50-C2 microcontroller features 32-bit Cortex-M3 CPU, 8KB RAM, and 32768 ROM words. Ideal for industrial applications with peripherals like PWM(6) and TIMER(3), operating at a max clock frequency of 0.032 MHz. Package style is flatpack with dimensions of 7mm x 7mm and terminal pitch of 0.5mm.

Median Price

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Lifecycle Status

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2

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Vyrian

USA . 5,863 parts In-Stock

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Digiode

USA . 682 parts In-Stock

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682

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AZTECH Wire

Italy . 314 parts In-Stock

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$17.589

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One Stop Electronics

USA . 917 parts In-Stock

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$35.000

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Parana Technologies

USA . 1,931 parts In-Stock

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$57.848

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DigiPath Technology Company

USA . 1,490 parts In-Stock

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$63.698

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$58.602

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ChromeModa Solutions

Germany . 1,572 parts In-Stock

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$64.998

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$53.298

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IDEA Electronic Components Group

UK . 652 parts In-Stock

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$64.998

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$58.498

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Corphita

USA . 505 parts In-Stock

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Microchip USA

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Overview

Elevate your projects with the LM3S610-IQN50-C2 by Texas Instruments, a top-tier microcontroller that delivers unparalleled performance and reliability. Crafted with precision and expertise, this product offers exceptional value to customers across various industries. Seamlessly integrating into a wide range of applications, this microcontroller ensures optimal functionality and efficiency. Embrace cutting-edge technology and unlock endless possibilities with the LM3S610-IQN50-C2 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various environments and applications.

Integrated Cache: YES

Integrated cache helps improve performance by storing frequently used instructions or data, reducing the need to access external memory.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options and compatibility with different voltage sources.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and manipulation within the microcontroller.

Bit Size: 32

A 32-bit architecture enables the microcontroller to handle larger data sizes and perform more complex calculations efficiently.

Power Supplies (V): 3.3

This specific voltage requirement ensures stable and reliable operation of the microcontroller within the specified parameter.

No. of Terminals: 48

Having a higher number of terminals allows for more I/O options and connectivity possibilities, making the microcontroller versatile for different applications.

Minimum Operating Temperature: -40 °C

The wide range of operating temperature makes the microcontroller suitable for use in extreme temperature conditions, ensuring consistent performance.

ADC Channels: YES

Integrated ADC channels allow the microcontroller to interface with analog sensors or signals, making it suitable for applications requiring analog input processing.

ROM Words: 32768

Having a large ROM capacity allows for storing a significant amount of program code, making the microcontroller suitable for complex applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers efficient instruction execution and improved performance for various applications.

RAM Bytes: 8192

The ample RAM capacity allows for storing and manipulating data during program execution, enhancing the microcontroller's performance.

Analog To Digital Convertors: 2-Ch 10-Bit

Having integrated ADC converters enables the microcontroller to interface with analog sensors or signals, expanding its application possibilities.

Connectivity: I2C, SSI, UART(2)

Support for multiple communication interfaces facilitates easy integration with external devices, enabling seamless data exchange.

Technical Specifications

Microcontrollers LM3S610-IQN50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

34

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SSI, UART(2)

Peripherals:

PWM(6), TIMER(3), WDT

Analog To Digital Convertors:

2-Ch 10-Bit

Trade Compliance

LM3S610-IQN50-C2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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