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LM3S608-EGZ50-C2

Texas Instruments

LM3S608-EGZ50-C2 by Texas Instruments

LM3S608-EGZ50-C2 by Texas Instruments is a 32-bit microcontroller with 3.3V power supply, 32768 ROM words, and 8192 RAM bytes. It operates in industrial temperatures from -40 to 105°C and features PWM channels for various applications requiring a max clock frequency of 0.032 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,610 parts In-Stock

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3,610

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Vyrian

USA . 3,308 parts In-Stock

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3,308

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Distributors (Availability)

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One Stop Electronics

USA . 675 parts In-Stock

1+ parts

$8.000

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675

$8.000

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AZTECH Wire

Italy . 704 parts In-Stock

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$14.720

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704

$14.720

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Parana Technologies

USA . 26 parts In-Stock

1+ parts

$27.182

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$33.044

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26

$27.182

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$33.044

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DigiPath Technology Company

USA . 2,202 parts In-Stock

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$29.931

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2,202

$29.931

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IDEA Electronic Components Group

UK . 1,857 parts In-Stock

1+ parts

$30.542

100+ parts

$29.015

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$27.488

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1,857

$30.542

$29.015

$27.488

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ChromeModa Solutions

Germany . 532 parts In-Stock

1+ parts

$30.542

100+ parts

$25.044

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532

$30.542

$25.044

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Corphita

USA . 4,511 parts In-Stock

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Microchip USA

USA . 2,494 parts In-Stock

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Overview

Unleash the power of innovation with Texas Instruments' LM3S608-EGZ50-C2 microcontroller. This high-quality product offers unparalleled performance and reliability, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers exceptional value and efficiency to customers. With advanced features and cutting-edge technology, the LM3S608-EGZ50-C2 is the perfect choice for your next project. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on PCBs, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V allows for compatibility with a wide range of power sources.

Package Shape: SQUARE

Square package shape provides uniformity and ease of handling during assembly.

Bit Size: 32

32-bit processing capability enables efficient handling of data and instructions, suitable for a variety of applications.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable performance of the microcontroller.

No. of Terminals: 48

Abundance of terminals allows for connectivity to various external components and peripherals.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers compactness and protection for the integrated circuit.

Minimum Supply Voltage: 3 V

Support for a minimum supply voltage of 3V ensures flexibility in power source options.

Maximum Operating Temperature: 105 °C

High maximum operating temperature of 105°C makes the microcontroller suitable for industrial environments with elevated temperatures.

CPU Family: CORTEX-M3

Utilizing the Cortex-M3 CPU family ensures efficient processing capabilities and compatibility with a wide range of software.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows for reliable operation in colder environments.

ADC Channels: YES

Integrated ADC channels enable analog sensing and signal processing within the microcontroller itself.

Terminal Position: QUAD

Quad terminal positioning facilitates easier routing of connections on the PCB and enhances signal integrity.

ROM Words: 32768

Large ROM capacity of 32768 words provides ample storage for program instructions and data.

Maximum Seated Height: 1 mm

Low maximum seated height of 1mm enables slim and compact device designs.

Width: 6.875 mm

Narrow width of 6.875mm makes the microcontroller suitable for space-constrained applications.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 0.032MHz allows for fast and responsive system operation.

Length: 6.875 mm

Compact length of 6.875mm complements the narrow width for space-efficient PCB layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Integration of RISC architecture in the microcontroller's peripheral IC type enables efficient and streamlined processing.

RAM Bytes: 8192

Generous RAM capacity of 8192 bytes allows for efficient data storage and manipulation during program execution.

Technology: CMOS

Utilization of CMOS technology offers low power consumption and high noise immunity for enhanced reliability.

Terminal Form: NO LEAD

No-lead terminal form simplifies soldering and enhances mechanical reliability in surface mount applications.

Maximum Supply Current: 110 mA

Maximum supply current of 110mA ensures efficient power utilization and minimal heat dissipation.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent performance and compatibility with standard power sources.

PWM Channels: YES

Built-in PWM channels enable precise control of analog circuits and components, expanding application versatility.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating and modification of program code, enhancing flexibility and adaptability.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5mm facilitates high-density PCB layouts and enables efficient routing of connections.

Speed: 50 rpm

Operational speed of 50rpm allows for rapid execution of instructions and timely response to inputs.

No. of I/O Lines: 28

Abundance of I/O lines provides ample connectivity for interfacing with external devices and peripherals, enhancing system functionality.

Technical Specifications

Microcontrollers LM3S608-EGZ50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

28

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S608-EGZ50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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