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LM3S601-IGZ50-C2

Texas Instruments

LM3S601-IGZ50-C2 by Texas Instruments

LM3S601-IGZ50-C2 by Texas Instruments is a 32-bit microcontroller with 48 terminals, operating at a max frequency of 0.032 MHz. It features 8192 bytes of RAM, 32768 ROM words, and ADC channels for industrial applications requiring high-speed processing and PWM control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,482 parts In-Stock

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Digiode

USA . 2,781 parts In-Stock

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2,781

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Distributors (Availability)

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One Stop Electronics

USA . 364 parts In-Stock

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$18.000

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364

$18.000

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AZTECH Wire

Italy . 758 parts In-Stock

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$18.640

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758

$18.640

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Ampacity Inc.

Singapore . 579 parts In-Stock

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$19.000

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$19.000

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Parana Technologies

USA . 2,043 parts In-Stock

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$57.441

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$57.441

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DigiPath Technology Company

USA . 1,911 parts In-Stock

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$63.249

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ChromeModa Solutions

Germany . 3,893 parts In-Stock

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$64.540

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$52.923

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$64.540

$52.923

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IDEA Electronic Components Group

UK . 2,234 parts In-Stock

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$64.540

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$61.313

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$58.086

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$58.086

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Corphita

USA . 4,960 parts In-Stock

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Microchip USA

USA . 2,849 parts In-Stock

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Futuretech Components

Singapore . 86 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S601-IGZ50-C2 by Texas Instruments! This cutting-edge microcontroller boasts top-notch quality and reliability from a manufacturer known for innovation. Ideal for a wide range of applications, this product offers unmatched value with its 32-bit CPU, ample ROM and RAM, PWM channels, ADC capabilities, and industrial-grade temperature tolerance. Experience seamless performance and flexibility in your projects with the LM3S601-IGZ50-C2 - the ultimate solution for all your microcontroller needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and compact soldering of the microcontroller onto a printed circuit board, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage tolerance provides flexibility in power supply compatibility and protects the microcontroller from potential voltage spikes, ensuring reliability.

Package Shape: SQUARE

Square package shape is efficient for space utilization on the PCB and facilitates easier layout design for system integration.

Bit Size: 32

A 32-bit architecture offers improved processing power and efficiency, making the microcontroller suitable for complex applications requiring high computational capabilities.

Power Supplies (V): 3.3

The 3.3V power supply is commonly used in many electronic devices, providing compatibility and convenience for integration with various components in a system.

No. of Terminals: 48

More terminals offer greater connectivity options, allowing for versatile external connections and interfacing with other devices in a design.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging provides protection for the microcontroller and enables efficient heat dissipation, ensuring high reliability and thermal performance.

Minimum Supply Voltage: 3 V

Having a low minimum supply voltage requirement ensures compatibility with a wide range of power sources, enhancing the microcontroller's flexibility in different operating conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature rating, the microcontroller can withstand harsh environmental conditions and operate reliably in industrial settings.

CPU Family: CORTEX-M3

Featuring a Cortex-M3 CPU family offers a balance between performance and power efficiency, making it well-suited for a variety of embedded applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures the microcontroller's functionality in extreme cold environments, expanding its usability across different applications.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, allowing the microcontroller to interface with sensors and other analog devices for data acquisition and processing.

Terminal Position: QUAD

Quad terminal positioning offers improved pinout arrangement, simplifying PCB routing and enhancing signal integrity in the design layout.

ROM Words: 32768

With 32768 ROM words, the microcontroller has ample memory for storing program instructions and data, supporting complex algorithms and functions in the application.

Maximum Seated Height: 1 mm

A low maximum seated height contributes to a compact overall design profile, making the microcontroller suitable for space-constrained applications where height restrictions apply.

Width: 6.875 mm

The small width dimension allows for a more efficient use of space on the PCB, contributing to a compact system layout and enabling high-density integration of components.

Maximum Clock Frequency: 0.032 MHz

A high maximum clock frequency of 32 MHz indicates fast processing speed and high performance capabilities, making the microcontroller suitable for demanding real-time applications.

Length: 6.875 mm

The moderate length dimension provides balance in the form factor of the microcontroller, offering a versatile footprint for integration in various electronic designs.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this microcontroller can operate reliably in demanding environments with extended temperature ranges and harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Featuring a RISC architecture, the microcontroller offers efficient data processing and reduced instruction execution time, making it suitable for high-performance applications.

RAM Bytes: 8192

With 8192 bytes of RAM, the microcontroller can efficiently handle data storage and manipulation tasks, supporting multitasking capabilities and data-intensive operations.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ensuring energy efficiency and robust performance in the microcontroller's operation.

Terminal Form: NO LEAD

No lead terminal form simplifies the soldering process and enhances thermal management, optimizing the overall reliability and performance of the microcontroller.

Maximum Supply Current: 110 mA

The maximum supply current of 110 mA indicates efficient power usage and low power consumption, making the microcontroller suitable for battery-powered or energy-efficient applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable and reliable operation of the microcontroller, providing consistent performance across various operating conditions.

PWM Channels: YES

The availability of PWM channels allows for precise control of analog signals, enabling the microcontroller to perform tasks such as motor speed control, LED dimming, and power management.

ROM Programmability: FLASH

Flash ROM programmability enables flexible and easy firmware updates, allowing for quick system modifications and enhancements without requiring physical ROM replacement.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5mm provides a fine pitch spacing for the terminals, enabling high-density mounting and efficient PCB layout design in space-constrained applications.

Speed: 50 rpm

With a speed rating of 50 revolutions per minute (rpm), this microcontroller can handle tasks that involve timing and speed control, making it suitable for applications requiring precise motor control or timing functions.

No. of I/O Lines: 36

Having 36 I/O lines offers extensive connectivity options for interfacing with external devices and peripherals, allowing for versatile input/output configurations and system integration capabilities.

Technical Specifications

Microcontrollers LM3S601-IGZ50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S601-IGZ50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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