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LM3S5P36-IQR80-C1

Texas Instruments

LM3S5P36-IQR80-C1 by Texas Instruments

Texas Instruments' LM3S5P36-IQR80-C1 is a 32-bit microcontroller with 64 terminals, operating at a max clock frequency of 0.032 MHz. It features ADC and DMA channels, suitable for industrial applications requiring high-speed processing and PWM functionality. The compact square package style with gull wing terminals makes it ideal for space-constrained designs.

Median Price

$9.520

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Bristol Electronics

USA . 10 parts In-Stock

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$9.520

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$9.520

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Vyrian

USA . 5,332 parts In-Stock

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Digiode

USA . 1,974 parts In-Stock

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Microfarads

USA . 10 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 426 parts In-Stock

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$17.101

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426

$17.101

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One Stop Electronics

USA . 523 parts In-Stock

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$26.000

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523

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Parana Technologies

USA . 1,961 parts In-Stock

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$28.193

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$44.740

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DigiPath Technology Company

USA . 2,117 parts In-Stock

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$31.043

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$28.560

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2,117

$31.043

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ChromeModa Solutions

Germany . 1,746 parts In-Stock

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$31.677

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$25.975

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IDEA Electronic Components Group

UK . 1,681 parts In-Stock

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$31.677

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$30.093

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$28.509

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Corphita

USA . 4,055 parts In-Stock

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Authorized Procurement Solutions

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Microchip USA

USA . 308 parts In-Stock

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Overview

Elevate your projects with the LM3S5P36-IQR80-C1 microcontroller from Texas Instruments. Crafted with top-notch quality and precision, this versatile device offers a wide range of applications in various industries. Designed to deliver exceptional performance, efficiency, and reliability, this microcontroller provides unmatched value for customers seeking cutting-edge technology. Whether you're working on robotics, automation, or IoT projects, the LM3S5P36-IQR80-C1 is your ultimate solution for seamless integration and superior results. Choose excellence, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.32 V

Provides flexibility in power supply options while ensuring safe operation of the microcontroller.

Bit Size: 32

Offers high processing power and capability, suitable for handling complex tasks and computations.

No. of Terminals: 64

Provides ample connectivity options for interfacing with other components and peripherals in a system.

Package Style (Meter): FLATPACK

Compact and space-saving design, ideal for applications where board space is limited.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, suitable for industrial applications with demanding operating conditions.

ADC Channels: YES

Integrated analog-to-digital converter channels allow for efficient conversion of analog signals to digital data for processing.

DMA Channels: YES

Direct Memory Access channels enable faster data transfer between peripherals and memory without involving the CPU.

Terminal Position: QUAD

Quad terminal position provides uniform and organized connectivity layout, aiding in easier circuit design and debugging.

Maximum Seated Height: 1.6 mm

Low-profile design for space-constrained applications, ensuring compatibility with compact electronic devices.

Width: 10 mm

Compact width dimensions make integration into small form factor systems convenient.

Maximum Clock Frequency: 0.032 MHz

Efficient clock frequency enables fast execution of instructions and tasks, enhancing overall system performance.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature ranges and conditions.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for microcontroller applications, providing dedicated features and functions for control and processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for energy-efficient and reliable operation.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and assembly onto PCBs, ensuring secure and reliable connections.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage for consistent performance and operation of the microcontroller.

PWM Channels: YES

Pulse Width Modulation channels provide precise control over output signals, suitable for applications requiring variable power control.

ROM Programmability: FLASH

Flash ROM programmability enables flexible and easy firmware updates and customizations.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact PCB layouts and high-density circuit designs.

Speed: 80 rpm

Speed capability of 80 rotations per minute suits various applications requiring control and monitoring of rotational speed.

No. of I/O Lines: 33

Ample input/output lines for interfacing with external devices and sensors, enhancing versatility and connectivity options.

Technical Specifications

Microcontrollers LM3S5P36-IQR80-C1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5P36-IQR80-C1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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