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LM3S5C31-IQC80-A1T

Texas Instruments

LM3S5C31-IQC80-A1T by Texas Instruments

LM3S5C31-IQC80-A1T by Texas Instruments is a 32-bit microcontroller with 67 I/O lines, operating at up to 16.384 MHz clock frequency. It features ADC and DMA channels, suitable for industrial applications requiring a temperature range of -40 to 85°C. The package style is flatpack with low profile and fine pitch terminals, making it ideal for compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,179 parts In-Stock

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Digiode

USA . 4,340 parts In-Stock

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4,340

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Distributors (Availability)

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One Stop Electronics

USA . 727 parts In-Stock

1+ parts

$3.000

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-

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727

$3.000

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AZTECH Wire

Italy . 797 parts In-Stock

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$10.891

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797

$10.891

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Parana Technologies

USA . 1,108 parts In-Stock

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$25.975

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$26.568

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1,108

$25.975

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$26.568

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ChromeModa Solutions

Germany . 3,507 parts In-Stock

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$29.185

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$23.932

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3,507

$29.185

$23.932

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IDEA Electronic Components Group

UK . 1,902 parts In-Stock

1+ parts

$29.185

100+ parts

$27.726

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$26.266

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1,902

$29.185

$27.726

$26.266

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Corphita

USA . 2,782 parts In-Stock

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2,782

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DigiPath Technology Company

USA . 1,148 parts In-Stock

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$26.313

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$26.313

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Microchip USA

USA . 427 parts In-Stock

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427

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Overview

Elevate your projects with the LM3S5C31-IQC80-A1T by Texas Instruments, a top-tier microcontroller that boasts premium quality and reliability. Designed by a renowned manufacturer in the industry, this powerful device offers endless possibilities for applications in various fields. With its cutting-edge technology and advanced features like ADC and DMA channels, this microcontroller ensures seamless performance and efficiency. Experience the value and benefits of this product with its wide range of I/O lines and ROM programmability, making it an essential component for any project. Upgrade to the LM3S5C31-IQC80-A1T today and unlock the full potential of your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the microcontroller, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount design allows for easy integration onto circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle higher voltage inputs, providing flexibility in power requirements.

Bit Size: 32

32-bit architecture allows for efficient processing and handling of data, suitable for complex applications that require high performance.

No. of Terminals: 100

Having 100 terminals allows for a wide range of connectivity options, making it versatile for different types of interfaces and peripherals.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this microcontroller can withstand harsh environmental conditions, making it suitable for industrial use.

Maximum Clock Frequency: 16.384 MHz

High clock frequency of 16.384 MHz enables fast processing speeds, making it suitable for applications that require quick response times.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing a RISC architecture in a microcontroller provides efficient and optimized performance, making it a good choice for high-speed processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

PWM Channels: YES

Pulse Width Modulation (PWM) channels allow for precise control of analog signals, making the microcontroller suitable for applications such as motor control and power management.

Technical Specifications

Microcontrollers LM3S5C31-IQC80-A1T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S5C31-IQC80-A1T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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