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LM3S5656-IQR80-C1T

Texas Instruments

LM3S5656-IQR80-C1T by Texas Instruments

Texas Instruments' LM3S5656-IQR80-C1T microcontroller features 32-bit architecture, 131072 ROM words, and 32768 RAM bytes. With ADC and DMA channels, it operates in industrial temperatures (-40 to 85 °C) for various applications requiring a max clock frequency of 0.032 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,745 parts In-Stock

1+ parts

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5,745

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Digiode

USA . 3,189 parts In-Stock

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3,189

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,475 parts In-Stock

1+ parts

$12.000

100+ parts

-

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1,475

$12.000

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AZTECH Wire

Italy . 233 parts In-Stock

1+ parts

$19.568

100+ parts

-

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233

$19.568

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Parana Technologies

USA . 1,716 parts In-Stock

1+ parts

$20.060

100+ parts

$1,862.848

1k+ parts

$18.054

10k+ parts

-

1,716

$20.060

$1,862.848

$18.054

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DigiPath Technology Company

USA . 343 parts In-Stock

1+ parts

$22.088

100+ parts

-

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343

$22.088

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ChromeModa Solutions

Germany . 3,826 parts In-Stock

1+ parts

$22.539

100+ parts

$18.482

1k+ parts

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3,826

$22.539

$18.482

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IDEA Electronic Components Group

UK . 1,426 parts In-Stock

1+ parts

$22.539

100+ parts

$21.412

1k+ parts

$20.285

10k+ parts

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1,426

$22.539

$21.412

$20.285

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Corphita

USA . 1,038 parts In-Stock

1+ parts

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1,038

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Microchip USA

USA . 233 parts In-Stock

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233

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Overview

Experience the cutting-edge technology of the Texas Instruments LM3S5656-IQR80-C1T microcontroller, a high-quality product that offers unparalleled performance and reliability. Designed by a renowned manufacturer, this device is perfect for a wide range of applications in various industries. With its advanced features and capabilities, this microcontroller provides exceptional value, benefits, and advantages to customers seeking top-notch electronic components. Upgrade your projects with the LM3S5656-IQR80-C1T and unlock endless possibilities in innovation and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the microcontroller lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly processes.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power supply options.

Package Shape: SQUARE

The square package shape helps in easy placement and orientation on the PCB.

Bit Size: 32

The 32-bit size provides efficient processing and computational capabilities.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages allows for compatibility with various systems.

No. of Terminals: 64

The high number of terminals enables connectivity to a wide range of external components and peripherals.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact and space-saving design for tight PCB layouts.

Minimum Supply Voltage: 1.08 V

The low minimum supply voltage ensures efficient power consumption and operation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the microcontroller suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance in harsh environments.

ADC Channels: YES

The presence of ADC channels allows for analog signal processing and conversion.

DMA Channels: YES

Support for DMA channels enhances data transfer and processing efficiency.

Terminal Position: QUAD

The quad terminal position provides convenient access and connection points for external devices.

ROM Words: 131072

The large ROM capacity allows for storing a significant amount of program data and instructions.

Maximum Seated Height: 1.6 mm

The low maximum seated height enables compact and slim device designs.

Width: 10 mm

The compact width size allows for space-efficient placement on the PCB.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency enables fast and responsive operation.

Length: 10 mm

The short length size facilitates efficient PCB layout and space utilization.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in rugged industrial environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it offers integrated peripherals for versatile functionality.

RAM Bytes: 32768

The ample RAM capacity allows for efficient temporary data storage during operation.

Technology: CMOS

The CMOS technology used in the microcontroller offers low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during assembly.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage ensures consistent and stable operation of the microcontroller.

PWM Channels: YES

Support for PWM channels enables precise control of analog outputs and motor speed.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and quick updates of firmware and software.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density mounting and space-efficient PCB design.

Speed: 80 rpm

The high speed capability makes the microcontroller suitable for time-critical applications.

No. of I/O Lines: 33

The ample number of I/O lines provide versatile connectivity options for interfacing with external devices.

Technical Specifications

Microcontrollers LM3S5656-IQR80-C1T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5656-IQR80-C1T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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