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LM3S5632-IQR50-A0

Texas Instruments

LM3S5632-IQR50-A0 by Texas Instruments

Texas Instruments' LM3S5632-IQR50-A0 microcontroller features 32-bit architecture, 131072 ROM words, and 32768 RAM bytes. Ideal for industrial applications, it offers CAN, I2C(2), SSI connectivity and operates at a max clock frequency of 50 MHz. With low power mode and integrated cache, it's suitable for various embedded systems.

Median Price

$25.080

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15 parts In-Stock

1+ parts

$25.080

100+ parts

$23.580

1k+ parts

$21.320

10k+ parts

-

15

$25.080

$23.580

$21.320

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,449 parts In-Stock

1+ parts

$23.826

100+ parts

-

1k+ parts

-

10k+ parts

-

2,449

$23.826

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-

-

Vyrian

USA . 5,766 parts In-Stock

1+ parts

-

100+ parts

-

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-

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5,766

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 848 parts In-Stock

1+ parts

$12.560

100+ parts

-

1k+ parts

-

10k+ parts

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848

$12.560

-

-

-

Corphita

USA . 3,765 parts In-Stock

1+ parts

$22.572

100+ parts

-

1k+ parts

-

10k+ parts

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3,765

$22.572

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-

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Microchip USA

USA . 1,663 parts In-Stock

1+ parts

$56.700

100+ parts

$55.710

1k+ parts

$55.220

10k+ parts

$54.720

1,663

$56.700

$55.710

$55.220

$54.720

Parana Technologies

USA . 46 parts In-Stock

1+ parts

$74.366

100+ parts

-

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-

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46

$74.366

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-

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DigiPath Technology Company

USA . 429 parts In-Stock

1+ parts

$81.886

100+ parts

$75.335

1k+ parts

-

10k+ parts

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429

$81.886

$75.335

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-

ChromeModa Solutions

Germany . 4,089 parts In-Stock

1+ parts

$83.557

100+ parts

$68.517

1k+ parts

-

10k+ parts

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4,089

$83.557

$68.517

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IDEA Electronic Components Group

UK . 1,028 parts In-Stock

1+ parts

$83.557

100+ parts

$79.379

1k+ parts

$75.201

10k+ parts

-

1,028

$83.557

$79.379

$75.201

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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5,000

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Perfect Parts

USA . 896 parts In-Stock

1+ parts

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896

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Kepictronics

USA . 706 parts In-Stock

1+ parts

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706

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A-Z Elektronik GmbH

Germany . 180 parts In-Stock

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180

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Overview

Unlock endless possibilities with the LM3S5632-IQR50-A0 microcontroller by Texas Instruments. Designed for industrial-grade applications, this powerhouse boasts a 32-bit Cortex-M3 CPU family and a wide array of peripherals including DMA, timers, and UART support. With its low power mode, integrated cache, and robust connectivity options such as CAN and USB, this microcontroller offers unmatched performance and versatility. Trust in Texas Instruments' reputation for quality and innovation, and elevate your projects to new heights with the LM3S5632-IQR50-A0.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides good durability and reliability for the microcontroller, making it suitable for various applications.

Integrated Cache: YES

The integrated cache helps improve the overall performance of the microcontroller by storing frequently accessed data and instructions, reducing access times and enhancing efficiency.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage of 3.6V allows for flexibility in power supply options while ensuring safe operation of the microcontroller.

CPU Family: CORTEX-M3

Being part of the CORTEX-M3 CPU family indicates that the microcontroller is designed for efficient and low-power processing, making it suitable for battery-powered or energy-efficient applications.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency of 50 MHz allows for fast processing speeds and efficient operation, making this microcontroller suitable for applications that require high-speed performance.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to easily interface with analog sensors and convert analog signals to digital data, expanding its usability in sensor-based applications.

Connectivity: CAN, I2C(2), SSI, UART(2), USB

The multiple connectivity options such as CAN, I2C, UART, and USB enable easy integration with various communication protocols and devices, making this microcontroller versatile for a wide range of applications.

ROM Programmability: FLASH

The use of FLASH memory for ROM programmability allows for easy and quick reprogramming of the microcontroller's firmware, enabling flexibility in updating or customizing the device's functionality.

Technical Specifications

Microcontrollers LM3S5632-IQR50-A0 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

7

No. of Terminals:

64

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), SSI, UART(2), USB

Peripherals:

DMA, TIMER(3), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

LM3S5632-IQR50-A0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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