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LM3S3W26-IQR50-C5

Texas Instruments

LM3S3W26-IQR50-C5 by Texas Instruments

LM3S3W26-IQR50-C5 by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 16.384 MHz. It features 8192 bytes of RAM, FLASH ROM programmability, and ADC/DMA channels. Ideal for industrial applications requiring a high-performance Cortex-M3 CPU in a compact square package with low profile and fine pitch design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,294 parts In-Stock

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Digiode

USA . 2,923 parts In-Stock

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2,923

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Distributors (Availability)

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AZTECH Wire

Italy . 447 parts In-Stock

1+ parts

$15.502

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447

$15.502

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One Stop Electronics

USA . 441 parts In-Stock

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$21.000

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441

$21.000

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Parana Technologies

USA . 1,250 parts In-Stock

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$45.049

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$45.049

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DigiPath Technology Company

USA . 100 parts In-Stock

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$49.605

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100

$49.605

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ChromeModa Solutions

Germany . 4,665 parts In-Stock

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$50.617

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$41.506

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4,665

$50.617

$41.506

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IDEA Electronic Components Group

UK . 1,373 parts In-Stock

1+ parts

$50.617

100+ parts

$48.086

1k+ parts

$45.555

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1,373

$50.617

$48.086

$45.555

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Corphita

USA . 3,620 parts In-Stock

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Lixinc

USA . 1,537 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,200 parts In-Stock

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Kepictronics

USA . 800 parts In-Stock

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800

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Microchip USA

USA . 326 parts In-Stock

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Overview

Unlock limitless potential with the Texas Instruments LM3S3W26-IQR50-C5 microcontroller. Crafted by a renowned manufacturer, this device boasts top-notch quality and reliability. Ideal for a wide range of applications, this microcontroller offers unparalleled value to customers seeking seamless performance, efficiency, and innovation. Discover the power of cutting-edge technology with the LM3S3W26-IQR50-C5 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environments and conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration of the microcontroller onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.365 V

The low maximum supply voltage ensures power efficiency and helps prevent damage to the microcontroller from voltage spikes.

Package Shape: SQUARE

The square package shape makes the microcontroller easy to handle and mount onto circuit boards with uniform dimensions.

Bit Size: 32

A 32-bit architecture allows for high processing capabilities and efficient handling of complex tasks and calculations.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages provides flexibility in system design and compatibility with different components.

No. of Terminals: 64

With 64 terminals, the microcontroller offers ample connectivity options for peripherals and external devices, enhancing its functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style allows for efficient board layout, compact design, and high-density integration of components.

Minimum Supply Voltage: 1.235 V

The low minimum supply voltage ensures stable operation and power efficiency, enabling the microcontroller to function in a wide voltage range.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance in harsh environmental conditions or applications that generate heat.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers high performance, low power consumption, and a rich set of features optimized for embedded applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microcontroller to operate reliably in cold environments or industrial applications with varying temperature conditions.

Terminal Finish: MATTE TIN

Matte Tin terminal finish provides excellent solderability, corrosion resistance, and a flat surface for reliable electrical connections.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with analog sensors and signals, expanding its range of applications.

DMA Channels: YES

DMA channels help offload data transfer tasks from the CPU, improving system efficiency, reducing latency, and supporting high-speed data processing.

Terminal Position: QUAD

Quad terminal position allows for secure and stable mounting of the microcontroller on the PCB, ensuring reliable connections and mechanical strength.

ROM Words: 32768

With 32768 ROM words, the microcontroller offers sufficient non-volatile memory for storing program code, configuration data, and firmware updates.

Maximum Seated Height: 1.6 mm

The low maximum seated height enables compact and slim device designs, facilitating space-saving integration of the microcontroller in tight enclosures.

Width: 10 mm

The width of 10mm provides a compact form factor for the microcontroller, making it suitable for applications with limited space constraints.

Maximum Clock Frequency: 16.384 MHz

The high maximum clock frequency allows for fast and efficient execution of instructions, supporting real-time processing and high-speed data handling.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures reliable soldering and thermal performance during assembly processes, preventing damage to the microcontroller.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for lead-free and RoHS-compliant soldering processes, ensuring environmental sustainability.

Length: 10 mm

The length of 10mm contributes to the compact size of the microcontroller, enabling efficient board layout and integration in small electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation and performance in demanding industrial environments with wide temperature variations.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product combines computing capabilities with integrated peripherals to provide a complete and versatile solution for embedded systems.

RAM Bytes: 8192

With 8192 bytes of RAM, the microcontroller offers sufficient volatile memory for data storage, variable manipulation, and temporary processing needs.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and reliable operation, making the microcontroller suitable for battery-powered and low-power applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates automated assembly processes, ensures strong mechanical connections, and offers good thermal performance during operation.

Nominal Supply Voltage: 1.3 V

The nominal supply voltage of 1.3V ensures stable and consistent power delivery to the microcontroller, supporting reliable and efficient operation.

PWM Channels: YES

The presence of PWM channels enables the microcontroller to generate precise analog output signals, control motor speeds, and interface with various electronic devices.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible software updates, configuration changes, and firmware enhancements without requiring external programming devices.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch enables high-density mounting of the microcontroller on PCBs, supporting compact designs and efficient use of available board space.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the microcontroller has moderate moisture sensitivity, requiring proper handling and storage to prevent moisture-related damage during assembly and operation.

Speed: 50 rpm

This 50 rpm speed parameter is not relevant to the microcontroller specifications and seems to be unrelated to its functionality in electronic systems.

No. of I/O Lines: 33

With 33 I/O lines, the microcontroller provides sufficient interface options for connecting to external devices, sensors, and peripherals, enabling versatile system integration.

Technical Specifications

Microcontrollers LM3S3W26-IQR50-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S3W26-IQR50-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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