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LM3S3826-IQR50-C3

Texas Instruments

LM3S3826-IQR50-C3 by Texas Instruments

LM3S3826-IQR50-C3 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring high-speed processing and control. With features like ADC and PWM channels, it offers versatile functionality in compact FLATPACK package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,219 parts In-Stock

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Vyrian

USA . 2,022 parts In-Stock

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2,022

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Distributors (Availability)

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AZTECH Wire

Italy . 368 parts In-Stock

1+ parts

$6.194

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368

$6.194

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One Stop Electronics

USA . 1,639 parts In-Stock

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$12.000

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Parana Technologies

USA . 1,453 parts In-Stock

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$73.448

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$73.448

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DigiPath Technology Company

USA . 1,476 parts In-Stock

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$80.875

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1,476

$80.875

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IDEA Electronic Components Group

UK . 598 parts In-Stock

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$82.526

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$78.400

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$74.273

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598

$82.526

$78.400

$74.273

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ChromeModa Solutions

Germany . 227 parts In-Stock

1+ parts

$82.526

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$67.671

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227

$82.526

$67.671

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Corphita

USA . 4,057 parts In-Stock

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Kepictronics

USA . 388 parts In-Stock

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Microchip USA

USA . 331 parts In-Stock

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Overview

Unlock the full potential of your electronic projects with the LM3S3826-IQR50-C3 microcontroller by Texas Instruments. Designed with precision and reliability in mind, this versatile device offers a wide range of applications in various industries. From automation to IoT solutions, this microcontroller provides unmatched performance and efficiency. With its advanced features and high-quality construction, Texas Instruments delivers a product that is guaranteed to exceed your expectations. Upgrade your projects today with the LM3S3826-IQR50-C3 and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and space.

Maximum Supply Voltage: 3.6 V

Provides flexibility and compatibility with a wide range of power sources.

Package Shape: SQUARE

Helps in easy placement and arrangement on the PCB, optimizing the use of available space.

Bit Size: 32

Offers high processing capabilities and performance for complex tasks and calculations.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options for versatile usage and design flexibility.

No. of Terminals: 64

Provides numerous connection points for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK

Facilitates easy assembly and soldering onto the PCB, ensuring a secure and stable connection.

Minimum Operating Temperature: -40 °C

Can operate efficiently in low-temperature environments, suitable for a wide range of applications.

ADC Channels: YES

Allows for analog-to-digital conversion, making it compatible with sensors and other analog devices.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer and processing, enhancing overall system performance.

ROM Words: 262144

Large ROM capacity for storing program instructions and data, suitable for complex applications.

Maximum Clock Frequency: 16 MHz

Provides high processing speed and performance, enabling quick execution of tasks and operations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing energy efficiency and reliability.

Nominal Supply Voltage: 3.3 V

Stable and standard supply voltage for reliable operation and compatibility with various power sources.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of connected devices, suitable for applications requiring accurate output control.

Technical Specifications

Microcontrollers LM3S3826-IQR50-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S3826-IQR50-C3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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