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LM3S3654-IQR50-C5T

Texas Instruments

LM3S3654-IQR50-C5T by Texas Instruments

Texas Instruments LM3S3654-IQR50-C5T is a 32-bit microcontroller with Cortex-M3 CPU, 131072 ROM words, and 49152 RAM bytes. It operates at up to 16.348 MHz clock frequency and has 33 I/O lines for industrial applications requiring high-speed processing and PWM functionality.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,013 parts In-Stock

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Vyrian

USA . 2,042 parts In-Stock

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2,042

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Distributors (Availability)

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AZTECH Wire

Italy . 729 parts In-Stock

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$11.572

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729

$11.572

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One Stop Electronics

USA . 768 parts In-Stock

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$20.000

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768

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Parana Technologies

USA . 1,067 parts In-Stock

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$24.689

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$25.356

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$24.689

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ChromeModa Solutions

Germany . 6,345 parts In-Stock

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$27.741

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$22.748

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6,345

$27.741

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IDEA Electronic Components Group

UK . 47 parts In-Stock

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$27.741

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$26.354

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$24.967

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47

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$24.967

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Corphita

USA . 2,975 parts In-Stock

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2,975

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DigiPath Technology Company

USA . 1,942 parts In-Stock

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$25.011

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Microchip USA

USA . 362 parts In-Stock

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Overview

Experience the power and precision of Texas Instruments with the LM3S3654-IQR50-C5T microcontroller. Perfect for a wide range of applications, this Cortex-M3 CPU family member offers unparalleled performance and reliability. With 32-bit capabilities, 64 terminals, and advanced features like ADC and PWM channels, this microcontroller is a versatile solution for your project needs. Trust in Texas Instruments' reputation for excellence and innovation to deliver exceptional quality and value in every product. Elevate your designs with the LM3S3654-IQR50-C5T and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Maximum Supply Voltage: 1.365 V

Provides stable operation within a safe voltage range, ensuring reliability and longevity of the product.

Bit Size: 32

A higher bit size allows for more complex calculations and processing capabilities, making the microcontroller versatile for different tasks.

Power Supplies (V): 1.3,3.3

Supports multiple power supply options, offering flexibility in system design and integration.

No. of Terminals: 64

Plenty of terminals allow for connection to various peripherals and components, expanding the capabilities of the microcontroller.

Maximum Operating Temperature: 85 °C

Withstands high temperatures, suitable for industrial applications and harsh environments.

CPU Family: CORTEX-M3

A reliable and widely used CPU family, ensuring compatibility with existing software and hardware ecosystems.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, essential for sensors and real-world interfacing.

DMA Channels: YES

Support for DMA channels allows for efficient data transfer without CPU intervention, optimizing system performance.

Technical Specifications

Microcontrollers LM3S3654-IQR50-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.348 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

49152

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

129 mA

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S3654-IQR50-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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