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LM3S315-IGZ25-C2

Texas Instruments

LM3S315-IGZ25-C2 by Texas Instruments

LM3S315-IGZ25-C2 by Texas Instruments is a 32-bit microcontroller with 48 terminals, operating at a max frequency of 25 MHz. It features 4096 bytes of RAM, 16384 ROM words, and PWM channels for industrial applications requiring high-speed processing within the temperature range of -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,628 parts In-Stock

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Digiode

USA . 646 parts In-Stock

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646

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One Stop Electronics

USA . 1,351 parts In-Stock

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$2.000

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$2.000

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AZTECH Wire

Italy . 212 parts In-Stock

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$17.066

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Parana Technologies

USA . 1,259 parts In-Stock

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$53.643

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DigiPath Technology Company

USA . 297 parts In-Stock

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$59.068

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$54.342

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297

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ChromeModa Solutions

Germany . 2,486 parts In-Stock

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$60.273

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$49.424

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IDEA Electronic Components Group

UK . 2,338 parts In-Stock

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$60.273

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$57.259

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$54.246

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2,338

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QUARKTWIN TECHNOLOGY LTD

USA . 23,502 parts In-Stock

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Microchip USA

USA . 4,677 parts In-Stock

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Corphita

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Overview

Unleash the power of innovation with the LM3S315-IGZ25-C2 by Texas Instruments. As a leader in the microcontroller industry, Texas Instruments brings you a high-quality product that is perfect for a wide range of applications. With its advanced technology and reliable performance, this microcontroller offers unmatched value to our customers. Experience the benefits of seamless integration, efficient operation, and superior functionality. Elevate your projects with the LM3S315-IGZ25-C2 and discover a world of possibilities.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more compact assembly of the microcontroller onto a circuit board, making it suitable for production in high volumes.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of input voltages, providing flexibility in different power supply scenarios.

Package Shape: SQUARE

The square package shape helps in efficient use of PCB space and allows for easier placement of the microcontroller on the board.

Bit Size: 32

With a 32-bit architecture, this microcontroller can process larger chunks of data at a time, leading to faster and more efficient performance.

Power Supplies (V): 3.3

Operating at a standard 3.3V power supply, this microcontroller is compatible with various other components and systems using the same voltage, simplifying integration.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for interfacing with external devices and peripherals, making it versatile for a wide range of applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style options offer flexibility in thermal management and space constraints, allowing for optimal performance and integration in different environments.

Minimum Supply Voltage: 3 V

With a low minimum supply voltage, this microcontroller can still operate reliably even in scenarios where the power supply may slightly drop below the standard voltage.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this microcontroller suitable for industrial applications where elevated temperatures are common, ensuring robust performance in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this microcontroller to function in extreme cold conditions, making it suitable for outdoor or automotive applications where temperature fluctuations occur.

ADC Channels: YES

Having ADC channels enables the microcontroller to convert analog signals to digital data, expanding its capability to interface with sensors and other analog devices.

Terminal Position: QUAD

The quad terminal position helps in efficient routing of signals on the PCB and simplifies the design layout, making it easier for PCB designers to work with this microcontroller.

ROM Words: 16384

With a large ROM size of 16384 words, this microcontroller can store a significant amount of program code and data, enabling complex applications to be implemented efficiently.

Maximum Seated Height: 1 mm

With a low seated height, this microcontroller can be designed into slim and compact devices without adding bulk, ideal for space-constrained applications.

Width: 6.875 mm

The narrow width of the microcontroller allows for compact placement on the PCB, optimizing space utilization and enabling sleek product designs.

Maximum Clock Frequency: 25 MHz

Operating at a high maximum clock frequency of 25 MHz, this microcontroller can execute instructions swiftly, leading to responsive and high-performance operation.

Length: 6.875 mm

The small length dimension makes this microcontroller suitable for space-sensitive applications where size constraints are a concern.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this microcontroller can withstand harsh environmental conditions typically found in industrial settings, ensuring reliability and longevity.

Peripheral IC Type: MICROCONTROLLER, RISC

Based on a RISC architecture, this microcontroller offers efficient and streamlined processing of instructions, leading to high performance and low power consumption.

RAM Bytes: 4096

With 4096 bytes of RAM, this microcontroller can store and access data quickly, enhancing its ability to handle real-time processing tasks effectively.

Technology: CMOS

Utilizing CMOS technology, this microcontroller offers low power consumption, high noise immunity, and reliable operation, making it ideal for battery-powered or noise-sensitive applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering process during assembly, ensuring better reliability and connectivity of the microcontroller on the PCB.

Maximum Supply Current: 65 mA

Operating with a maximum supply current of 65 mA, this microcontroller consumes minimal power, making it energy-efficient and suitable for portable or battery-operated devices.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3V, this microcontroller offers stable and consistent performance under standard operating conditions, ensuring reliable operation in various applications.

PWM Channels: YES

Featuring PWM channels, this microcontroller can generate precise analog output signals, allowing for control of motors, LEDs, and other devices that require variable voltage levels.

ROM Programmability: FLASH

Using flash memory for ROM, this microcontroller offers fast and easy programmability, allowing for quick updates or modifications to the firmware without the need for external programming equipment.

Terminal Pitch: 0.5 mm

With a fine terminal pitch of 0.5mm, this microcontroller offers high-density packaging options, accommodating more terminals in a smaller footprint for compact and feature-rich designs.

Speed: 25 rpm

Operating at a speed of 25 rpm, this microcontroller can efficiently execute tasks and respond to input signals in real-time, ensuring smooth and responsive operation in dynamic applications.

No. of I/O Lines: 32

Featuring 32 I/O lines, this microcontroller offers ample connectivity for interfacing with external devices, sensors, and peripherals, making it suitable for diverse applications requiring multiple input/output configurations.

Technical Specifications

Microcontrollers LM3S315-IGZ25-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

32

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S315-IGZ25-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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