Loading...

LM3S310-IQN25-C2

Texas Instruments

LM3S310-IQN25-C2 by Texas Instruments

Texas Instruments LM3S310-IQN25-C2 is a 32-bit microcontroller with Cortex-M3 CPU. It features 4096 bytes of RAM, 16384 ROM words, and operates at a max clock frequency of 0.032 MHz. Ideal for industrial applications requiring low power consumption and connectivity through SSI and UART interfaces.

Median Price

$4.250

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,889 parts In-Stock

1+ parts

$4.250

100+ parts

$4.170

1k+ parts

$4.080

10k+ parts

-

1,889

$4.250

$4.170

$4.080

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,896 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,896

-

-

-

-

Digiode

USA . 2,219 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,219

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 820 parts In-Stock

1+ parts

$16.614

100+ parts

-

1k+ parts

-

10k+ parts

-

820

$16.614

-

-

-

Microchip USA

USA . 255 parts In-Stock

1+ parts

$23.590

100+ parts

$23.420

1k+ parts

$23.420

10k+ parts

$23.250

255

$23.590

$23.420

$23.420

$23.250

One Stop Electronics

USA . 333 parts In-Stock

1+ parts

$25.000

100+ parts

-

1k+ parts

-

10k+ parts

-

333

$25.000

-

-

-

Parana Technologies

USA . 1,840 parts In-Stock

1+ parts

$59.165

100+ parts

-

1k+ parts

-

10k+ parts

-

1,840

$59.165

-

-

-

DigiPath Technology Company

USA . 356 parts In-Stock

1+ parts

$65.147

100+ parts

-

1k+ parts

-

10k+ parts

-

356

$65.147

-

-

-

ChromeModa Solutions

Germany . 5,400 parts In-Stock

1+ parts

$66.477

100+ parts

$54.511

1k+ parts

-

10k+ parts

-

5,400

$66.477

$54.511

-

-

IDEA Electronic Components Group

UK . 2,035 parts In-Stock

1+ parts

$66.477

100+ parts

$63.153

1k+ parts

$59.829

10k+ parts

-

2,035

$66.477

$63.153

$59.829

-

Glotronic Ltd.

UK . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,000

-

-

-

-

Corphita

USA . 237 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

237

-

-

-

-

Overview

Unlock the potential of your electronics projects with the LM3S310-IQN25-C2 microcontroller by Texas Instruments. Renowned for its quality and reliability, Texas Instruments offers cutting-edge technology in the form of this versatile microcontroller. Ideal for a wide range of applications, this microcontroller boasts integrated cache, low power mode, and a variety of peripherals including PWM and timers. Whether you're a hobbyist or a professional, the LM3S310-IQN25-C2 provides value, performance, and efficiency that will take your projects to the next level. Experience the benefits of Texas Instruments' expertise with this top-of-the-line microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material choice makes the microcontroller lightweight and durable, which is ideal for portable or rugged applications.

Integrated Cache: YES

Having an integrated cache improves the overall performance of the microcontroller by reducing the access time to frequently used data.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, making it suitable for a wide range of applications.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 family ensures compatibility with a well-established and widely used architecture, making it easier for developers to work with.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions without compromising performance.

ROM Programmability: FLASH

The ability to programm the ROM using FLASH technology allows for easy and fast updates or changes to the firmware, enhancing the flexibility of the microcontroller.

Technical Specifications

Microcontrollers LM3S310-IQN25-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

36

No. of Serial I/Os:

3

No. of Terminals:

48

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SSI, UART(2)

Peripherals:

PWM(6), TIMER(3), WDT

Trade Compliance

LM3S310-IQN25-C2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20