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LM3S308-EQN25-C2

Texas Instruments

LM3S308-EQN25-C2 by Texas Instruments

Texas Instruments LM3S308-EQN25-C2 microcontroller features 32-bit architecture, 3.3V power supply, and 25MHz clock frequency. Ideal for industrial applications requiring a compact design with 48 terminals, FLASH ROM programmability, and 4096 bytes of RAM.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,460 parts In-Stock

1+ parts

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6,460

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Digiode

USA . 1,735 parts In-Stock

1+ parts

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1k+ parts

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1,735

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Distributors (Availability)

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One Stop Electronics

USA . 748 parts In-Stock

1+ parts

$6.000

100+ parts

-

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748

$6.000

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Microchip USA

USA . 2,128 parts In-Stock

1+ parts

$14.170

100+ parts

$13.970

1k+ parts

$13.870

10k+ parts

$13.770

2,128

$14.170

$13.970

$13.870

$13.770

AZTECH Wire

Italy . 292 parts In-Stock

1+ parts

$14.348

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292

$14.348

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Parana Technologies

USA . 1,969 parts In-Stock

1+ parts

$51.810

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1,969

$51.810

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DigiPath Technology Company

USA . 281 parts In-Stock

1+ parts

$57.050

100+ parts

$52.486

1k+ parts

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10k+ parts

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281

$57.050

$52.486

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ChromeModa Solutions

Germany . 5,420 parts In-Stock

1+ parts

$58.214

100+ parts

$47.735

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5,420

$58.214

$47.735

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IDEA Electronic Components Group

UK . 592 parts In-Stock

1+ parts

$58.214

100+ parts

$55.303

1k+ parts

$52.393

10k+ parts

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592

$58.214

$55.303

$52.393

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Component Stockers USA

USA . 695 parts In-Stock

1+ parts

$99.990

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695

$99.990

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Corphita

USA . 3,695 parts In-Stock

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3,695

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Overview

Experience the next level of performance with the LM3S308-EQN25-C2 microcontroller by Texas Instruments. Crafted with precision and expertise, this powerful device offers unparalleled reliability, efficiency, and versatility. Ideal for a wide range of applications, this microcontroller is designed to enhance your projects with its cutting-edge technology and advanced features. Unlock endless possibilities and elevate your creations with the LM3S308-EQN25-C2, where innovation meets quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 3.6 V

A higher supply voltage allows for flexibility in different power supply configurations.

Package Shape: SQUARE

Square packages are easy to handle and integrate into PCB designs efficiently.

Bit Size: 32

A 32-bit microcontroller provides higher processing power and performance compared to lower bit sizes.

Power Supplies (V): 3.3

A standard operating voltage of 3.3V ensures compatibility with a wide range of applications.

No. of Terminals: 48

Having 48 terminals allows for connectivity to various external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers space-saving benefits and efficient routing of connections on the PCB.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3V ensures stable operation under various conditions.

Maximum Operating Temperature: 105 °C

With a high operating temperature range, this microcontroller is suitable for industrial environments with demanding conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this microcontroller suitable for a wide range of applications.

Terminal Finish: TIN

A TIN finish provides good conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

The presence of ADC channels allows for analog signal processing and conversion, expanding the microcontroller's capabilities.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and enhances signal integrity.

ROM Words: 16384

A ROM size of 16384 words offers ample memory space for program storage and data handling.

Maximum Seated Height: 1.6 mm

A low seated height makes this microcontroller suitable for compact electronic designs with limited space.

Width: 7 mm

The compact width of 7mm enables easy integration into tight PCB layouts.

Maximum Clock Frequency: 25 MHz

A high clock frequency of 25MHz allows for fast processing of instructions and data.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, this microcontroller is easy to solder and assemble.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures reliable solder joints during the assembly process.

Length: 7 mm

The compact length of 7mm saves PCB space and allows for efficient layout designs.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges makes this microcontroller suitable for harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

A RISC-based microcontroller design offers high performance, energy efficiency, and faster execution of instructions.

RAM Bytes: 4096

With 4096 bytes of RAM, this microcontroller can efficiently handle data processing and storage requirements.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form enables easy soldering and reliable connections during PCB assembly.

Maximum Supply Current: 65 mA

A maximum supply current of 65mA ensures efficient power consumption and stable operation of the microcontroller.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3V, this microcontroller can operate within standard voltage ranges.

PWM Channels: YES

The presence of PWM channels allows for precise control of motor speeds, LED brightness, and other analog output applications.

ROM Programmability: FLASH

Flash programmability enables easy updating and reprogramming of the microcontroller firmware without the need for specialized programming equipment.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5mm provides high-density packaging and allows for efficient routing of signals on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that this microcontroller can withstand intermediate exposure to moisture during storage and assembly processes.

Speed: 25 rpm

With a speed of 25rpm, this microcontroller can process data and execute instructions quickly, suitable for real-time applications.

No. of I/O Lines: 28

Having 28 I/O lines allows for versatile connectivity to external devices, sensors, and interfaces, expanding the functionality of the microcontroller.

Technical Specifications

Microcontrollers LM3S308-EQN25-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S308-EQN25-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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