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LM3S301-EQN20-C2

Texas Instruments

LM3S301-EQN20-C2 by Texas Instruments

Texas Instruments LM3S301-EQN20-C2 is a 32-bit microcontroller with 16384 ROM words and 2048 RAM bytes. Operating at up to 20 MHz, it features 33 I/O lines and PWM channels for industrial applications. With a package size of 7x7 mm, it has a low profile design suitable for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,744 parts In-Stock

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9,744

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Digiode

USA . 134 parts In-Stock

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134

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,340 parts In-Stock

1+ parts

$14.650

100+ parts

$14.440

1k+ parts

$14.340

10k+ parts

$14.240

1,340

$14.650

$14.440

$14.340

$14.240

AZTECH Wire

Italy . 548 parts In-Stock

1+ parts

$15.979

100+ parts

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548

$15.979

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One Stop Electronics

USA . 1,643 parts In-Stock

1+ parts

$20.000

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1,643

$20.000

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Parana Technologies

USA . 2,054 parts In-Stock

1+ parts

$54.009

100+ parts

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2,054

$54.009

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ChromeModa Solutions

Germany . 4,852 parts In-Stock

1+ parts

$60.684

100+ parts

$49.761

1k+ parts

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4,852

$60.684

$49.761

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IDEA Electronic Components Group

UK . 280 parts In-Stock

1+ parts

$60.684

100+ parts

$57.650

1k+ parts

$54.616

10k+ parts

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280

$60.684

$57.650

$54.616

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Corphita

USA . 4,554 parts In-Stock

1+ parts

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4,554

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DigiPath Technology Company

USA . 2,058 parts In-Stock

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100+ parts

$54.713

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2,058

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$54.713

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Overview

Unlock endless possibilities with the Texas Instruments LM3S301-EQN20-C2 microcontroller. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in every product they produce. This versatile microcontroller is perfect for a wide range of applications, offering unmatched value, benefits, and advantages to customers. Experience seamless performance and innovative solutions with the LM3S301-EQN20-C2, tailored to meet your unique needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for embedded applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs.

Maximum Supply Voltage: 3.6 V

Operates at a higher voltage range, providing flexibility in power supply options.

Package Shape: SQUARE

Square shape helps in efficient space utilization on the PCB.

Bit Size: 32

32-bit architecture enables faster processing and performance.

Power Supplies (V): 3.3

Stable power supply at 3.3V for reliable operation.

No. of Terminals: 48

Sufficient number of terminals for connecting to various peripherals and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact package style for space-constrained designs with precise placement of terminals.

Minimum Supply Voltage: 3 V

Operates at a low minimum voltage, conserving power.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Operates effectively in low-temperature conditions as well.

Terminal Finish: TIN

Tin finish provides good conductivity and corrosion resistance.

ADC Channels: YES

Built-in ADC channels for analog signal processing.

Terminal Position: QUAD

Quad terminal position for stable and secure connections.

ROM Words: 16384

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for compact and slim devices.

Width: 7 mm

Narrow width for space-efficient PCB layout.

Maximum Clock Frequency: 20 MHz

High clock frequency for fast processing and real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time for reflow soldering during assembly.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly process.

Length: 7 mm

Compact length for efficient use of PCB space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient processing of instructions.

RAM Bytes: 2048

Adequate RAM capacity for data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high speed operation.

Terminal Form: GULL WING

Gull wing terminal form for reliable solder connections.

Maximum Supply Current: 50 mA

Low supply current requirement for power-efficient operation.

Nominal Supply Voltage: 3.3 V

Stable nominal voltage supply for consistent performance.

PWM Channels: YES

Supports PWM channels for precise control of output signals.

ROM Programmability: FLASH

Flash ROM programmability for easy and quick updates to firmware.

Terminal Pitch: 0.5 mm

Fine pitch for high-density mounting on PCBs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 for handling and storage in standard factory conditions.

Speed: 20 rpm

Clock speed of 20 rpm for efficient processing of instructions.

No. of I/O Lines: 33

Sufficient I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S301-EQN20-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S301-EQN20-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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