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LM3S2D93-IQC80-A2T

Texas Instruments

LM3S2D93-IQC80-A2T by Texas Instruments

Texas Instruments LM3S2D93-IQC80-A2T is a 32-bit Cortex-M3 microcontroller with 524288 ROM words and 98304 RAM bytes. Operating at up to 16.384 MHz, it features ADC and DMA channels for industrial applications requiring high-speed processing and low power consumption. With a compact square package style, it is suitable for space-constrained designs in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,623 parts In-Stock

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Digiode

USA . 1,692 parts In-Stock

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1,692

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Distributors (Availability)

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AZTECH Wire

Italy . 298 parts In-Stock

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$11.714

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298

$11.714

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One Stop Electronics

USA . 873 parts In-Stock

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$35.000

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873

$35.000

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Parana Technologies

USA . 2,364 parts In-Stock

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$36.528

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$3,392.204

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$32.875

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2,364

$36.528

$3,392.204

$32.875

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DigiPath Technology Company

USA . 403 parts In-Stock

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$40.222

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$37.004

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403

$40.222

$37.004

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IDEA Electronic Components Group

UK . 1,480 parts In-Stock

1+ parts

$41.043

100+ parts

$38.991

1k+ parts

$36.939

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1,480

$41.043

$38.991

$36.939

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ChromeModa Solutions

Germany . 1,296 parts In-Stock

1+ parts

$41.043

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$33.655

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1,296

$41.043

$33.655

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Corphita

USA . 312 parts In-Stock

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312

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Microchip USA

USA . 101 parts In-Stock

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Overview

Get ready to experience top-notch performance with the LM3S2D93-IQC80-A2T microcontroller from Texas Instruments. Known for their high-quality products, Texas Instruments delivers cutting-edge technology that is perfect for a wide range of applications. Whether you're in the industrial or consumer electronics industry, this microcontroller offers unmatched value and benefits. With features like 32-bit processing power, advanced ADC and DMA channels, and a fast clock frequency of up to 16.384 MHz, you can trust this device to meet all your needs efficiently and reliably. Upgrade your project today with the LM3S2D93-IQC80-A2T and see the difference for yourself!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring long-term reliability.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, accommodating a wide range of voltage inputs.

Bit Size: 32

Offers a higher processing capability, allowing for more complex operations and calculations.

CPU Family: CORTEX-M3

The Cortex-M3 architecture is known for its efficiency and performance, making this microcontroller suitable for various applications.

ROM Words: 524288

With a large ROM capacity, this microcontroller can store a significant amount of program data and instructions.

RAM Bytes: 98304

Having a substantial amount of RAM allows for efficient data storage and processing.

Maximum Clock Frequency: 16.384 MHz

The high clock frequency enables faster data processing and improves overall system performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers simplified instructions and efficient processing, making it a good choice for embedded systems.

Technical Specifications

Microcontrollers LM3S2D93-IQC80-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

135 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2D93-IQC80-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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