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LM3S2950-IQC50-A2

Texas Instruments

LM3S2950-IQC50-A2 by Texas Instruments

Texas Instruments LM3S2950-IQC50-A2 microcontroller features 32-bit Cortex-M3 CPU, 65536 bytes RAM, and 262144 ROM words. Ideal for industrial applications with CAN, I2C, UART(3) connectivity and peripherals like PWM(6) and TIMER(4). Operates at up to 50 MHz clock frequency in a compact square package.

Median Price

$25.110

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8 parts In-Stock

1+ parts

-

100+ parts

$25.110

1k+ parts

$22.470

10k+ parts

$21.140

8

-

$25.110

$22.470

$21.140

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,044 parts In-Stock

1+ parts

$23.047

100+ parts

-

1k+ parts

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1,044

$23.047

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Vyrian

USA . 6,902 parts In-Stock

1+ parts

-

100+ parts

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6,902

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TME

Poland . 90 parts In-Stock

1+ parts

-

100+ parts

$32.976

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90

-

$32.976

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 953 parts In-Stock

1+ parts

$8.380

100+ parts

-

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953

$8.380

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Corphita

USA . 297 parts In-Stock

1+ parts

$21.834

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297

$21.834

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Parana Technologies

USA . 2,057 parts In-Stock

1+ parts

$54.939

100+ parts

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2,057

$54.939

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DigiPath Technology Company

USA . 1,021 parts In-Stock

1+ parts

$60.494

100+ parts

-

1k+ parts

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1,021

$60.494

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ChromeModa Solutions

Germany . 1,529 parts In-Stock

1+ parts

$61.729

100+ parts

$50.618

1k+ parts

-

10k+ parts

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1,529

$61.729

$50.618

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IDEA Electronic Components Group

UK . 374 parts In-Stock

1+ parts

$61.729

100+ parts

$58.643

1k+ parts

$55.556

10k+ parts

-

374

$61.729

$58.643

$55.556

-

Microchip USA

USA . 311 parts In-Stock

1+ parts

$68.140

100+ parts

$67.550

1k+ parts

$67.550

10k+ parts

$66.960

311

$68.140

$67.550

$67.550

$66.960

Kepictronics

USA . 3,500 parts In-Stock

1+ parts

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100+ parts

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3,500

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Perfect Parts

USA . 67 parts In-Stock

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67

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Overview

Unlock the power of innovation with the LM3S2950-IQC50-A2 by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers top-quality products that exceed industry standards. This versatile microcontroller is perfect for a wide range of applications, offering unparalleled performance and reliability. Whether you're designing smart devices, industrial automation systems, or automotive electronics, this product provides exceptional value, efficiency, and flexibility. Trust Texas Instruments to elevate your projects to the next level with the LM3S2950-IQC50-A2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is commonly used for packaging microcontrollers as it offers good protection from external elements and is cost-effective.

Integrated Cache: YES

Integrated cache helps improve the overall performance of the microcontroller by reducing the access time to frequently used data and instructions.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, making the microcontroller suitable for mass production.

Maximum Supply Voltage: 2.75 V

2.75 V maximum supply voltage ensures compatibility with a wide range of power sources while providing sufficient voltage for proper operation.

On Chip Data RAM Width: 8

8-bit wide on-chip data RAM allows for efficient data handling and processing within the microcontroller.

Package Shape: SQUARE

Square package shape helps in easier placement on the PCB and offers a compact design for space-constrained applications.

Bit Size: 32

32-bit architecture allows for higher computational capabilities, making the microcontroller suitable for complex tasks and applications.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V, 3.3V) offers flexibility in designing power systems for the microcontroller.

No. of Terminals: 100

Having 100 terminals provides sufficient I/O options for connecting external devices and peripherals to the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package styles allow for easy integration onto the PCB while maximizing space efficiency.

Minimum Supply Voltage: 2.25 V

2.25 V minimum supply voltage ensures proper operation of the microcontroller even under low voltage conditions, improving reliability.

Maximum Operating Temperature: 85 °C

85°C maximum operating temperature makes the microcontroller suitable for industrial applications where high temperature environments are common.

CPU Family: CORTEX-M3

CORTEX-M3 CPU family offers efficient performance and low power consumption, making the microcontroller ideal for battery-powered devices.

Minimum Operating Temperature: -40 °C

-40°C minimum operating temperature ensures reliable operation even in extremely cold environments, expanding the range of use cases for the microcontroller.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability of the connections.

ADC Channels: YES

Presence of ADC channels allows the microcontroller to interface with analog sensors and signals, enabling a wide range of data acquisition applications.

Terminal Position: QUAD

Quad terminal position provides a stable and secure connection between the microcontroller and the PCB, minimizing the risk of connectivity issues.

ROM Words: 262144

262144 ROM words offer ample storage space for program instructions and data, allowing for the implementation of complex algorithms and applications.

Maximum Seated Height: 1.6 mm

1.6 mm maximum seated height ensures compatibility with standard PCB designs and allows for compact and slim device profiles.

Width: 14 mm

14 mm width offers a balance between compactness and ease of handling during PCB assembly, making the microcontroller versatile for various form factors.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the microcontroller during the manufacturing process, improving overall product quality.

Peripherals: PWM(6), QEI, TIMER(4), WDT

Multiple peripherals such as PWM, QEI, timers, and watchdog timer enhance the functionality and versatility of the microcontroller for diverse applications.

Maximum Clock Frequency: 50 MHz

50 MHz maximum clock frequency allows for high-speed processing and operation, making the microcontroller suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds at peak reflow temperature of 260°C ensures proper soldering and reliability during the PCB assembly process.

Length: 14 mm

14 mm length provides a balanced form factor for the microcontroller, enabling easy integration into various PCB layouts and designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environments with wide temperature fluctuations, making the microcontroller suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers efficient processing capabilities and low power consumption, making it suitable for embedded systems and IoT devices.

No. of Timers: 4

Having 4 timers enables precise timing and control functions within the microcontroller, facilitating a wide range of time-sensitive applications.

RAM Bytes: 65536

65536 bytes of RAM provide sufficient memory for data storage and manipulation, supporting complex algorithms and multitasking operations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the microcontroller in various applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections on the PCB, ensuring proper signal transmission and reducing the risk of signal interference.

Nominal Supply Voltage: 2.5 V

2.5 V nominal supply voltage ensures stable and efficient operation of the microcontroller while minimizing power consumption.

No. of Serial I/Os: 8

Having 8 serial I/O lines allows for versatile communication interfaces with external devices, expanding the connectivity options of the microcontroller.

PWM Channels: YES

Support for PWM channels enables precise control of analog signals, making the microcontroller suitable for applications such as motor control and power management.

Connectivity: CAN, I2C, SSI(2), UART(3)

Multiple connectivity options including CAN, I2C, SSI, and UART enhance the interoperability of the microcontroller with other devices and systems.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization, enabling the microcontroller to adapt to evolving application requirements.

Terminal Pitch: 0.5 mm

0.5 mm terminal pitch offers fine-pitched connections, enabling high-density integration on the PCB and reducing the overall footprint of the device.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and improves computational efficiency, making the microcontroller suitable for real-time signal processing.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, requiring standard handling precautions during the manufacturing and storage of the microcontroller.

Speed: 50 rpm

50 rpm speed rating ensures efficient processing and operation, making the microcontroller suitable for applications requiring moderate processing speeds.

Low Power Mode: YES

Low power mode capability allows the microcontroller to operate in power-efficient states, extending battery life and reducing overall power consumption.

On Chip Program ROM Width: 8

8-bit wide on-chip program ROM enables efficient storage and retrieval of program instructions, enhancing the overall performance of the microcontroller.

No. of I/O Lines: 60

Having 60 I/O lines offers versatile connectivity options for external devices and peripherals, making the microcontroller suitable for a wide range of applications.

Technical Specifications

Microcontrollers LM3S2950-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3 V IO SUPPLY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

60

No. of Serial I/Os:

8

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SSI(2), UART(3)

Peripherals:

PWM(6), QEI, TIMER(4), WDT

Trade Compliance

LM3S2950-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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