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LM3S2939-EQC50-A2

Texas Instruments

LM3S2939-EQC50-A2 by Texas Instruments

LM3S2939-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. Operating at a max clock frequency of 0.032 MHz, it offers 57 I/O lines for industrial applications requiring PWM channels and ADC channels.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,327 parts In-Stock

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Digiode

USA . 1,885 parts In-Stock

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1,885

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One Stop Electronics

USA . 488 parts In-Stock

1+ parts

$5.000

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488

$5.000

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AZTECH Wire

Italy . 241 parts In-Stock

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$9.106

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241

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Parana Technologies

USA . 1,082 parts In-Stock

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$18.180

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$18.320

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1,082

$18.180

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$18.320

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ChromeModa Solutions

Germany . 4,888 parts In-Stock

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$20.427

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$16.750

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4,888

$20.427

$16.750

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IDEA Electronic Components Group

UK . 1,243 parts In-Stock

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$20.427

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$19.406

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$18.384

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1,243

$20.427

$19.406

$18.384

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Corphita

USA . 2,372 parts In-Stock

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2,372

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DigiPath Technology Company

USA . 1,416 parts In-Stock

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$18.417

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Microchip USA

USA . 423 parts In-Stock

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Overview

Experience the innovation and reliability of Texas Instruments with the LM3S2939-EQC50-A2 microcontroller. Designed for industrial applications, this powerful 32-bit device offers 262144 ROM words and 65536 RAM bytes, providing exceptional performance and versatility. With its compact square package and wide temperature range, it is perfect for a variety of projects. Trust in Texas Instruments for quality engineering and cutting-edge technology that delivers value and efficiency to your designs. Elevate your creations with the LM3S2939-EQC50-A2 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/epoxy material provides good durability and reliability for the microcontroller.

Surface Mount: YES

Surface mount capability makes it easier to mount the microcontroller on circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 2.75 V

2.75V maximum supply voltage ensures safe operation of the microcontroller within specified voltage limits.

Package Shape: SQUARE

Square package shape allows for easy integration into compact electronic designs.

Bit Size: 32

32-bit architecture enables fast and efficient processing of data and instructions.

Power Supplies (V): 2.5, 3.3

Support for multiple power supply voltages allows flexibility in designing with different components and power requirements.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for interfacing with other devices and components.

Package Style (Meter): FLATPACK

Flatpack package style is easy to handle and mount on PCBs, offering a secure and stable assembly.

Minimum Supply Voltage: 2.25 V

2.25V minimum supply voltage ensures reliable operation even under low voltage conditions.

Maximum Operating Temperature: 105 °C

High maximum operating temperature of 105°C allows the microcontroller to withstand elevated temperatures in industrial settings.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures the microcontroller can function in a wide range of environmental conditions.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals.

Terminal Position: QUAD

Quad terminal position facilitates easy connectivity and soldering on the PCB.

ROM Words: 262144

262144 ROM words provide ample storage for program instructions and data.

Maximum Seated Height: 1.6 mm

Low seated height of 1.6mm allows for a slim and compact overall design.

Width: 14 mm

14mm width offers a compact form factor for tight PCB layout requirements.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 32MHz ensures rapid processing and execution of instructions.

Length: 14 mm

14mm length complements the width for a square-shaped package design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture microcontroller offers efficient performance and power consumption for embedded applications.

RAM Bytes: 65536

65536 bytes of RAM provide sufficient memory for data storage and processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering on PCBs and provides mechanical stability.

Nominal Supply Voltage: 2.5 V

2.5V nominal supply voltage ensures optimal performance and compatibility with other components.

PWM Channels: YES

Pulse width modulation channels enable the microcontroller to generate precise analog signals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to the program code.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5mm enables compact PCB layout and high-density integration.

Speed: 50 rpm

Operating speed of 50rpm ensures efficient processing of instructions and data.

No. of I/O Lines: 57

Having 57 I/O lines provides ample connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S2939-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

57

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2939-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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