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LM3S2739-EQC50-A2

Texas Instruments

LM3S2739-EQC50-A2 by Texas Instruments

LM3S2739-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring high-speed processing and multiple PWM channels. With a temperature range from -40 to 105 °C, it offers versatile performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,657 parts In-Stock

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3,657

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Digiode

USA . 1,723 parts In-Stock

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1,723

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Distributors (Availability)

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AZTECH Wire

Italy . 202 parts In-Stock

1+ parts

$8.344

100+ parts

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202

$8.344

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One Stop Electronics

USA . 422 parts In-Stock

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$9.000

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422

$9.000

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Parana Technologies

USA . 181 parts In-Stock

1+ parts

$45.985

100+ parts

$4,270.360

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$41.386

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181

$45.985

$4,270.360

$41.386

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DigiPath Technology Company

USA . 1,152 parts In-Stock

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$50.635

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1,152

$50.635

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ChromeModa Solutions

Germany . 936 parts In-Stock

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$51.668

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$42.368

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936

$51.668

$42.368

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IDEA Electronic Components Group

UK . 514 parts In-Stock

1+ parts

$51.668

100+ parts

$49.085

1k+ parts

$46.501

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514

$51.668

$49.085

$46.501

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Corphita

USA . 4,488 parts In-Stock

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Microchip USA

USA . 319 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S2739-EQC50-A2 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This microcontroller is perfect for a wide range of applications, offering customers unparalleled value and performance. Say goodbye to limitations and hello to endless possibilities with this versatile product. Upgrade your projects today with the LM3S2739-EQC50-A2 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material offers durability and protection for the microcontroller, ensuring longevity and reliability.

Surface Mount: YES

Surface mount capability simplifies the assembly process and allows for compact design in electronic devices.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a maximum supply voltage of 2.75V, making it suitable for low power applications.

Package Shape: SQUARE

Square package shape allows for easy placement and alignment on circuit boards, optimizing space usage.

Bit Size: 32

32-bit architecture provides high performance and processing capabilities for complex tasks and applications.

Power Supplies (V): 2.5,3.3

Supports multiple power supply voltages (2.5V and 3.3V), offering flexibility in various electronic systems.

No. of Terminals: 100

100 terminals enable seamless connectivity with external components and peripherals for enhanced functionality.

Package Style (Meter): FLATPACK

Flatpack package style facilitates easy integration and mounting on circuit boards, ensuring a secure connection.

Minimum Supply Voltage: 2.25 V

Operates reliably even at low minimum supply voltage of 2.25V, suitable for energy-efficient applications.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures up to 105°C, making it suitable for industrial environments with varying conditions.

Minimum Operating Temperature: -40 °C

Operates efficiently even in extreme cold temperatures down to -40°C, ensuring reliable performance in harsh environments.

Terminal Finish: TIN

TIN terminal finish provides excellent conductivity and corrosion resistance for long-lasting connection stability.

ADC Channels: YES

Built-in ADC channels allow for analog-to-digital conversion, essential for interfacing with sensors and other analog devices.

Terminal Position: QUAD

Quad terminal position enables efficient routing of signals and minimizes interference, enhancing overall performance.

ROM Words: 131072

Large ROM capacity of 131072 words allows for storing extensive program code and data, ideal for complex applications.

Maximum Seated Height: 1.6 mm

Low profile with a maximum seated height of 1.6mm saves space and enables slim designs in electronic systems.

Width: 14 mm

Compact width of 14mm allows for easy integration and placement in tight spaces, suitable for miniaturized devices.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 32MHz enables fast processing speeds and real-time operation in demanding applications.

Length: 14 mm

Short length of 14mm contributes to a compact form factor and efficient use of board space in electronic designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in rugged environments with extreme temperature variations.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture provides efficient instruction execution and high processing power for a wide range of applications.

RAM Bytes: 65536

Generous RAM capacity of 65536 bytes allows for efficient data storage and processing, essential for multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in operation.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections and mechanical strength, ensuring robust electrical connections in the circuit.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage of 2.5V ensures consistent and reliable operation, suitable for a wide range of electronic devices.

PWM Channels: YES

Support for PWM channels enables precise control of motor speeds, LED brightness, and other applications requiring variable pulse-width modulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating and reprogramming of firmware, facilitating firmware upgrades and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting and integration, maximizing connectivity options in space-constrained designs.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate sensitivity to moisture, requiring standard handling procedures to prevent damage and ensure product reliability.

Speed: 50 rpm

Operates at a speed of 50rpm, suitable for controlling rotational motion and precise positioning in motor control applications.

No. of I/O Lines: 56

56 I/O lines provide ample connectivity options for interfacing with external devices and peripherals, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers LM3S2739-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

56

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2739-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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