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LM3S2730-IBZ50-A2

Texas Instruments

LM3S2730-IBZ50-A2 by Texas Instruments

Texas Instruments LM3S2730-IBZ50-A2 is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. Operating at up to 0.032 MHz, it features 60 I/O lines and PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

$12.460

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$10.760

1k+ parts

$9.630

10k+ parts

$9.060

90

-

$10.760

$9.630

$9.060

DigiKey

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$14.160

1k+ parts

-

10k+ parts

-

90

-

$14.160

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,615 parts In-Stock

1+ parts

$11.362

100+ parts

-

1k+ parts

-

10k+ parts

-

4,615

$11.362

-

-

-

Vyrian

USA . 2,102 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,102

-

-

-

-

DigiKey Marketplace

USA . 90 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

90

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,091 parts In-Stock

1+ parts

$10.764

100+ parts

-

1k+ parts

-

10k+ parts

-

2,091

$10.764

-

-

-

Parana Technologies

USA . 1,098 parts In-Stock

1+ parts

$18.225

100+ parts

-

1k+ parts

$18.361

10k+ parts

-

1,098

$18.225

-

$18.361

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ChromeModa Solutions

Germany . 2,686 parts In-Stock

1+ parts

$20.477

100+ parts

$16.791

1k+ parts

-

10k+ parts

-

2,686

$20.477

$16.791

-

-

IDEA Electronic Components Group

UK . 2,269 parts In-Stock

1+ parts

$20.477

100+ parts

$19.453

1k+ parts

$18.429

10k+ parts

-

2,269

$20.477

$19.453

$18.429

-

Microchip USA

USA . 382 parts In-Stock

1+ parts

$45.290

100+ parts

$44.640

1k+ parts

$44.320

10k+ parts

$43.990

382

$45.290

$44.640

$44.320

$43.990

DigiPath Technology Company

USA . 2,240 parts In-Stock

1+ parts

-

100+ parts

$18.462

1k+ parts

-

10k+ parts

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2,240

-

$18.462

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Overview

Elevate your electronics projects with the LM3S2730-IBZ50-A2 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their microcontrollers. Whether you're working on IoT devices, robotics, or industrial automation, this powerful 32-bit microcontroller offers unmatched value and performance. With features like ADC channels, PWM channels, and a wide operating temperature range, the LM3S2730-IBZ50-A2 is the perfect choice for your next project. Upgrade your designs today and experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the microcontroller chip, ensuring longevity and reliability.

Surface Mount: YES

Enables easy and efficient integration onto circuit boards, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 2.75 V

Ideal for low power applications, helping to conserve energy and extend battery life.

Bit Size: 32

Offers a high level of processing power and capability for handling complex tasks and calculations.

Power Supplies (V): 2.5,3.3

Compatible with commonly used voltage levels in electronic systems, providing versatility and ease of integration.

No. of Terminals: 108

Provides a sufficient number of connection points for interfacing with external components and peripherals.

Minimum Operating Temperature: -40 °C

Suitable for operation in harsh environments or extreme cold conditions without compromising performance.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the microcontroller to process analog signals from sensors or other sources.

ROM Words: 131072

Offers ample storage capacity for program instructions and data, accommodating complex software requirements.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing (RISC) architecture for efficient and streamlined processing of instructions.

No. of I/O Lines: 60

Provides multiple input/output channels for interfacing with external devices and communicating with the surrounding system.

Technical Specifications

Microcontrollers LM3S2730-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S2730-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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