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LM3S2637-IQC50-A2

Texas Instruments

LM3S2637-IQC50-A2 by Texas Instruments

Texas Instruments' LM3S2637-IQC50-A2 is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. Operating at up to 0.032 MHz, it features 46 I/O lines and PWM channels for industrial applications requiring a temperature range of -40 to 85 °C.

Median Price

$11.370

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9 parts In-Stock

1+ parts

-

100+ parts

$11.370

1k+ parts

$10.170

10k+ parts

$9.580

9

-

$11.370

$10.170

$9.580

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,191 parts In-Stock

1+ parts

$11.998

100+ parts

-

1k+ parts

-

10k+ parts

-

2,191

$11.998

-

-

-

Vyrian

USA . 7,724 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,724

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,377 parts In-Stock

1+ parts

$11.367

100+ parts

-

1k+ parts

-

10k+ parts

-

3,377

$11.367

-

-

-

AZTECH Wire

Italy . 1,087 parts In-Stock

1+ parts

$21.610

100+ parts

-

1k+ parts

-

10k+ parts

-

1,087

$21.610

-

-

-

Microchip USA

USA . 167 parts In-Stock

1+ parts

$47.830

100+ parts

$47.150

1k+ parts

$46.800

10k+ parts

$46.460

167

$47.830

$47.150

$46.800

$46.460

Parana Technologies

USA . 428 parts In-Stock

1+ parts

$75.258

100+ parts

-

1k+ parts

-

10k+ parts

-

428

$75.258

-

-

-

DigiPath Technology Company

USA . 593 parts In-Stock

1+ parts

$82.868

100+ parts

$76.238

1k+ parts

-

10k+ parts

-

593

$82.868

$76.238

-

-

ChromeModa Solutions

Germany . 3,050 parts In-Stock

1+ parts

$84.559

100+ parts

$69.338

1k+ parts

-

10k+ parts

-

3,050

$84.559

$69.338

-

-

IDEA Electronic Components Group

UK . 622 parts In-Stock

1+ parts

$84.559

100+ parts

$80.331

1k+ parts

$76.103

10k+ parts

-

622

$84.559

$80.331

$76.103

-

Overview

Elevate your projects with the LM3S2637-IQC50-A2 by Texas Instruments, a top-tier microcontroller that delivers unparalleled performance and reliability. Crafted by the industry-leading manufacturer, this cutting-edge device is designed to meet the demands of various applications in the tech world. With its advanced features and robust capabilities, this microcontroller offers exceptional value and benefits to customers looking to push the boundaries of innovation. Upgrade your next project with the LM3S2637-IQC50-A2 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-lasting performance in various environments.

Surface Mount: YES

Ease of installation and PCB assembly, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 2.75 V

Allows for a safe operating voltage range, preventing damage to the microcontroller.

Package Shape: SQUARE

Optimal packaging design for efficient use of space on the PCB.

Bit Size: 32

High processing capabilities and performance for complex tasks and calculations.

Power Supplies (V): 2.5,3.3

Support for multiple power supply options, providing flexibility in system design.

No. of Terminals: 100

Sufficient I/O connections for interfacing with external devices and components.

Package Style (Meter): FLATPACK

Compact form factor for space-constrained applications.

Minimum Supply Voltage: 2.25 V

Allows for reliable operation even at lower supply voltages.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operates reliably in cold environments, ensuring functionality in various conditions.

Terminal Finish: TIN

Provides good conductivity and solderability for reliable connections.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling sensor interfacing and data acquisition.

Terminal Position: QUAD

Facilitates easy PCB layout and routing for efficient design.

ROM Words: 131072

Ample memory capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for space-saving and compact applications.

Width: 14 mm

Compact dimensions for integration into tight spaces on the PCB.

Maximum Clock Frequency: 0.032 MHz

High-speed processing capabilities for quick and efficient operation.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering during the assembly process.

Peak Reflow Temperature °C: 260

Supports high-temperature reflow soldering for robust connections.

Length: 14 mm

Compact form factor for space-efficient PCB layout.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Advanced RISC architecture for efficient and high-performance computing.

RAM Bytes: 32768

Sufficient random access memory for data storage and processing.

Technology: CMOS

Low power consumption and high noise immunity for energy-efficient operation.

Terminal Form: GULL WING

Easy to solder and provides mechanical strength for reliable connections.

Nominal Supply Voltage: 2.5 V

Stable and reliable supply voltage for consistent performance.

PWM Channels: YES

Enables pulse-width modulation for precise control of peripherals and devices.

ROM Programmability: FLASH

Allows for easy and quick reprogramming of the ROM memory.

Terminal Pitch: 0.5 mm

Fine pitch spacing for compact layout and high-density connections.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering with multiple heat exposure cycles.

Speed: 50 rpm

Fast processing speed for efficient operation in real-time applications.

No. of I/O Lines: 46

Sufficient input/output interfaces for versatile connectivity with external devices.

Technical Specifications

Microcontrollers LM3S2637-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2637-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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