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LM3S2616-IQR50-A0

Texas Instruments

LM3S2616-IQR50-A0 by Texas Instruments

Texas Instruments LM3S2616-IQR50-A0 microcontroller features 32-bit Cortex-M3 CPU, 131072 ROM words, and 16384 RAM bytes. Ideal for industrial applications requiring CAN, I2C, UART connectivity and low power mode with 50 rpm speed.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,804 parts In-Stock

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Digiode

USA . 166 parts In-Stock

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166

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Distributors (Availability)

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AZTECH Wire

Italy . 401 parts In-Stock

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$5.352

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401

$5.352

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Advanced Electronics

New Zealand . 16 parts In-Stock

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$17.640

100+ parts

$16.052

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$14.465

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16

$17.640

$16.052

$14.465

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One Stop Electronics

USA . 1,137 parts In-Stock

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$35.000

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$35.000

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Microchip USA

USA . 2,770 parts In-Stock

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$51.170

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$50.280

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$49.830

10k+ parts

$49.390

2,770

$51.170

$50.280

$49.830

$49.390

Parana Technologies

USA . 1,666 parts In-Stock

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$57.640

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$57.640

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DigiPath Technology Company

USA . 369 parts In-Stock

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$63.469

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$58.391

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369

$63.469

$58.391

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ChromeModa Solutions

Germany . 3,244 parts In-Stock

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$64.764

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$53.106

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$64.764

$53.106

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IDEA Electronic Components Group

UK . 2,003 parts In-Stock

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$64.764

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$61.526

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$58.288

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2,003

$64.764

$61.526

$58.288

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Authorized Procurement Solutions

USA . 21,000 parts In-Stock

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Lixinc

USA . 12,622 parts In-Stock

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Corphita

USA . 4,940 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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Perfect Parts

USA . 560 parts In-Stock

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Futuretech Components

Singapore . 123 parts In-Stock

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Overview

Experience the power of innovation with the LM3S2616-IQR50-A0 microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that are reliable and efficient. This microcontroller is perfect for a wide range of applications, offering unmatched performance and versatility. From industrial automation to consumer electronics, this product provides exceptional value to customers, with features like integrated cache, low power mode, and a variety of peripherals. Trust Texas Instruments for cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material for the package body makes the microcontroller lightweight and durable.

Integrated Cache: YES

Having an integrated cache helps improve performance by reducing memory access times and increasing data throughput.

Maximum Supply Voltage: 2.75 V

The lower maximum supply voltage of 2.75 V can help in reducing power consumption and enhancing efficiency.

On Chip Data RAM Width: 8

The 8-bit data RAM width allows for efficient data processing and storage capabilities.

Package Shape: SQUARE

The square package shape makes it easier for placement on circuit boards and ensures a compact design.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle larger amounts of data and perform complex calculations efficiently.

Power Supplies (V): 2.5,3.3

Support for multiple power supplies (2.5V and 3.3V) offers flexibility in voltage requirements for different applications.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK

The FLATPACK package style offers easy assembly and soldering onto the PCB, making it suitable for mass production.

CPU Family: CORTEX-M3

The CORTEX-M3 CPU family is known for its high performance and energy efficiency, making it ideal for a wide range of embedded applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various peripherals, it allows for streamlined and efficient control of external devices.

Technical Specifications

Microcontrollers LM3S2616-IQR50-A0 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

3

No. of Terminals:

64

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, UART

Peripherals:

DMA, PWM(4), QEI, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

LM3S2616-IQR50-A0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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