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LM3S2608-IBZ50-A2T

Texas Instruments

LM3S2608-IBZ50-A2T by Texas Instruments

LM3S2608-IBZ50-A2T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring high-speed processing and multiple PWM channels. With a package style of GRID ARRAY and terminal finish of TIN SILVER COPPER, it offers versatile connectivity options in compact dimensions.

Median Price

$20.605

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$20.605

100+ parts

-

1k+ parts

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300

$20.605

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Digiode

USA . 4,641 parts In-Stock

1+ parts

-

100+ parts

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4,641

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Vyrian

USA . 4,204 parts In-Stock

1+ parts

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4,204

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 505 parts In-Stock

1+ parts

$4.000

100+ parts

-

1k+ parts

-

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-

505

$4.000

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Parana Technologies

USA . 36 parts In-Stock

1+ parts

$15.501

100+ parts

-

1k+ parts

$15.877

10k+ parts

-

36

$15.501

-

$15.877

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AZTECH Wire

Italy . 475 parts In-Stock

1+ parts

$16.114

100+ parts

-

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475

$16.114

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DigiPath Technology Company

USA . 1,590 parts In-Stock

1+ parts

$17.069

100+ parts

-

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10k+ parts

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1,590

$17.069

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ChromeModa Solutions

Germany . 507 parts In-Stock

1+ parts

$17.417

100+ parts

$14.282

1k+ parts

-

10k+ parts

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507

$17.417

$14.282

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IDEA Electronic Components Group

UK . 484 parts In-Stock

1+ parts

$17.417

100+ parts

$16.546

1k+ parts

$15.675

10k+ parts

-

484

$17.417

$16.546

$15.675

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Microchip USA

USA . 2,930 parts In-Stock

1+ parts

$50.480

100+ parts

$49.760

1k+ parts

$49.400

10k+ parts

$49.040

2,930

$50.480

$49.760

$49.400

$49.040

Corphita

USA . 4,367 parts In-Stock

1+ parts

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4,367

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Overview

Discover the power of innovation with the LM3S2608-IBZ50-A2T microcontroller by Texas Instruments. Designed with precision and reliability in mind, this cutting-edge device offers unparalleled performance for a wide range of applications. Whether you're looking to enhance your industrial automation systems or develop advanced robotics, this microcontroller delivers the speed, efficiency, and flexibility you need to bring your projects to life. Trust in Texas Instruments to provide top-quality products that push the boundaries of technology, making your visions a reality. Elevate your designs with the LM3S2608-IBZ50-A2T and unlock a world of endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring reliability in various environments.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 2.75 V

Operates within a safe voltage range, preventing damage to the microcontroller.

Package Shape: SQUARE

Space-saving design that maximizes usage of PCB real estate.

Bit Size: 32

Offers enhanced processing capabilities for more complex tasks and applications.

Power Supplies (V): 2.5,3.3

Versatile voltage options for compatibility with different power sources.

No. of Terminals: 108

Sufficient terminals for interfacing with various external components and peripherals.

Package Style (Meter): GRID ARRAY

Ensures secure and stable connection with the PCB for reliable performance.

Minimum Supply Voltage: 2.25 V

Allows for operation at lower voltage levels, conserving power and extending battery life.

Maximum Operating Temperature: 85 °C

Capable of withstanding high temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Maintains functionality in extreme cold environments, offering versatility in temperature conditions.

Terminal Finish: TIN SILVER COPPER

Provides superior conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Enables analog-to-digital conversion for interfacing with sensors and other analog devices.

Terminal Position: BOTTOM

Facilitates easy and secure PCB mounting and soldering during assembly.

ROM Words: 131072

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.5 mm

Low profile design for compact and space-constrained applications.

Width: 10 mm

Compact size for integration into small form factor devices.

Maximum Clock Frequency: 0.032 MHz

High clock frequency for fast processing of instructions.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reflow process during assembly.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures for reliable solder joints.

Length: 10 mm

Compact size for space-saving design layouts.

Temperature Grade: INDUSTRIAL

Suitable for rugged industrial environments with wide temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses efficient RISC architecture for optimized performance and power consumption.

RAM Bytes: 32768

Sufficient RAM for data storage and processing in multitasking applications.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminals for reliable solder connections and durability.

Nominal Supply Voltage: 2.5 V

Stable supply voltage for consistent and reliable operation.

PWM Channels: YES

Supports pulse-width modulation for precise control of motors and other devices.

ROM Programmability: FLASH

Flash ROM for easy reprogramming and updating of firmware.

Terminal Pitch: 0.8 mm

Fine pitch terminals for compact PCB layout and space optimization.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes with moderate moisture sensitivity.

Speed: 50 rpm

Operates at a high speed for quick and efficient processing tasks.

No. of I/O Lines: 52

Sufficient I/O lines for versatile interfacing and connectivity with external devices.

Technical Specifications

Microcontrollers LM3S2608-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S2608-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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