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LM3S2533-IQC50-A2

Texas Instruments

LM3S2533-IQC50-A2 by Texas Instruments

Texas Instruments' LM3S2533-IQC50-A2 microcontroller features 32-bit architecture, 65536 bytes of RAM, and 98304 ROM words. With a clock frequency of 0.032 MHz, it is ideal for industrial applications requiring PWM channels and ADC functionality. The compact square package with gull wing terminals makes it suitable for space-constrained designs.

Median Price

$14.011

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 41 parts In-Stock

1+ parts

$14.011

100+ parts

$13.472

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41

$14.011

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Digiode

USA . 2,391 parts In-Stock

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Vyrian

USA . 2,161 parts In-Stock

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2,161

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Dan-Mar Components

USA . 41 parts In-Stock

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41

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Distributors (Availability)

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AZTECH Wire

Italy . 379 parts In-Stock

1+ parts

$15.158

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-

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379

$15.158

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One Stop Electronics

USA . 1,507 parts In-Stock

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$20.000

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1,507

$20.000

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Parana Technologies

USA . 153 parts In-Stock

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$24.259

100+ parts

$2,252.791

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$21.833

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153

$24.259

$2,252.791

$21.833

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DigiPath Technology Company

USA . 1,149 parts In-Stock

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$26.712

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1,149

$26.712

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ChromeModa Solutions

Germany . 2,517 parts In-Stock

1+ parts

$27.257

100+ parts

$22.351

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2,517

$27.257

$22.351

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IDEA Electronic Components Group

UK . 586 parts In-Stock

1+ parts

$27.257

100+ parts

$25.894

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$24.531

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586

$27.257

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$24.531

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Microchip USA

USA . 1,213 parts In-Stock

1+ parts

$47.530

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$46.850

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$46.520

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$46.180

1,213

$47.530

$46.850

$46.520

$46.180

Advanced Electronics

New Zealand . 66 parts In-Stock

1+ parts

$55.069

100+ parts

$50.113

1k+ parts

$45.157

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66

$55.069

$50.113

$45.157

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Corphita

USA . 4,805 parts In-Stock

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4,805

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Perfect Parts

USA . 46 parts In-Stock

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Overview

Experience the seamless integration of cutting-edge technology and superior quality with the LM3S2533-IQC50-A2 microcontroller by Texas Instruments. Crafted with precision and expertise, this product offers unparalleled performance and reliability in a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers unmatched value, efficiency, and versatility. Take your projects to the next level with Texas Instruments' innovative solutions. Elevate your designs with the LM3S2533-IQC50-A2 microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for a variety of environments.

Maximum Supply Voltage: 2.75 V

Allows for efficient power consumption and operation within specified voltage limits.

Bit Size: 32

Provides a higher processing capability and efficiency for handling complex tasks.

No. of Terminals: 100

Offers a wide range of connectivity options for peripherals, sensors, and external devices.

ROM Words: 98304

Provides ample memory for storing program instructions and data efficiently.

RAM Bytes: 65536

Offers sufficient random access memory for temporary storage and data processing.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for efficient power consumption and performance.

PWM Channels: YES

Allows for precise control of analog devices such as motors, LEDs, and servos.

Speed: 50 rpm

Indicates the rotational speed of the microcontroller, suitable for various applications.

Technical Specifications

Microcontrollers LM3S2533-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2533-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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