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LM3S2410-IQC25-A2T

Texas Instruments

LM3S2410-IQC25-A2T by Texas Instruments

LM3S2410-IQC25-A2T by Texas Instruments is a 32-bit microcontroller with 32768 bytes of RAM and 98304 ROM words. It operates at a max clock frequency of 0.032 MHz, making it suitable for industrial applications requiring high-speed processing and control. With 60 I/O lines and PWM channels, this microcontroller offers versatile connectivity options in a compact flatpack package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,243 parts In-Stock

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3,243

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Digiode

USA . 1,668 parts In-Stock

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1,668

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Distributors (Availability)

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AZTECH Wire

Italy . 583 parts In-Stock

1+ parts

$11.510

100+ parts

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583

$11.510

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One Stop Electronics

USA . 1,049 parts In-Stock

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$13.000

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1,049

$13.000

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Microchip USA

USA . 3,744 parts In-Stock

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$43.610

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$42.980

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$42.670

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$42.360

3,744

$43.610

$42.980

$42.670

$42.360

Parana Technologies

USA . 1,258 parts In-Stock

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$58.066

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1,258

$58.066

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$63.283

100+ parts

$57.588

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$51.892

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$63.283

$57.588

$51.892

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DigiPath Technology Company

USA . 1,385 parts In-Stock

1+ parts

$63.938

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$58.823

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1,385

$63.938

$58.823

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ChromeModa Solutions

Germany . 3,730 parts In-Stock

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$65.243

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$53.499

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$53.499

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IDEA Electronic Components Group

UK . 1,026 parts In-Stock

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$65.243

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$61.981

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$58.719

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1,026

$65.243

$61.981

$58.719

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Corphita

USA . 678 parts In-Stock

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Overview

Experience the cutting-edge technology of the LM3S2410-IQC25-A2T microcontroller from Texas Instruments, a leading manufacturer known for its high-quality products. Perfect for a wide range of applications, this microcontroller offers unparalleled value with its 32-bit processing power, multiple power supply options, and versatile peripheral features. Whether you're creating IoT devices, robotics, or industrial automation systems, this innovative product provides the performance and reliability you need to bring your projects to life. Trust in Texas Instruments to deliver exceptional solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material which is commonly used for packaging electronic components, ensuring protection during handling and operation.

Surface Mount: YES

Allows for easy installation on PCBs, reducing assembly time and simplifying production processes.

Maximum Supply Voltage: 2.75 V

Designed to operate within a safe voltage range, ensuring the safety and longevity of the microcontroller.

Package Shape: SQUARE

Compact shape that facilitates efficient placement on circuit boards, optimizing space utilization in electronic devices.

Bit Size: 32

High bit size allows for processing and handling of complex instructions, making the microcontroller suitable for a wide range of applications.

Power Supplies (V): 2.5, 3.3

Compatible with common power supply voltages, providing flexibility in design and deployment of electronic systems.

No. of Terminals: 100

Sufficient number of terminals for connecting various components and peripherals, enabling versatile functionality and customization.

Package Style (Meter): FLATPACK

Flatpack style enhances thermal performance and reliability by efficiently dissipating heat during operation.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature environments, making it suitable for a wide range of industrial and outdoor applications.

Maximum Operating Temperature: 85 °C

Designed to withstand high operating temperatures, ensuring stability and performance reliability under various environmental conditions.

ADC Channels: YES

Integrated Analog-to-Digital Converter (ADC) allows for accurate conversion of analog signals to digital data, enhancing precision and sensor interfacing capabilities.

ROM Words: 98304

Ample ROM (Read-Only Memory) capacity for storing program instructions and data, supporting complex algorithms and applications.

RAM Bytes: 32768

Sufficient RAM (Random Access Memory) for efficient data storage and retrieval, enabling multitasking and real-time processing requirements.

PWM Channels: YES

Integrated Pulse Width Modulation (PWM) channels for precise control of output signals, ideal for motor control and power management applications.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and flexible firmware updates, enhancing product longevity and adaptability to changing requirements.

Technical Specifications

Microcontrollers LM3S2410-IQC25-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2410-IQC25-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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