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LM3S2139-IQC25-A2T

Texas Instruments

LM3S2139-IQC25-A2T by Texas Instruments

Texas Instruments LM3S2139-IQC25-A2T microcontroller features Cortex-M3 CPU, 32-bit architecture, and 16384 bytes of RAM. With CAN, I2C, SSI, UART connectivity options and 4-Ch 10-Bit ADCs, it's ideal for industrial applications requiring low power consumption and high-speed processing up to 25 MHz. The package style is a flatpack with a square shape and gull wing terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,856 parts In-Stock

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Vyrian

USA . 2,439 parts In-Stock

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2,439

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Distributors (Availability)

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AZTECH Wire

Italy . 267 parts In-Stock

1+ parts

$8.899

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267

$8.899

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Andel Nordic

Denmark . 1,697 parts In-Stock

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$9.750

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$9.360

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$9.360

1,697

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$9.360

One Stop Electronics

USA . 274 parts In-Stock

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$11.000

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274

$11.000

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Microchip USA

USA . 443 parts In-Stock

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$51.410

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$50.960

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$50.960

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$50.510

443

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$50.960

$50.960

$50.510

Parana Technologies

USA . 608 parts In-Stock

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$61.891

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608

$61.891

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DigiPath Technology Company

USA . 2,372 parts In-Stock

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$68.150

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$68.150

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ChromeModa Solutions

Germany . 4,747 parts In-Stock

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$69.541

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$57.024

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4,747

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IDEA Electronic Components Group

UK . 555 parts In-Stock

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$69.541

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$66.064

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$62.587

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555

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$62.587

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Corphita

USA . 3,040 parts In-Stock

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Overview

Get ready to experience the best in microcontroller technology with the LM3S2139-IQC25-A2T by Texas Instruments. As a leading manufacturer, Texas Instruments delivers top-quality products like this one, perfect for a wide range of applications. Whether you're looking to enhance your industrial automation processes, develop innovative IoT solutions, or create cutting-edge consumer electronics, this microcontroller offers unmatched performance and reliability. With integrated cache, multiple peripherals, and low power modes, this versatile device provides value, benefits, and advantages that will take your projects to the next level. Upgrade to the LM3S2139-IQC25-A2T today and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Integrated Cache: YES

Improves processing speed by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 2.75 V

Allows for flexibility in power supply options while ensuring safe operation.

Address Bus Width: 8

Provides flexibility and efficiency in addressing memory locations within the system.

Bit Size: 32

Enables handling of larger data sets and more complex calculations efficiently.

CPU Family: CORTEX-M3

Utilizes an advanced processor architecture for high performance and energy efficiency.

ADC Channels: YES

Allows for analog-to-digital conversion for interfacing with various sensors and external devices.

DMA Channels: YES

Enables direct memory access for efficient data transfer between peripherals and memory without CPU involvement.

ROM Words: 65536

Provides ample storage for program code and data, allowing for complex applications to be executed.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes reduced instruction set computing (RISC) architecture for faster and more efficient processing.

Technical Specifications

Microcontrollers LM3S2139-IQC25-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

8

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

56

No. of Serial I/Os:

5

No. of Terminals:

100

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SSI, UART(2)

Peripherals:

TIMER(3), WDT

Analog To Digital Convertors:

4-Ch 10-Bit

Trade Compliance

LM3S2139-IQC25-A2T Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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