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LM3S2110-IQC25-A2T

Texas Instruments

LM3S2110-IQC25-A2T by Texas Instruments

Texas Instruments' LM3S2110-IQC25-A2T is a 32-bit microcontroller with 40 I/O lines, 16384 RAM bytes, and 65536 ROM words. Operating at -40 to 85 °C, it features PWM channels, ADC support, and a max clock frequency of 0.032 MHz. Ideal for industrial applications requiring a compact design with low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,888 parts In-Stock

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5,888

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Digiode

USA . 2,014 parts In-Stock

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2,014

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Distributors (Availability)

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AZTECH Wire

Italy . 838 parts In-Stock

1+ parts

$8.064

100+ parts

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838

$8.064

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One Stop Electronics

USA . 612 parts In-Stock

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$30.000

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612

$30.000

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Parana Technologies

USA . 127 parts In-Stock

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$44.722

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127

$44.722

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Microchip USA

USA . 2,888 parts In-Stock

1+ parts

$45.530

100+ parts

$44.880

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$44.560

10k+ parts

$44.230

2,888

$45.530

$44.880

$44.560

$44.230

DigiPath Technology Company

USA . 9 parts In-Stock

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$49.245

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9

$49.245

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IDEA Electronic Components Group

UK . 2,023 parts In-Stock

1+ parts

$50.250

100+ parts

$47.738

1k+ parts

$45.225

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2,023

$50.250

$47.738

$45.225

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ChromeModa Solutions

Germany . 801 parts In-Stock

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$50.250

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$41.205

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801

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$41.205

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Component Stockers USA

USA . 292 parts In-Stock

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$99.990

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292

$99.990

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Authorized Procurement Solutions

USA . 27,400 parts In-Stock

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Lixinc

USA . 9,542 parts In-Stock

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Corphita

USA . 4,688 parts In-Stock

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Overview

Experience the next level of performance and reliability with the Texas Instruments LM3S2110-IQC25-A2T microcontroller. Crafted with precision by a trusted industry leader, this powerful device offers unparalleled versatility for a wide range of applications. Whether you're designing cutting-edge IoT devices or innovative automation systems, this microcontroller delivers exceptional value, efficiency, and seamless integration. Elevate your projects with the quality and reliability that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, providing protection to the microcontroller.

Surface Mount: YES

Surface mount technology allows for easier and more efficient installation on PCBs.

Maximum Supply Voltage: 2.75 V

This voltage range ensures safe operation and prevents damage to the microcontroller.

Package Shape: SQUARE

Square shape allows for a more compact design and efficient use of space on the PCB.

Bit Size: 32

32-bit architecture provides higher processing power and capabilities for the microcontroller.

Power Supplies (V): 2.5,3.3

Having multiple power supply options allows for flexibility in different applications and voltage requirements.

No. of Terminals: 100

Having a high number of terminals allows for connectivity to various components and peripherals.

Package Style (Meter): FLATPACK

Flatpack style is commonly used for space-saving and compact designs.

Minimum Supply Voltage: 2.25 V

Ensuring a minimum supply voltage helps maintain stability and performance of the microcontroller.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this microcontroller can perform reliably in cold environments.

Terminal Finish: TIN

Tin finish provides good conductivity and durability for the terminals of the microcontroller.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals to digital, increasing its functionality.

Terminal Position: QUAD

Quad terminal position facilitates easy soldering and connection with other components.

ROM Words: 65536

With a large ROM capacity, this microcontroller can store a significant amount of program data.

Maximum Seated Height: 1.6 mm

Low seated height makes this microcontroller suitable for compact and slim designs.

Width: 14 mm

Compact width allows for efficient placement on the PCB and space-saving design.

Maximum Clock Frequency: 0.032 MHz

High clock frequency enables fast and efficient processing of instructions within the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 30

This parameter ensures that the microcontroller can withstand reflow soldering processes without damage.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures robustness during soldering processes.

Length: 14 mm

Compact length allows for space-efficient designs and placement on the PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature performance ensures reliability and durability in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and efficiency for the microcontroller's operations.

RAM Bytes: 16384

With a large RAM capacity, this microcontroller can handle multiple tasks and data processing efficiently.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for the microcontroller.

Terminal Form: GULL WING

Gull wing terminals offer easy soldering and reliable connectivity on the PCB.

Nominal Supply Voltage: 2.5 V

Stable and reliable nominal supply voltage ensures consistent performance of the microcontroller.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of outputs and devices connected to the microcontroller.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to the microcontroller's firmware or program code.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on the PCB and space-saving design.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that this microcontroller has moderate sensitivity to moisture, requiring standard handling precautions.

Speed: 25 rpm

This microcontroller operates at a speed of 25 revolutions per minute, suitable for various applications.

No. of I/O Lines: 40

Having a high number of I/O lines allows for versatile connectivity and interface options with external devices.

Technical Specifications

Microcontrollers LM3S2110-IQC25-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

40

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2110-IQC25-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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