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LM3S1N16-IQR50-C1

Texas Instruments

LM3S1N16-IQR50-C1 by Texas Instruments

LM3S1N16-IQR50-C1 by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at a max clock frequency of 0.032 MHz. It features 33 I/O lines, ADC and DMA channels, and 12288 bytes of RAM. Ideal for industrial applications requiring high-speed processing and precise control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,495 parts In-Stock

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7,495

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Digiode

USA . 3,163 parts In-Stock

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3,163

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Distributors (Availability)

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AZTECH Wire

Italy . 772 parts In-Stock

1+ parts

$10.723

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772

$10.723

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One Stop Electronics

USA . 1,587 parts In-Stock

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$13.000

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1,587

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Parana Technologies

USA . 276 parts In-Stock

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$54.438

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276

$54.438

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IDEA Electronic Components Group

UK . 523 parts In-Stock

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$61.166

100+ parts

$58.108

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$55.049

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523

$61.166

$58.108

$55.049

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ChromeModa Solutions

Germany . 345 parts In-Stock

1+ parts

$61.166

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$50.156

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345

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$50.156

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Corphita

USA . 4,203 parts In-Stock

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DigiPath Technology Company

USA . 2,363 parts In-Stock

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$55.147

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Microchip USA

USA . 162 parts In-Stock

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Overview

Maximize your project's potential with the LM3S1N16-IQR50-C1 microcontroller from Texas Instruments. Known for their top-quality products, Texas Instruments delivers unrivaled performance and reliability in the world of microcontrollers. This versatile device is perfect for a wide range of applications, offering customers value and benefits like never before. Whether you're designing robotics, IoT devices, or industrial automation systems, the LM3S1N16-IQR50-C1 is sure to take your projects to the next level. Experience the advantages of Texas Instruments technology today and unlock endless possibilities for innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material for package body provides durability and protection to the internal components of the microcontroller.

Surface Mount: YES

Surface mount capability allows for easier and more convenient assembly onto circuit boards.

Maximum Supply Voltage: 1.32 V

Ability to handle a maximum supply voltage of 1.32V ensures stable operation under varying voltage conditions.

Package Shape: SQUARE

Square shape package allows for efficient use of space on circuit boards.

Bit Size: 32

32-bit architecture provides high processing power and efficiency for various applications.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages enables flexibility in designing and operating the microcontroller.

No. of Terminals: 64

Having 64 terminals allows for multiple connections and interfaces with external devices.

Package Style (Meter): FLATPACK

Flatpack package style offers easy integration and installation on PCBs.

Minimum Supply Voltage: 1.08 V

Low minimum supply voltage requirement ensures efficient power consumption.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range makes the microcontroller suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme conditions without affecting performance.

ADC Channels: YES

Built-in ADC channels enable analog-to-digital conversion, essential for many sensor interfacing applications.

DMA Channels: YES

Support for Direct Memory Access channels improves data transfer efficiency and speed.

Terminal Position: QUAD

Quad terminal position offers better connectivity options and easier PCB layout.

ROM Words: 65536

Large ROM capacity of 65536 words allows for storing program code and data.

Maximum Seated Height: 1.6 mm

Low seated height makes it suitable for compact and slim design applications.

Width: 10 mm

Compact width dimension ensures space-saving on the PCB layout.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 0.032 MHz provides fast processing capabilities.

Length: 10 mm

Compact length dimension for space-efficient placement on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it offers integrated peripherals and processing capabilities for standalone operation.

RAM Bytes: 12288

Ample RAM capacity of 12288 bytes for data storage and processing requirements.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering and robust connection on the PCB.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage of 1.2V ensures consistent performance.

PWM Channels: YES

Support for Pulse Width Modulation channels enables precise control and modulation of output signals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to the program code.

Terminal Pitch: 0.5 mm

Compact terminal pitch of 0.5mm provides better connectivity options in limited space.

Speed: 50 rpm

Operational speed of 50 rpm offers efficient processing capabilities for various applications.

No. of I/O Lines: 33

Having 33 I/O lines provides versatile input/output options for external interfacing.

Technical Specifications

Microcontrollers LM3S1N16-IQR50-C1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1N16-IQR50-C1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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