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LM3S1J16-IQR50-C5T

Texas Instruments

LM3S1J16-IQR50-C5T by Texas Instruments

LM3S1J16-IQR50-C5T by Texas Instruments is a 32-bit Cortex-M3 microcontroller with 131072 ROM words and 20480 RAM bytes. Operating at up to 16 MHz, it features 33 I/O lines, PWM and ADC channels, suitable for industrial applications requiring high-speed processing and precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,414 parts In-Stock

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9,414

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Digiode

USA . 3,144 parts In-Stock

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3,144

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Distributors (Availability)

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AZTECH Wire

Italy . 240 parts In-Stock

1+ parts

$18.976

100+ parts

-

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240

$18.976

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Parana Technologies

USA . 724 parts In-Stock

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$24.309

100+ parts

-

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$24.969

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724

$24.309

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$24.969

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DigiPath Technology Company

USA . 238 parts In-Stock

1+ parts

$26.767

100+ parts

$24.625

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238

$26.767

$24.625

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IDEA Electronic Components Group

UK . 2,079 parts In-Stock

1+ parts

$27.313

100+ parts

$25.947

1k+ parts

$24.582

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2,079

$27.313

$25.947

$24.582

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ChromeModa Solutions

Germany . 1,417 parts In-Stock

1+ parts

$27.313

100+ parts

$22.397

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1,417

$27.313

$22.397

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One Stop Electronics

USA . 208 parts In-Stock

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$29.000

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208

$29.000

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Corphita

USA . 4,203 parts In-Stock

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Microchip USA

USA . 100 parts In-Stock

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100

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Overview

Unlock endless possibilities with the LM3S1J16-IQR50-C5T by Texas Instruments, a top-of-the-line microcontroller that delivers unmatched quality and performance. Designed with cutting-edge technology, this versatile device is perfect for a wide range of applications. Whether you're a tech enthusiast or a seasoned professional, this product offers unmatched value, benefits, and advantages. Trust Texas Instruments to provide you with the tools you need to bring your innovations to life. Elevate your projects today with the LM3S1J16-IQR50-C5T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

Having a maximum supply voltage of 3.6V allows for flexibility in power supply options while ensuring safe operation within specified limits.

Package Shape: SQUARE

Square package shape helps in efficient PCB layout and space utilization, especially in compact designs.

Bit Size: 32

A 32-bit architecture provides enhanced processing power and efficiency, suitable for demanding tasks and applications.

Power Supplies (V): 1.2, 3.3

Support for multiple power supply voltages (1.2V and 3.3V) enables compatibility with various power sources and peripherals.

No. of Terminals: 64

Having 64 terminals allows for a sufficient number of I/O connections and peripheral interfaces, enhancing the device's functionality and versatility.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3V ensures stable operation within specified voltage range for reliable performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the microcontroller can withstand high temperature environments without compromising functionality.

CPU Family: CORTEX-M3

Based on Cortex-M3 architecture, the microcontroller offers high performance, low power consumption, and a rich set of features for diverse applications.

Minimum Operating Temperature: -40 °C

Capable of operating at temperatures as low as -40°C, making it suitable for use in harsh environmental conditions or industrial applications.

Terminal Finish: MATTE TIN

Matte tin finish on terminals provides corrosion resistance and reliable solder joints, ensuring long-term functionality and durability.

ADC Channels: YES

Integrated ADC channels enable analog input signal conversion, expanding functionality for sensor interfacing and data acquisition applications.

DMA Channels: YES

DMA channels offer efficient data transfer between peripherals and memory, reducing CPU overhead and improving system performance.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and facilitates soldering processes, enhancing manufacturing efficiency.

ROM Words: 131072

With a ROM size of 131072 words, the microcontroller can store large program code, configurations, and data, supporting complex application requirements.

Technical Specifications

Microcontrollers LM3S1J16-IQR50-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1J16-IQR50-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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