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LM3S1J11-IQC50-C5

Texas Instruments

LM3S1J11-IQC50-C5 by Texas Instruments

LM3S1J11-IQC50-C5 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 20480 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring high-speed processing and ADC/DMA capabilities. With a temperature range from -40 to 85°C, it offers reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,188 parts In-Stock

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Digiode

USA . 3,305 parts In-Stock

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Bristol Electronics

USA . 947 parts In-Stock

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One Stop Electronics

USA . 1,394 parts In-Stock

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$13.000

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AZTECH Wire

Italy . 676 parts In-Stock

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$18.791

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676

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Parana Technologies

USA . 613 parts In-Stock

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$39.144

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ChromeModa Solutions

Germany . 4,186 parts In-Stock

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$43.982

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$36.065

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$36.065

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IDEA Electronic Components Group

UK . 523 parts In-Stock

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$43.982

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$41.783

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$39.584

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523

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$39.584

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Corphita

USA . 4,632 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,453 parts In-Stock

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DigiPath Technology Company

USA . 1,612 parts In-Stock

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$39.654

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Microchip USA

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Perfect Parts

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Overview

Unlock the power of innovation with the LM3S1J11-IQC50-C5 microcontroller from Texas Instruments. Designed with precision and reliability in mind, this cutting-edge device offers endless possibilities for a wide range of applications. With advanced features like ADC and DMA channels, along with PWM capabilities, this microcontroller provides unparalleled performance and flexibility. Whether you're a seasoned professional or a hobbyist, this product delivers value, efficiency, and quality that will exceed your expectations. Embrace the future of technology with the LM3S1J11-IQC50-C5 and revolutionize your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection to the microcontroller, making it suitable for a wide range of applications.

Surface Mount: YES

The surface-mount feature allows for easy and convenient installation on PCBs, saving space and improving the overall design efficiency.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6 V ensures compatibility with a variety of power sources, making it versatile for different projects.

Package Shape: SQUARE

The square package shape helps in efficient placement and layout on the PCB, optimizing space utilization and enhancing design flexibility.

Bit Size: 32

The 32-bit architecture offers enhanced processing power and performance, suitable for handling complex tasks and computations effectively.

No. of Terminals: 100

With 100 terminals, this microcontroller provides ample connectivity options for interfacing with various external components and peripherals.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40 to 85°C allows the microcontroller to operate reliably in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with various built-in peripherals, it simplifies system design and integration, reducing the need for external components.

RAM Bytes: 20480

With 20,480 bytes of RAM, this microcontroller can handle data processing and storage efficiently, enabling smooth operation of applications.

PWM Channels: YES

The presence of PWM channels allows for precise control of connected devices such as motors or LEDs, enabling implementation of sophisticated functions.

Technical Specifications

Microcontrollers LM3S1J11-IQC50-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1J11-IQC50-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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