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LM3S1937-IQC50-A2T

Texas Instruments

LM3S1937-IQC50-A2T by Texas Instruments

Texas Instruments' LM3S1937-IQC50-A2T is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. Operating at up to 0.032 MHz, it features 56 I/O lines and PWM channels for industrial applications requiring high-speed processing and precise control. With a temperature range of -40 to 85 °C, this CMOS technology-based device offers versatile performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,656 parts In-Stock

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2,656

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Vyrian

USA . 2,532 parts In-Stock

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2,532

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Distributors (Availability)

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AZTECH Wire

Italy . 792 parts In-Stock

1+ parts

$13.396

100+ parts

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792

$13.396

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One Stop Electronics

USA . 1,000 parts In-Stock

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$21.000

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$21.000

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Microchip USA

USA . 3,221 parts In-Stock

1+ parts

$41.900

100+ parts

$41.310

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$41.010

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$40.710

3,221

$41.900

$41.310

$41.010

$40.710

Parana Technologies

USA . 396 parts In-Stock

1+ parts

$44.568

100+ parts

$4,138.781

1k+ parts

$40.111

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396

$44.568

$4,138.781

$40.111

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DigiPath Technology Company

USA . 1,186 parts In-Stock

1+ parts

$49.074

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1,186

$49.074

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ChromeModa Solutions

Germany . 6,379 parts In-Stock

1+ parts

$50.076

100+ parts

$41.062

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6,379

$50.076

$41.062

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IDEA Electronic Components Group

UK . 2,043 parts In-Stock

1+ parts

$50.076

100+ parts

$47.572

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$45.068

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2,043

$50.076

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$45.068

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Component Stockers USA

USA . 771 parts In-Stock

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$99.990

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Corphita

USA . 1,778 parts In-Stock

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Overview

Experience the next level of innovation with the LM3S1937-IQC50-A2T by Texas Instruments, a leading manufacturer in the industry. This microcontroller offers unparalleled quality and reliability for a wide range of applications. With advanced features and cutting-edge technology, this product provides value like no other. Unlock endless possibilities and maximize efficiency with the LM3S1937-IQC50-A2T, your ultimate solution for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good insulation properties and can protect the internal components of the microcontroller.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly.

Maximum Supply Voltage: 2.75 V

This specific voltage range is suitable for the intended applications of the microcontroller.

Package Shape: SQUARE

Square packages can optimize space on the PCB and allow for efficient component placement.

Bit Size: 32

32-bit architecture allows for high performance and efficient processing of data.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages increases flexibility in design and compatibility with various systems.

No. of Terminals: 100

Having a high number of terminals allows for connectivity with numerous external components and peripherals.

Package Style (Meter): FLATPACK

Flatpack style packages are compact and suitable for space-constrained applications.

Minimum Supply Voltage: 2.25 V

The ability to operate at low supply voltages can save power and extend battery life in portable devices.

Maximum Operating Temperature: 85 °C

The microcontroller can operate reliably in high-temperature environments without performance degradation.

Minimum Operating Temperature: -40 °C

The microcontroller can withstand cold temperatures, making it suitable for a wide range of operating environments.

Terminal Finish: TIN

Tin finish provides good solderability and corrosion resistance for long-term reliability.

ADC Channels: YES

Built-in ADC channels enable analog-to-digital conversion, making the microcontroller versatile for sensor interfacing.

Terminal Position: QUAD

Quad terminal layout allows for easier PCB layout and routing of signals.

ROM Words: 262144

Large ROM capacity allows for storing complex programs and data for various applications.

Maximum Seated Height: 1.6 mm

Low profile design reduces the overall height of the assembled PCB, important for slim devices.

Width: 14 mm

Compact width dimension saves space on the PCB and allows for densely populated designs.

Maximum Clock Frequency: 0.032 MHz

High clock frequency enables fast processing and real-time operation for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller can withstand peak reflow temperatures for a sufficient duration during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and connection reliability during assembly.

Length: 14 mm

Compact length dimension saves space on the PCB and allows for compact product designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliability in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and efficiency in processing instructions, ideal for embedded applications.

RAM Bytes: 65536

Generous RAM capacity allows for efficient data storage and manipulation during program execution.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals offer good mechanical strength and reliability during PCB assembly and operation.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and compatibility with external components.

PWM Channels: YES

Built-in PWM channels enable precise control of digital signals for applications like motor control and LED dimming.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of firmware, crucial for flexibility in product development.

Terminal Pitch: 0.5 mm

Fine terminal pitch facilitates high-density PCB layouts and allows for more terminals in a given space.

Moisture Sensitivity Level (MSL): 3

MSL rating of 3 indicates moderate sensitivity to moisture, requiring standard precautions during storage and handling.

Speed: 50 rpm

Operates at a speed of 50 revolutions per minute, suitable for applications requiring precise timing and control.

No. of I/O Lines: 56

Numerous I/O lines provide sufficient connectivity for interfacing with various peripherals and external devices.

Technical Specifications

Microcontrollers LM3S1937-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

56

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1937-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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