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LM3S1918-IBZ50-A2

Texas Instruments

LM3S1918-IBZ50-A2 by Texas Instruments

Texas Instruments LM3S1918-IBZ50-A2 microcontroller features 32-bit CPU, 108 terminals, and 262144 ROM words. Ideal for industrial applications, it offers 8-channel ADC, 5 timers, and low power mode with a max clock frequency of 0.032 MHz.

Median Price

$23.692

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 377 parts In-Stock

1+ parts

-

100+ parts

$21.060

1k+ parts

$18.840

10k+ parts

$17.740

377

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$21.060

$18.840

$17.740

Verical

USA . 254 parts In-Stock

1+ parts

-

100+ parts

$26.325

1k+ parts

$23.550

10k+ parts

$22.175

254

-

$26.325

$23.550

$22.175

Distributors (In-Stock)

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Digiode

USA . 770 parts In-Stock

1+ parts

$22.230

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770

$22.230

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Vyrian

USA . 3,539 parts In-Stock

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3,539

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DigiKey Marketplace

USA . 377 parts In-Stock

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377

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Distributors (Availability)

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Ampacity Inc.

Singapore . 304 parts In-Stock

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$19.890

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304

$19.890

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Corphita

USA . 933 parts In-Stock

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$21.060

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933

$21.060

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Parana Technologies

USA . 2,376 parts In-Stock

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$67.992

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2,376

$67.992

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DigiPath Technology Company

USA . 136 parts In-Stock

1+ parts

$74.868

100+ parts

$68.879

1k+ parts

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136

$74.868

$68.879

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ChromeModa Solutions

Germany . 1,468 parts In-Stock

1+ parts

$76.396

100+ parts

$62.645

1k+ parts

-

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1,468

$76.396

$62.645

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IDEA Electronic Components Group

UK . 960 parts In-Stock

1+ parts

$76.396

100+ parts

$72.576

1k+ parts

$68.756

10k+ parts

-

960

$76.396

$72.576

$68.756

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Microchip USA

USA . 411 parts In-Stock

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Perfect Parts

USA . 166 parts In-Stock

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Overview

Discover the LM3S1918-IBZ50-A2 by Texas Instruments, a top-quality microcontroller with integrated cache and a wide range of peripherals like BOR, COMPARATOR, TIMER, and WDT. With a powerful CORTEX-M3 CPU family, this industrial-grade marvel offers low power mode and PWM channels for efficient operation. Ideal for applications requiring high performance and reliability, this microcontroller provides 52 I/O lines and 8-channel 10-bit ADC for versatile connectivity. Elevate your projects with the LM3S1918-IBZ50-A2, where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Integrated Cache: YES

The integrated cache helps in improving the performance of the microcontroller by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures safe operation and protects the microcontroller from damage due to overvoltage.

On Chip Data RAM Width: 8

With a data RAM width of 8, this microcontroller can efficiently handle data processing tasks and store temporary data during operation.

Package Shape: SQUARE

The square package shape makes it easy to mount and align this microcontroller on a PCB, simplifying the manufacturing process.

Bit Size: 32

With a bit size of 32, this microcontroller can handle complex calculations and data processing tasks efficiently.

Power Supplies (V): 2.5,3.3

The availability of multiple power supply options (2.5V and 3.3V) provides flexibility in designing and powering the system.

No. of Terminals: 108

Having a high number of terminals allows for multiple connection points, enabling the microcontroller to interface with various external components.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25 V ensures that the microcontroller can operate reliably even under low voltage conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this microcontroller can withstand elevated temperatures in industrial applications.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 family means that this microcontroller is designed for efficient processing and low power consumption, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures that the microcontroller can function in extreme cold environments without any issues.

Terminal Finish: TIN SILVER COPPER

The terminal finish of TIN SILVER COPPER provides a reliable and durable connection, reducing the risk of corrosion and ensuring long-term performance.

ADC Channels: YES

The presence of Analog to Digital Converter (ADC) channels allows the microcontroller to interface with analog sensors and convert analog signals into digital data for processing.

Terminal Position: BOTTOM

The bottom terminal position makes it easy to mount and solder the microcontroller onto a PCB, ensuring a secure and stable connection.

ROM Words: 262144

With a large ROM capacity of 262144 words, this microcontroller can store a significant amount of program code for execution.

Maximum Seated Height: 1.5 mm

The low maximum seated height of 1.5 mm allows for a compact and slim design, making this microcontroller suitable for space-constrained applications.

RAM Words: 64

The RAM capacity of 64 words enables the microcontroller to store and access data quickly during operation, improving overall system performance.

Width: 10 mm

With a width of 10 mm, this microcontroller can easily fit into compact electronic devices or PCB layouts, saving valuable space.

Boundary Scan: YES

The presence of boundary scan capability allows for easy debugging and testing of the microcontroller during the manufacturing process, ensuring quality and reliability.

Peripherals: BOR, COMPARATOR(2), POR, TIMER(5), WDT

The inclusion of various peripherals such as Brown-Out Reset (BOR), comparators, timers, and watchdog timer (WDT) enhances the functionality of the microcontroller and enables it to interface with external devices effectively.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency of 0.032 MHz allows the microcontroller to execute instructions quickly and efficiently, improving overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures that the microcontroller can withstand the reflow soldering process without any issues, enabling easy and reliable assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C is well within industry standards, ensuring that the microcontroller can be soldered onto a PCB using standard reflow soldering techniques.

Length: 10 mm

With a length of 10 mm, this microcontroller has a compact form factor, making it suitable for small and portable electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that this microcontroller can operate reliably in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, this product offers high performance, low power consumption, and efficient instruction execution, making it ideal for a wide range of applications.

No. of Timers: 5

Having 5 timers allows the microcontroller to perform timing, counting, and scheduling functions, enhancing its versatility and capability in controlling and monitoring external devices.

RAM Bytes: 65536

With a large RAM capacity of 65536 bytes, this microcontroller can efficiently store and access data during operation, improving system performance and responsiveness.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, making this microcontroller energy-efficient and suitable for battery-powered or portable devices.

Terminal Form: BALL

The ball terminal form provides a secure and reliable connection to the PCB, minimizing the risk of signal loss or poor contact, ensuring optimal performance.

Analog To Digital Convertors: 8-Ch 10-Bit

With 8 channels and 10-bit resolution, the Analog to Digital Converters (ADCs) allow the microcontroller to accurately measure analog signals from sensors and convert them into digital data for processing.

Maximum Supply Current: 25 mA

The maximum supply current of 25 mA ensures that the microcontroller operates within safe limits, preventing overheating or electrical damage.

Nominal Supply Voltage: 2.5 V

Having a nominal supply voltage of 2.5 V ensures stable and consistent power delivery to the microcontroller, promoting reliable and efficient operation.

No. of Serial I/Os: 2

Having 2 serial I/O interfaces enables the microcontroller to communicate with external devices or peripherals using standard serial communication protocols, expanding its connectivity options.

PWM Channels: YES

The availability of Pulse Width Modulation (PWM) channels allows the microcontroller to generate precise and variable analog signals, making it ideal for motor control, LED brightness control, and other applications that require precise control.

Connectivity: I2C(2), IRDA, SSI(2), UART(2)

With a variety of connectivity options such as I2C, IRDA, SSI, and UART interfaces, this microcontroller can easily communicate with a wide range of external devices and peripherals, facilitating seamless integration into complex systems.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and quick updates to the program code, enabling flexible and efficient development and maintenance of the microcontroller firmware.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8 mm provides a good balance between space-saving and solderability, making it easy to mount and solder the microcontroller onto a PCB with standard manufacturing processes.

Technical Specifications

Microcontrollers LM3S1918-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

52

No. of Serial I/Os:

2

No. of Terminals:

108

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

RAM Words:

64

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), IRDA, SSI(2), UART(2)"

Peripherals:

"BOR, COMPARATOR(2), POR, TIMER(5), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S1918-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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