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LM3S1911-IQC50-A2T

Texas Instruments

LM3S1911-IQC50-A2T by Texas Instruments

Texas Instruments LM3S1911-IQC50-A2T is a 32-bit Cortex-M3 microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C(2), SPI(2), UART(3).

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,144 parts In-Stock

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6,144

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Chip Stock

USA . 3,370 parts In-Stock

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3,370

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Cyclops Electronics Ltd

UK . 272 parts In-Stock

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272

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Digiode

USA . 263 parts In-Stock

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263

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Distributors (Availability)

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AZTECH Wire

Italy . 516 parts In-Stock

1+ parts

$12.337

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516

$12.337

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Ampacity Inc.

Singapore . 366 parts In-Stock

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$20.000

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366

$20.000

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One Stop Electronics

USA . 1,175 parts In-Stock

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$22.000

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$22.000

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Parana Technologies

USA . 48 parts In-Stock

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$66.620

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48

$66.620

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DigiPath Technology Company

USA . 1,236 parts In-Stock

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$73.357

100+ parts

$67.488

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1,236

$73.357

$67.488

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ChromeModa Solutions

Germany . 6,281 parts In-Stock

1+ parts

$74.854

100+ parts

$61.380

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6,281

$74.854

$61.380

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IDEA Electronic Components Group

UK . 1,651 parts In-Stock

1+ parts

$74.854

100+ parts

$71.111

1k+ parts

$67.369

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1,651

$74.854

$71.111

$67.369

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Authorized Procurement Solutions

USA . 90,000 parts In-Stock

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90,000

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Lixinc

USA . 16,735 parts In-Stock

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Perfect Parts

USA . 12,320 parts In-Stock

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Corphita

USA . 1,720 parts In-Stock

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Microchip USA

USA . 481 parts In-Stock

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481

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments LM3S1911-IQC50-A2T microcontroller. Crafted with precision and quality, this device from a reputable manufacturer offers unmatched performance for a wide range of applications. Whether you're looking to optimize your industrial processes or enhance your consumer electronics, this microcontroller delivers unrivaled value, benefits, and advantages. Experience seamless connectivity, efficient power management, and reliable operation with the LM3S1911-IQC50-A2T - the ultimate choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the microcontroller, making it suitable for various industrial applications.

Integrated Cache: YES

Integrated cache helps in improving the overall performance of the microcontroller by providing faster access to frequently used data.

Maximum Supply Voltage: 2.75 V

Operating at a maximum supply voltage of 2.75V ensures better power efficiency and reduces the risk of damage due to voltage spikes.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 family ensures high performance and efficiency in processing tasks, making it a reliable choice for embedded applications.

ROM Programmability: FLASH

Flash programmability allows for easy and quick updates to the program memory, enabling flexibility and adaptability in the microcontroller's functionality.

Connectivity: I2C(2), SPI(2), UART(3)

Multiple connectivity options such as I2C, SPI, and UART provide versatility in communication interfaces, allowing the microcontroller to easily integrate with other devices.

RAM Bytes: 65536

Having a large RAM capacity of 65536 bytes enables efficient data storage and processing, leading to improved performance in multitasking scenarios.

Technical Specifications

Microcontrollers LM3S1911-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

60

No. of Serial I/Os:

6

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI(2), UART(3)

Peripherals:

TIMER(4), WDT

Trade Compliance

LM3S1911-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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