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LM3S1626-IQR50-A0

Texas Instruments

LM3S1626-IQR50-A0 by Texas Instruments

Texas Instruments' LM3S1626-IQR50-A0 is a 32-bit microcontroller with Cortex-M3 CPU, 131072 ROM words, and 32768 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM(4) peripherals, and I2C/SSI/UART(2) connectivity. Ideal for industrial applications requiring low power mode and high-speed processing up to 16.384 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,027 parts In-Stock

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Digiode

USA . 1,067 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 192 parts In-Stock

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$18.267

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$18.267

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One Stop Electronics

USA . 1,560 parts In-Stock

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$19.000

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$19.000

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Advanced Electronics

New Zealand . 550 parts In-Stock

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$38.901

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$35.400

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$31.899

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550

$38.901

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$31.899

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Parana Technologies

USA . 845 parts In-Stock

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$46.535

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$4,321.521

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$41.882

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845

$46.535

$4,321.521

$41.882

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DigiPath Technology Company

USA . 2,088 parts In-Stock

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$51.241

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$47.142

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$51.241

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IDEA Electronic Components Group

UK . 1,226 parts In-Stock

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$52.287

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$49.673

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$47.058

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$47.058

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ChromeModa Solutions

Germany . 25 parts In-Stock

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$52.287

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$42.875

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25

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Microchip USA

USA . 190 parts In-Stock

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$55.220

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$54.820

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$54.820

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$54.430

190

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Corphita

USA . 955 parts In-Stock

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A-Z Elektronik GmbH

Germany . 887 parts In-Stock

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Kepictronics

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Perfect Parts

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Overview

Unlock the power of innovation with the Texas Instruments LM3S1626-IQR50-A0 microcontroller. Designed with precision and quality in mind, this microcontroller offers unmatched performance in a variety of applications. Whether you're working on industrial automation, consumer electronics, or IoT devices, this microcontroller provides the reliability and efficiency you need to bring your ideas to life. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the LM3S1626-IQR50-A0 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the microcontroller, ensuring reliability and longevity.

Integrated Cache: YES

Integrated cache helps in improving data access speeds and overall performance of the microcontroller.

Maximum Supply Voltage: 2.75 V

Operates within a safe voltage range, preventing damage to the microcontroller.

On Chip Data RAM Width: 8

The wider data RAM width allows for efficient data processing and storage on the microcontroller.

Bit Size: 32

32-bit architecture enables higher computational capabilities and better performance for the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing RISC architecture makes the microcontroller more efficient in processing instructions and performing tasks.

Maximum Clock Frequency: 16.384 MHz

High clock frequency allows for faster execution of instructions, enhancing the overall speed of the microcontroller.

RAM Bytes: 32768

Having a large RAM size enables the microcontroller to handle complex programs and data-intensive tasks effectively.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

ADC Channels: YES

Built-in ADC channels enable the microcontroller to convert analog signals into digital data, expanding its range of applications.

DMA Channels: YES

Direct Memory Access channels enhance data transfer speeds and efficiency by allowing peripherals to directly access memory without CPU intervention.

Technical Specifications

Microcontrollers LM3S1626-IQR50-A0 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SSI, UART(2)

Peripherals:

DMA, PWM(4), QEI, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

LM3S1626-IQR50-A0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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