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LM3S1439-EQC50-A2T

Texas Instruments

LM3S1439-EQC50-A2T by Texas Instruments

LM3S1439-EQC50-A2T by Texas Instruments is a 32-bit microcontroller with 32768 bytes of RAM and 98304 ROM words. It operates at a max clock frequency of 8.192 MHz, suitable for industrial applications requiring PWM channels and ADC functionality. The package style is flatpack with a square shape, making it ideal for surface mount assembly in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,992 parts In-Stock

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Digiode

USA . 2,477 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 618 parts In-Stock

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$19.521

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One Stop Electronics

USA . 1,606 parts In-Stock

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$34.000

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Parana Technologies

USA . 779 parts In-Stock

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$72.988

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$6,778.044

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$65.689

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779

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DigiPath Technology Company

USA . 51 parts In-Stock

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$80.369

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51

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ChromeModa Solutions

Germany . 2,706 parts In-Stock

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$82.009

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$67.247

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$82.009

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IDEA Electronic Components Group

UK . 338 parts In-Stock

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$82.009

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$77.909

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$73.808

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338

$82.009

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QUARKTWIN TECHNOLOGY LTD

USA . 19,981 parts In-Stock

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Microchip USA

USA . 4,978 parts In-Stock

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Corphita

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Overview

Elevate your projects with the LM3S1439-EQC50-A2T microcontroller by Texas Instruments. Renowned for their top-quality products, Texas Instruments delivers reliability and innovation in every component they create. This versatile microcontroller is perfect for a wide range of applications, offering customers unrivaled value and performance. Experience seamless integration, powerful processing capabilities, and unmatched efficiency with the LM3S1439-EQC50-A2T. Upgrade your designs today and unlock endless possibilities with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration of the microcontroller onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 2.75 V

Operating with a maximum supply voltage of 2.75 V allows for energy efficiency and prevents potential damage from excessive voltage levels.

Bit Size: 32

Having a 32-bit architecture provides the microcontroller with the ability to handle complex computations and data processing tasks efficiently.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V and 3.3V) offers flexibility in powering the microcontroller, catering to different system requirements.

No. of Terminals: 100

Having a high number of terminals enables connectivity with various external components and peripherals, expanding the functionality of the microcontroller.

Package Style (Meter): FLATPACK

The flatpack package style provides a compact and space-saving form factor, making it suitable for applications where size constraints are a concern.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, the microcontroller can operate reliably in low-temperature environments without performance degradation.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors and convert analog signals into digital data for processing.

ROM Words: 98304

The large ROM capacity of 98304 words provides ample storage for program code and data, enabling the microcontroller to support complex applications.

Technical Specifications

Microcontrollers LM3S1439-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1439-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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