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LM3S1165-EQC50-A2

Texas Instruments

LM3S1165-EQC50-A2 by Texas Instruments

LM3S1165-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 65536 ROM words and 16384 RAM bytes. It operates b/w -40 to 105 °C, has PWM channels, and offers 43 I/O lines. Ideal for industrial applications requiring a compact design with low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,309 parts In-Stock

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Digiode

USA . 4,509 parts In-Stock

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4,509

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Distributors (Availability)

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Parana Technologies

USA . 1,423 parts In-Stock

1+ parts

$14.718

100+ parts

-

1k+ parts

$15.158

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1,423

$14.718

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$15.158

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DigiPath Technology Company

USA . 2,008 parts In-Stock

1+ parts

$16.206

100+ parts

$14.910

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2,008

$16.206

$14.910

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ChromeModa Solutions

Germany . 6,458 parts In-Stock

1+ parts

$16.537

100+ parts

$13.560

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6,458

$16.537

$13.560

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IDEA Electronic Components Group

UK . 584 parts In-Stock

1+ parts

$16.537

100+ parts

$15.710

1k+ parts

$14.883

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584

$16.537

$15.710

$14.883

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AZTECH Wire

Italy . 662 parts In-Stock

1+ parts

$19.877

100+ parts

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662

$19.877

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One Stop Electronics

USA . 358 parts In-Stock

1+ parts

$32.000

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358

$32.000

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Corphita

USA . 3,844 parts In-Stock

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Microchip USA

USA . 389 parts In-Stock

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Overview

Experience the superior quality and innovation of Texas Instruments with the LM3S1165-EQC50-A2 microcontroller. This groundbreaking product offers unbeatable value for customers seeking high-performance solutions in a compact package. Ideal for a wide range of applications, this microcontroller boasts advanced features and benefits that set it apart from the competition. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the LM3S1165-EQC50-A2 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the microcontroller lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easier integration into circuit boards, making the installation process more efficient.

Maximum Supply Voltage: 2.75 V

This low maximum supply voltage is suitable for applications where lower power consumption is required.

Package Shape: SQUARE

The square package shape provides a compact design, saving space on the circuit board.

Bit Size: 32

The 32-bit size allows for processing larger amounts of data efficiently, making the microcontroller suitable for complex tasks.

Power Supplies (V): 2.5,3.3

Support for multiple power supply options provides flexibility in system design and compatibility with various power sources.

No. of Terminals: 100

Having 100 terminals allows for multiple connections and interfaces, enabling the microcontroller to interact with a wide range of external devices.

Package Style (Meter): FLATPACK

The flatpack package style offers easy handling and installation onto circuit boards.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage ensures reliable operation even in low-power scenarios.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes the microcontroller suitable for industrial applications where it may be exposed to elevated temperatures.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the microcontroller to operate in harsh environments with extreme temperature variations.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, making the microcontroller suitable for applications requiring sensor interfacing.

Terminal Position: QUAD

The quad terminal position provides stability and ease of connection, ensuring reliable performance in various applications.

ROM Words: 65536

The large ROM capacity allows for storing a significant amount of program data, enabling the microcontroller to execute complex instructions efficiently.

Maximum Seated Height: 1.6 mm

The low seated height makes the microcontroller suitable for compact designs and applications with space constraints.

Width: 14 mm

The compact width of the microcontroller allows for efficient use of space on the circuit board.

Maximum Clock Frequency: 0.032 MHz

Support for a high clock frequency enables fast processing speeds, making the microcontroller suitable for time-critical applications.

Length: 14 mm

The compact length of the microcontroller contributes to a space-efficient design on the circuit board.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperatures.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller offers efficient data processing and execution of instructions, making it suitable for a wide range of applications.

RAM Bytes: 16384

The large RAM capacity allows for storing and accessing data efficiently during operation, enhancing the microcontroller's performance.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable for various applications.

Terminal Form: GULL WING

The gull-wing terminal form allows for easy soldering and connection to the circuit board, ensuring a reliable electrical connection.

Nominal Supply Voltage: 2.5 V

The specified nominal supply voltage ensures compatibility with standard power sources, simplifying the design and integration process.

PWM Channels: YES

The presence of PWM channels allows for precise control of analog components, making the microcontroller suitable for applications requiring accurate pulse-width modulation.

ROM Programmability: FLASH

The ROM programmability using flash technology enables easy reprogramming of the microcontroller, offering flexibility for firmware updates and customization.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for dense packing of terminals, maximizing connectivity options in a limited space.

Speed: 50 rpm

The specified speed parameter may refer to the processing speed or other operational characteristics of the microcontroller, ensuring optimal performance in desired applications.

No. of I/O Lines: 43

The availability of 43 I/O lines allows for versatile input and output configurations, enabling the microcontroller to interface with a wide range of external devices.

Technical Specifications

Microcontrollers LM3S1165-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

43

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1165-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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