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LM3S1162-EQC50-A2

Texas Instruments

LM3S1162-EQC50-A2 by Texas Instruments

LM3S1162-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 46 I/O lines, 16384 RAM bytes, and 65536 ROM words. It operates in industrial temperatures (-40 to 105°C) and has a max clock frequency of 8.192 MHz. Ideal for applications requiring high-speed processing and multiple PWM channels.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,369 parts In-Stock

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4,369

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Vyrian

USA . 2,866 parts In-Stock

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2,866

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Distributors (Availability)

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One Stop Electronics

USA . 520 parts In-Stock

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$10.000

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520

$10.000

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AZTECH Wire

Italy . 196 parts In-Stock

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$16.614

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196

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Parana Technologies

USA . 594 parts In-Stock

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$24.698

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$25.360

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594

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$25.360

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DigiPath Technology Company

USA . 1,526 parts In-Stock

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$27.195

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1,526

$27.195

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ChromeModa Solutions

Germany . 6,332 parts In-Stock

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$27.750

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$22.755

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6,332

$27.750

$22.755

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IDEA Electronic Components Group

UK . 1,089 parts In-Stock

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$27.750

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$26.362

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$24.975

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1,089

$27.750

$26.362

$24.975

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Microchip USA

USA . 1,559 parts In-Stock

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$47.210

100+ parts

$46.390

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$45.980

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$45.570

1,559

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$46.390

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$45.570

QUARKTWIN TECHNOLOGY LTD

USA . 2,188 parts In-Stock

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Corphita

USA . 2,095 parts In-Stock

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Overview

Elevate your projects with the LM3S1162-EQC50-A2 by Texas Instruments, a top-of-the-line microcontroller that delivers unparalleled performance and reliability. With Texas Instruments' renowned reputation for quality, this microcontroller is perfect for a wide range of applications. From industrial automation to consumer electronics, this powerful device offers customers exceptional value, benefits, and advantages. Experience seamless operation, precise control, and innovative solutions with the LM3S1162-EQC50-A2, setting a new standard in microcontroller technology.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount - YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage - 2.75 V

Operates efficiently within a low maximum supply voltage range, ideal for power-sensitive applications.

Bit Size - 32

Generates strong processing power with a 32-bit architecture, suitable for handling complex tasks.

Power Supplies (V) - 2.5,3.3

Supports multiple power supply voltages, offering flexibility in application design.

No. of Terminals - 100

Provides ample terminal connections for interfacing with external components and peripherals.

Package Style (Meter) - FLATPACK

The flatpack design ensures easy handling and placement during assembly processes.

Maximum Operating Temperature - 105 °C

Withstands high operating temperatures, suitable for industrial environments.

ADC Channels - YES

Integrated analog-to-digital converter channels enable precise measurements and sensor data acquisition.

ROM Words - 65536

Large ROM capacity allows for storing program instructions and data, supporting extensive applications.

Maximum Clock Frequency - 8.192 MHz

Operates at a high clock frequency for fast processing speeds and real-time responsiveness.

Temperature Grade - INDUSTRIAL

Designed to withstand harsh industrial environments and temperature fluctuations.

RAM Bytes - 16384

Offers sufficient random access memory for temporary data storage and manipulation.

Technical Specifications

Microcontrollers LM3S1162-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1162-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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