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DLPC300ZVB

Texas Instruments

DLPC300ZVB by Texas Instruments

DLPC300ZVB by Texas Instruments is a consumer IC with 176 terminals in a square grid array package. It operates at supply voltages ranging from 0.95V to 1.8V, making it suitable for various consumer circuit applications requiring precise power management and compact design. With a low seated height of 1mm and ball terminal form, this IC offers high performance in a small footprint for space-constrained electronic devices.

Median Price

$34.680

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5 parts In-Stock

1+ parts

$14.100

100+ parts

$13.800

1k+ parts

-

10k+ parts

-

5

$14.100

$13.800

-

-

Verical

USA . 5 parts In-Stock

1+ parts

$14.100

100+ parts

$13.800

1k+ parts

-

10k+ parts

-

5

$14.100

$13.800

-

-

Chip1Stop

Japan . 7 parts In-Stock

1+ parts

$36.420

100+ parts

-

1k+ parts

-

10k+ parts

-

7

$36.420

-

-

-

DigiKey

USA . 40 parts In-Stock

1+ parts

$53.900

100+ parts

$41.558

1k+ parts

-

10k+ parts

-

40

$53.900

$41.558

-

-

Rochester

USA . 5 parts In-Stock

1+ parts

-

100+ parts

$34.680

1k+ parts

$31.030

10k+ parts

$29.200

5

-

$34.680

$31.030

$29.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,267 parts In-Stock

1+ parts

$31.825

100+ parts

-

1k+ parts

-

10k+ parts

-

3,267

$31.825

-

-

-

Vyrian

USA . 2,687 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,687

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 340 parts In-Stock

1+ parts

$0.117

100+ parts

-

1k+ parts

-

10k+ parts

$0.113

340

$0.117

-

-

$0.113

Northwest PG Solutions

USA . 1,719 parts In-Stock

1+ parts

$0.129

100+ parts

-

1k+ parts

-

10k+ parts

$0.114

1,719

$0.129

-

-

$0.114

Parana Technologies

USA . 2,312 parts In-Stock

1+ parts

$3.378

100+ parts

-

1k+ parts

$3.906

10k+ parts

-

2,312

$3.378

-

$3.906

-

ChromeModa Solutions

Germany . 4,122 parts In-Stock

1+ parts

$3.795

100+ parts

$3.112

1k+ parts

-

10k+ parts

-

4,122

$3.795

$3.112

-

-

IDEA Electronic Components Group

UK . 1,380 parts In-Stock

1+ parts

$3.795

100+ parts

-

1k+ parts

$3.416

10k+ parts

-

1,380

$3.795

-

$3.416

-

Corphita

USA . 2,754 parts In-Stock

1+ parts

$30.150

100+ parts

-

1k+ parts

-

10k+ parts

-

2,754

$30.150

-

-

-

Microchip USA

USA . 1,055 parts In-Stock

1+ parts

$100.300

100+ parts

$98.560

1k+ parts

$97.690

10k+ parts

$96.810

1,055

$100.300

$98.560

$97.690

$96.810

A-Z Elektronik GmbH

Germany . 5,463 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,463

-

-

-

-

Alle Elektronik GmbH

Germany . 3,642 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,642

-

-

-

-

DigiPath Technology Company

USA . 1,106 parts In-Stock

1+ parts

-

100+ parts

$3.422

1k+ parts

-

10k+ parts

-

1,106

-

$3.422

-

-

Kepictronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Perfect Parts

USA . 510 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

510

-

-

-

-

Overview

Unlock the power of innovation with the DLPC300ZVB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality consumer ICs like this one, designed for a wide range of applications. This compact square-shaped package offers customers a multitude of benefits, from its surface mount capability to its efficient power supplies and 176 terminals. Experience the value of high performance and reliability with the DLPC300ZVB, setting new standards in consumer circuit technology.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Package Shape: SQUARE

Square package shape provides better utilization of space on a circuit board, allowing for a more compact design.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronics, ensuring compatibility and optimal performance in consumer devices.

Power Supplies (V): 1, 1.8

Supports multiple power supply options, offering flexibility in design and compatibility with various systems.

No. of Terminals: 176

High number of terminals allows for more connections and functionality, making it versatile for different applications.

Package Style (Meter): GRID ARRAY

Grid array package style provides better thermal performance and reliability, suitable for demanding applications.

Terminal Finish: TIN SILVER COPPER

Combination of finishes offers excellent conductivity, corrosion resistance, and durability for long-term usage.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure mounting on the circuit board, ensuring stability during operation.

Maximum Seated Height: 1 mm

Low seated height allows for compact design and efficient use of space in electronic devices.

Width: 7 mm

Narrow width enables space-saving placement on the circuit board, ideal for applications with limited space availability.

Minimum Supply Voltage (Vsup): 0.95 V

Supports low supply voltage requirements, offering energy efficiency and compatibility with low-power systems.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable soldering process during assembly, leading to better quality and durability.

Length: 7 mm

Compact length allows for versatile placement on the circuit board and contributes to a smaller overall footprint of the product.

Terminal Form: BALL

Ball terminal form provides good electrical connection and mechanical stability, enhancing the overall reliability of the product.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for denser packing of terminals on the IC, enhancing functionality and performance in a compact package.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, suitable for standard assembly processes and environments with controlled humidity.

Maximum Supply Voltage (Vsup): 1.05 V

Supports higher supply voltage requirements, ensuring compatibility with a wide range of systems and applications.

Technical Specifications

Other Function Consumer ICs DLPC300ZVB attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-XBGA-B176

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

176

Package Body Material:

UNSPECIFIED

Package Code:

BGA

Package Equivalence Code:

BGA176,15X15,16

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1,1.8

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.05 V

Minimum Supply Voltage (Vsup):

.95 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

7 mm

Trade Compliance

DLPC300ZVB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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