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DLPC3435CZEZ

Texas Instruments

DLPC3435CZEZ by Texas Instruments

DLPC3435CZEZ by Texas Instruments is a consumer IC with 201 terminals in a grid array package. It operates b/w -30 to 85°C, with Vsup ranging from 1.045V to 1.155V. This IC is suitable for applications requiring fine pitch and thin profile packages.

Median Price

$13.182

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 16,744 parts In-Stock

1+ parts

$13.280

100+ parts

$11.600

1k+ parts

$8.000

10k+ parts

-

16,744

$13.280

$11.600

$8.000

-

Arrow

USA . 119 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$13.085

10k+ parts

-

119

-

-

$13.085

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,432 parts In-Stock

1+ parts

$12.616

100+ parts

-

1k+ parts

-

10k+ parts

-

4,432

$12.616

-

-

-

Vyrian

USA . 6,694 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,694

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 962 parts In-Stock

1+ parts

$0.384

100+ parts

-

1k+ parts

$1.580

10k+ parts

-

962

$0.384

-

$1.580

-

DigiPath Technology Company

USA . 184 parts In-Stock

1+ parts

$0.423

100+ parts

$0.389

1k+ parts

-

10k+ parts

-

184

$0.423

$0.389

-

-

ChromeModa Solutions

Germany . 993 parts In-Stock

1+ parts

$0.432

100+ parts

$0.354

1k+ parts

-

10k+ parts

-

993

$0.432

$0.354

-

-

IDEA Electronic Components Group

UK . 918 parts In-Stock

1+ parts

$0.432

100+ parts

-

1k+ parts

$0.389

10k+ parts

-

918

$0.432

-

$0.389

-

Corphita

USA . 567 parts In-Stock

1+ parts

$11.952

100+ parts

-

1k+ parts

-

10k+ parts

-

567

$11.952

-

-

-

Microchip USA

USA . 2,615 parts In-Stock

1+ parts

$36.880

100+ parts

$36.350

1k+ parts

$36.090

10k+ parts

$35.820

2,615

$36.880

$36.350

$36.090

$35.820

Lixinc

USA . 13,806 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,806

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,428 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,428

-

-

-

-

Kepictronics

USA . 1,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,200

-

-

-

-

Northwest PG Solutions

USA . 968 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.616

10k+ parts

-

968

-

-

$4.616

-

Native Components

USA . 650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.569

10k+ parts

-

650

-

-

$4.569

-

Overview

Discover the cutting-edge DLPC3435CZEZ by Texas Instruments, a top-quality Consumer IC that promises reliable performance in a variety of applications. With Texas Instruments' renowned reputation for excellence in manufacturing, this product offers unmatched value and benefits to customers. Whether you're looking to enhance your consumer electronics or streamline your industrial processes, the DLPC3435CZEZ is the perfect solution. Upgrade your technology with this innovative IC and experience the advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

Square package shape is compact and ideal for space-constrained applications.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronics applications, ensuring optimal performance and compatibility.

No. of Terminals: 201

Large number of terminals provide flexibility for connecting to various components in the circuit.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array style with a thin profile and fine pitch allows for high-density mounting and efficient signal routing.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in a wide range of environments.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature allows for use in cold conditions without compromising functionality.

Terminal Finish: TIN SILVER COPPER

Terminal finish of Tin, Silver, Copper provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easy soldering and mounting on the circuit board.

Maximum Seated Height: 1 mm

Low seated height helps in maintaining a slim profile and efficient use of space in the device.

Width: 13 mm

Compact width enables the product to be used in small form factor devices.

Minimum Supply Voltage (Vsup): 1.045 V

Low minimum supply voltage ensures energy efficiency and compatibility with various power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature allows for thorough soldering and reliable connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature enables robust solder joints and long-term reliability.

Length: 13 mm

Short length makes the product suitable for compact devices and space-constrained applications.

Terminal Form: BALL

Ball terminal form provides efficient electrical connections and ease of soldering.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting and efficient signal routing.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, suitable for standard handling and storage conditions.

Maximum Supply Voltage (Vsup): 1.155 V

Moderate maximum supply voltage ensures safe operation and protection against overvoltage situations.

Technical Specifications

Other Function Consumer ICs DLPC3435CZEZ attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B201

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

201

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.155 V

Minimum Supply Voltage (Vsup):

1.045 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Trade Compliance

DLPC3435CZEZ General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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