Loading...

DLPC100ZCT

Texas Instruments

DLPC100ZCT by Texas Instruments

DLPC100ZCT by Texas Instruments is a consumer IC with 256 terminals in a square package. It operates b/w -20 to 85°C, with power supplies of 1.2-2.5V. Ideal for applications requiring low profile and fine pitch grid array packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,740

-

-

-

-

Digiode

USA . 1,986 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,986

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 1,507 parts In-Stock

1+ parts

$2.900

100+ parts

-

1k+ parts

-

10k+ parts

-

1,507

$2.900

-

-

-

Parana Technologies

USA . 560 parts In-Stock

1+ parts

$3.028

100+ parts

-

1k+ parts

$3.538

10k+ parts

-

560

$3.028

-

$3.538

-

DigiPath Technology Company

USA . 195 parts In-Stock

1+ parts

$3.334

100+ parts

$3.067

1k+ parts

-

10k+ parts

-

195

$3.334

$3.067

-

-

ChromeModa Solutions

Germany . 3,608 parts In-Stock

1+ parts

$3.402

100+ parts

$2.790

1k+ parts

-

10k+ parts

-

3,608

$3.402

$2.790

-

-

IDEA Electronic Components Group

UK . 1,877 parts In-Stock

1+ parts

$3.402

100+ parts

-

1k+ parts

$3.062

10k+ parts

-

1,877

$3.402

-

$3.062

-

AZTECH Wire

Italy . 884 parts In-Stock

1+ parts

$12.494

100+ parts

-

1k+ parts

-

10k+ parts

-

884

$12.494

-

-

-

One Stop Electronics

USA . 507 parts In-Stock

1+ parts

$15.800

100+ parts

-

1k+ parts

-

10k+ parts

-

507

$15.800

-

-

-

Corphita

USA . 2,370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,370

-

-

-

-

Microchip USA

USA . 474 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

474

-

-

-

-

Native Components

USA . 324 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.557

10k+ parts

-

324

-

-

$2.557

-

Overview

Discover the DLPC100ZCT by Texas Instruments, a cutting-edge consumer IC that offers unmatched quality and reliability. Manufactured by the trusted brand, this versatile product is perfect for a wide range of applications. With its innovative design and advanced features, customers can expect superior performance and efficiency. Upgrade your technology with the DLPC100ZCT and experience the value and benefits it brings to your projects. Trust Texas Instruments for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications while ensuring high reliability.

Surface Mount: YES

The surface mount design allows for easy and efficient installation onto circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

The square shape facilitates a compact design, enabling the product to fit neatly within electronic devices with limited space.

Power Supplies (V): 1.2,1.8,2.5

Having multiple power supply options gives flexibility in designing and operating the device within different voltage ranges.

No. of Terminals: 256

The high number of terminals allows for a complex circuit design, offering more functionality and capabilities in the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style provides a sturdy and compact form factor, enhancing the product's performance and reliability.

Maximum Operating Temperature: 85 °C

With a high maximum temperature tolerance, the product can operate in various environments without risking overheating or damage.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature ensures the product can function reliably in cold conditions, expanding its use in different settings.

Terminal Position: BOTTOM

Bottom terminal position helps in efficient heat dissipation and ensures better connectivity for improved performance.

Maximum Seated Height: 1.46 mm

Having a low seated height contributes to a slim design and allows for compact integration within electronic devices.

Width: 14 mm

The narrow width makes the product suitable for applications where space is limited, providing flexibility in placement.

Minimum Supply Voltage (Vsup): 1.15 V

The low minimum supply voltage ensures the product can operate efficiently even with limited power, enhancing energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

With a short time at peak reflow temperature, the product can undergo reflow soldering quickly and effectively for reliable manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance enables the product to undergo soldering processes without compromising its performance.

Length: 14 mm

The compact length allows for a smaller overall footprint, making the product suitable for applications with size constraints.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections, ensuring stable performance and compatibility with various systems.

Terminal Pitch: 0.8 mm

The small terminal pitch enables high-density mounting, facilitating intricate circuit designs and enhancing overall functionality.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the product can withstand moderate exposure to moisture during handling and storage, ensuring long-term reliability.

Maximum Supply Voltage (Vsup): 1.25 V

The maximum supply voltage limit protects the product from potential voltage spikes or overload, ensuring safe operation and longevity.

Technical Specifications

Other Function Consumer ICs DLPC100ZCT attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B256

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,2.5

Qualification:

Not Qualified

Maximum Seated Height:

1.46 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.25 V

Minimum Supply Voltage (Vsup):

1.15 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

DLPC100ZCT General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19