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DLPC230STZDQQ1

Texas Instruments

DLPC230STZDQQ1 by Texas Instruments

DLPC230STZDQQ1 by Texas Instruments is a consumer circuit IC with 324 terminals in a grid array package. It operates b/w -40 to 105°C, suitable for industrial applications. With a min supply voltage of 1.045V and max seated height of 2.352mm, it's ideal for compact electronic devices.

Median Price

$45.240

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 26,966 parts In-Stock

1+ parts

$30.536

100+ parts

$27.143

1k+ parts

$19.958

10k+ parts

-

26,966

$30.536

$27.143

$19.958

-

Mouser Electronics

USA . 9 parts In-Stock

1+ parts

$45.240

100+ parts

$34.590

1k+ parts

$33.910

10k+ parts

-

9

$45.240

$34.590

$33.910

-

DigiKey

USA . 12 parts In-Stock

1+ parts

$45.250

100+ parts

-

1k+ parts

-

10k+ parts

-

12

$45.250

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,007 parts In-Stock

1+ parts

$29.009

100+ parts

-

1k+ parts

-

10k+ parts

-

3,007

$29.009

-

-

-

Vyrian

USA . 7,914 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,914

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 709 parts In-Stock

1+ parts

$2.721

100+ parts

-

1k+ parts

$3.203

10k+ parts

-

709

$2.721

-

$3.203

-

DigiPath Technology Company

USA . 1,421 parts In-Stock

1+ parts

$2.996

100+ parts

-

1k+ parts

-

10k+ parts

-

1,421

$2.996

-

-

-

ChromeModa Solutions

Germany . 4,266 parts In-Stock

1+ parts

$3.057

100+ parts

$2.507

1k+ parts

-

10k+ parts

-

4,266

$3.057

$2.507

-

-

IDEA Electronic Components Group

UK . 538 parts In-Stock

1+ parts

$3.057

100+ parts

-

1k+ parts

$2.751

10k+ parts

-

538

$3.057

-

$2.751

-

Corphita

USA . 55 parts In-Stock

1+ parts

$27.482

100+ parts

-

1k+ parts

-

10k+ parts

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55

$27.482

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-

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Native Components

USA . 640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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640

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-

-

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Northwest PG Solutions

USA . 631 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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631

-

-

-

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A-Z Elektronik GmbH

Germany . 200 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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200

-

-

-

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Overview

Elevate your consumer electronic designs with the DLPC230STZDQQ1 by Texas Instruments, a top-of-the-line product in the category of Other Function Consumer ICs. Manufactured with precision and reliability in mind, this IC offers unparalleled value and benefits to customers looking for high-quality components for their projects. With a wide range of applications and a temperature grade of INDUSTRIAL, this square-shaped IC is perfect for various consumer circuit designs. Upgrade your electronic devices today with the DLPC230STZDQQ1 and experience the difference Texas Instruments can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the IC, ensuring longer lifespan and reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost in manufacturing processes.

Screening Level: AEC-Q100

AEC-Q100 compliance ensures high quality and reliability, making the IC suitable for automotive applications that require strict standards.

Package Shape: SQUARE

Square package shape offers good thermal performance and efficient use of PCB space, making it ideal for compact designs.

General IC Type: CONSUMER CIRCUIT

Designed for consumer electronic applications, this IC is optimized for performance, cost-effectiveness, and compatibility with a wide range of products.

No. of Terminals: 324

Having a large number of terminals allows for versatile connectivity options, enabling the IC to be used in various complex circuit configurations.

Package Style (Meter): GRID ARRAY

Grid array package style offers high density and improved electrical performance, making the IC suitable for high-speed and high-frequency applications.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions and operate reliably in challenging thermal environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the IC to function in both extreme cold and hot conditions, ensuring versatility and reliability in various environments.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and PCB mounting, simplifying assembly processes and ensuring mechanical stability.

Maximum Seated Height: 2.352 mm

Low seated height enables slim and compact designs, making the IC suitable for space-constrained applications.

Width: 23 mm

Compact width size allows for efficient use of PCB space and enables integration into small form factor devices.

Minimum Supply Voltage (Vsup): 1.045 V

Low minimum supply voltage requirement allows for energy-efficient operation and extends battery life in portable electronic devices.

Length: 23 mm

Compact length size offers flexibility in PCB layout and design, making it easier to accommodate the IC in various product configurations.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments, making the IC suitable for industrial control and automation applications.

Terminal Form: BALL

Ball terminal form enables precise and reliable solder connections, improving electrical performance and ensuring long-term stability.

Terminal Pitch: 1 mm

Fine terminal pitch allows for high-density integration and compact design, making the IC suitable for applications that require miniaturization and space-saving solutions.

Maximum Supply Voltage (Vsup): 1.155 V

With a low maximum supply voltage requirement, the IC operates efficiently and safely without risking damage from voltage spikes or surges.

Technical Specifications

Other Function Consumer ICs DLPC230STZDQQ1 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B324

Length:

23 mm

No. of Functions:

1

No. of Terminals:

324

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA324,.22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Screening Level:

AEC-Q100

Maximum Seated Height:

2.352 mm

Maximum Supply Voltage (Vsup):

1.155 V

Minimum Supply Voltage (Vsup):

1.045 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

23 mm

Trade Compliance

DLPC230STZDQQ1 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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