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DLPC200ZEWT

Texas Instruments

DLPC200ZEWT by Texas Instruments

DLPC200ZEWT by Texas Instruments is a consumer IC with 780 terminals, operating at 0-70°C. It has power supplies of 1.2V, 1.8V, and 2.5V, suitable for commercial applications requiring a compact GRID ARRAY package style. The PLASTIC/EPOXY material and surface mount feature make it versatile for various electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,200

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-

-

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Vyrian

USA . 3,172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,172

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 707 parts In-Stock

1+ parts

$3.312

100+ parts

-

1k+ parts

$3.835

10k+ parts

-

707

$3.312

-

$3.835

-

DigiPath Technology Company

USA . 517 parts In-Stock

1+ parts

$3.647

100+ parts

$3.355

1k+ parts

-

10k+ parts

-

517

$3.647

$3.355

-

-

ChromeModa Solutions

Germany . 1,773 parts In-Stock

1+ parts

$3.721

100+ parts

$3.051

1k+ parts

-

10k+ parts

-

1,773

$3.721

$3.051

-

-

IDEA Electronic Components Group

UK . 1,732 parts In-Stock

1+ parts

$3.721

100+ parts

-

1k+ parts

$3.349

10k+ parts

-

1,732

$3.721

-

$3.349

-

AZTECH Wire

Italy . 423 parts In-Stock

1+ parts

$15.840

100+ parts

-

1k+ parts

-

10k+ parts

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423

$15.840

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-

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One Stop Electronics

USA . 1,104 parts In-Stock

1+ parts

$21.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,104

$21.800

-

-

-

Native Components

USA . 451 parts In-Stock

1+ parts

$150.000

100+ parts

-

1k+ parts

-

10k+ parts

$144.000

451

$150.000

-

-

$144.000

Northwest PG Solutions

USA . 1,733 parts In-Stock

1+ parts

$165.000

100+ parts

-

1k+ parts

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10k+ parts

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1,733

$165.000

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-

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Corphita

USA . 921 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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921

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Microchip USA

USA . 494 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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494

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Overview

Elevate your consumer electronic designs with the DLPC200ZEWT by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in the form of this consumer circuit IC. With a wide range of applications, this product offers unparalleled value to customers seeking high performance and efficiency in their devices. Experience the benefits of advanced power supplies, precise terminal positioning, and a durable package body material. Trust Texas Instruments to provide innovative solutions for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for consumer electronics.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards.

Power Supplies (V): 1.2, 1.8, 2.5

The product supports multiple power supply voltages, providing flexibility for different applications.

Maximum Operating Temperature: 70 °C

The product can operate at high temperatures, ensuring reliable performance in various environments.

Terminal Form: BALL

The ball terminal form allows for easy and secure connections, enhancing the reliability of the product.

Technical Specifications

Other Function Consumer ICs DLPC200ZEWT attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B780

Length:

29 mm

No. of Functions:

1

No. of Terminals:

780

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA780,28X28,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.2,1.8,2.5

Qualification:

Not Qualified

Maximum Seated Height:

2.44 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.25 V

Minimum Supply Voltage (Vsup):

1.15 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

29 mm

Trade Compliance

DLPC200ZEWT General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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