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DLPC3430ZVBR

Texas Instruments

DLPC3430ZVBR by Texas Instruments

DLPC3430ZVBR by Texas Instruments is a consumer IC with 176 terminals in a square package. It operates b/w -30°C to 125°C, with Vsup ranging from 1.045V to 1.155V. This IC is suitable for applications requiring very thin profile and fine pitch grid array packages.

Median Price

$0.129

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.129

100+ parts

-

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500

$0.129

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Vyrian

USA . 8,277 parts In-Stock

1+ parts

-

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8,277

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Digiode

USA . 4,426 parts In-Stock

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4,426

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Chip Stock

USA . 3,700 parts In-Stock

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3,700

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,830 parts In-Stock

1+ parts

$0.718

100+ parts

-

1k+ parts

$1.742

10k+ parts

-

1,830

$0.718

-

$1.742

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ChromeModa Solutions

Germany . 4,904 parts In-Stock

1+ parts

$0.807

100+ parts

$0.662

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-

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4,904

$0.807

$0.662

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IDEA Electronic Components Group

UK . 1,030 parts In-Stock

1+ parts

$0.807

100+ parts

-

1k+ parts

$0.726

10k+ parts

-

1,030

$0.807

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$0.726

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AZTECH Wire

Italy . 351 parts In-Stock

1+ parts

$12.028

100+ parts

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351

$12.028

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One Stop Electronics

USA . 1,193 parts In-Stock

1+ parts

$21.800

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1,193

$21.800

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Native Components

USA . 45 parts In-Stock

1+ parts

$18,748.801

100+ parts

$18,373.825

1k+ parts

$18,186.337

10k+ parts

$17,998.849

45

$18,748.801

$18,373.825

$18,186.337

$17,998.849

Northwest PG Solutions

USA . 562 parts In-Stock

1+ parts

$20,623.681

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562

$20,623.681

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Lixinc

USA . 14,186 parts In-Stock

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14,186

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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7,500

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A-Z Elektronik GmbH

Germany . 5,345 parts In-Stock

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5,345

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Alle Elektronik GmbH

Germany . 3,563 parts In-Stock

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3,563

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Corphita

USA . 2,833 parts In-Stock

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2,833

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DigiPath Technology Company

USA . 1,715 parts In-Stock

1+ parts

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100+ parts

$0.728

1k+ parts

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1,715

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$0.728

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Microchip USA

USA . 468 parts In-Stock

1+ parts

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468

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Futuretech Components

Singapore . 124 parts In-Stock

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124

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Overview

Unlock endless possibilities with the Texas Instruments DLPC3430ZVBR, a cutting-edge consumer circuit that brings innovation to your projects. Manufactured by industry leader Texas Instruments, this high-quality IC offers reliability and performance like no other. Ideal for a wide range of applications, this product provides value and benefits that go beyond expectations. Say goodbye to limitations and hello to endless opportunities with the DLPC3430ZVBR from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for consumer electronics, providing durability and cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for smaller and lighter circuit designs, making the product more compact.

Package Shape: SQUARE

The square shape helps in efficient space utilization on circuit boards, optimizing the layout and reducing overall size.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature enables the product to function in a wide range of temperature environments.

Width: 7 mm

The narrow width of 7mm allows for more components to be placed side by side, increasing functionality in a small space.

Minimum Supply Voltage (Vsup): 1.045 V

The low minimum supply voltage makes the product energy-efficient and suitable for battery-operated devices.

Technical Specifications

Other Function Consumer ICs DLPC3430ZVBR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B176

Length:

7 mm

No. of Functions:

1

No. of Terminals:

176

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.155 V

Minimum Supply Voltage (Vsup):

1.045 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

7 mm

Trade Compliance

DLPC3430ZVBR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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