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DLPC23STZDQRQ1

Texas Instruments

DLPC23STZDQRQ1 by Texas Instruments

DLPC23STZDQRQ1 by Texas Instruments is a consumer IC with 324 terminals in a grid array package. It operates b/w -40 to 105°C, suitable for industrial applications. With a min supply voltage of 1.045V and max of 1.155V, it is ideal for various electronic devices requiring precise control and processing capabilities.

Median Price

$30.536

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 914 parts In-Stock

1+ parts

$30.536

100+ parts

$27.143

1k+ parts

$19.958

10k+ parts

-

914

$30.536

$27.143

$19.958

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,729 parts In-Stock

1+ parts

$29.009

100+ parts

-

1k+ parts

-

10k+ parts

-

4,729

$29.009

-

-

-

Vyrian

USA . 5,214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,214

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,776 parts In-Stock

1+ parts

$2.566

100+ parts

-

1k+ parts

$3.055

10k+ parts

-

1,776

$2.566

-

$3.055

-

DigiPath Technology Company

USA . 190 parts In-Stock

1+ parts

$2.825

100+ parts

-

1k+ parts

-

10k+ parts

-

190

$2.825

-

-

-

ChromeModa Solutions

Germany . 5,971 parts In-Stock

1+ parts

$2.883

100+ parts

$2.364

1k+ parts

-

10k+ parts

-

5,971

$2.883

$2.364

-

-

IDEA Electronic Components Group

UK . 2,362 parts In-Stock

1+ parts

$2.883

100+ parts

-

1k+ parts

$2.595

10k+ parts

-

2,362

$2.883

-

$2.595

-

AZTECH Wire

Italy . 128 parts In-Stock

1+ parts

$15.170

100+ parts

-

1k+ parts

-

10k+ parts

-

128

$15.170

-

-

-

Corphita

USA . 298 parts In-Stock

1+ parts

$27.482

100+ parts

-

1k+ parts

-

10k+ parts

-

298

$27.482

-

-

-

Northwest PG Solutions

USA . 2,315 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,315

-

-

-

-

Native Components

USA . 695 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

695

-

-

-

-

Overview

Unlock the potential of cutting-edge technology with the DLPC23STZDQRQ1 by Texas Instruments. Designed with precision and quality in mind, this innovative consumer IC offers unparalleled performance and reliability. From automotive to industrial applications, this versatile product is a game-changer in the electronics industry. Experience the value and benefits of Texas Instruments' expertise with the DLPC23STZDQRQ1, where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for consumer applications.

Surface Mount: YES

Being surface mountable allows for easier and cleaner assembly on PCBs, saving space and reducing production time.

Screening Level: AEC-Q100

AEC-Q100 certification ensures high reliability and quality standards, making it suitable for automotive applications.

Package Shape: SQUARE

Square package shape helps in efficient use of PCB space and easy integration into electronic designs.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and operate reliably.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows the product to function effectively in both extreme cold and hot conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and integration, ensuring a more compact and efficient design.

Terminal Pitch: 1 mm

The small terminal pitch enables high-density mounting, allowing for more components to be placed in a limited space.

Technical Specifications

Other Function Consumer ICs DLPC23STZDQRQ1 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B324

Length:

23 mm

No. of Functions:

1

No. of Terminals:

324

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA324,.22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Screening Level:

AEC-Q100

Maximum Seated Height:

2.352 mm

Maximum Supply Voltage (Vsup):

1.155 V

Minimum Supply Voltage (Vsup):

1.045 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

23 mm

Trade Compliance

DLPC23STZDQRQ1 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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