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DLPC3430ZVB

Texas Instruments

DLPC3430ZVB by Texas Instruments

DLPC3430ZVB by Texas Instruments is a consumer IC with 176 terminals in a square package. It operates b/w -30 to 125°C, with Vsup ranging from 1.045V to 1.155V. This IC is ideal for applications requiring a very thin profile and fine pitch grid array package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,619 parts In-Stock

1+ parts

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5,619

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Digiode

USA . 3,704 parts In-Stock

1+ parts

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3,704

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,179 parts In-Stock

1+ parts

$1.522

100+ parts

-

1k+ parts

$2.181

10k+ parts

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2,179

$1.522

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$2.181

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ChromeModa Solutions

Germany . 3,763 parts In-Stock

1+ parts

$1.710

100+ parts

$1.402

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3,763

$1.710

$1.402

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IDEA Electronic Components Group

UK . 2,332 parts In-Stock

1+ parts

$1.710

100+ parts

-

1k+ parts

$1.539

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2,332

$1.710

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$1.539

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AZTECH Wire

Italy . 310 parts In-Stock

1+ parts

$11.953

100+ parts

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310

$11.953

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One Stop Electronics

USA . 599 parts In-Stock

1+ parts

$17.800

100+ parts

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599

$17.800

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Corphita

USA . 4,834 parts In-Stock

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4,834

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Northwest PG Solutions

USA . 2,030 parts In-Stock

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2,030

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Microchip USA

USA . 414 parts In-Stock

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414

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Native Components

USA . 203 parts In-Stock

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203

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DigiPath Technology Company

USA . 49 parts In-Stock

1+ parts

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100+ parts

$1.542

1k+ parts

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49

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$1.542

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Overview

Experience unparalleled quality and innovation with the DLPC3430ZVB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments offers cutting-edge technology and reliability that you can trust. This versatile consumer IC is perfect for a wide range of applications, providing exceptional value and performance. With its advanced features and compact design, the DLPC3430ZVB delivers unmatched benefits and advantages to customers looking for top-notch functionality in their electronic devices. Elevate your projects with Texas Instruments and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal circuitry, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and efficient assembly on PCBs, saving time and effort during manufacturing.

Package Shape: SQUARE

Saves space on the PCB and allows for efficient layout.

Maximum Operating Temperature: 125 °C

Ensures reliable operation even in high temperature environments.

Minimum Operating Temperature: -30 °C

Provides versatility and allows for operation in cold temperature conditions.

Terminal Position: BOTTOM

Facilitates easy connection to other components on the PCB.

Width: 7 mm

Compact size allows for flexibility in PCB design and layout.

Minimum Supply Voltage (Vsup): 1.045 V

Low minimum supply voltage requirement helps in energy efficiency.

Terminal Form: BALL

Ball terminals ensure reliable and secure connection.

Terminal Pitch: 0.4 mm

Fine pitch allows for dense layout and miniaturization of the product.

Technical Specifications

Other Function Consumer ICs DLPC3430ZVB attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B176

Length:

7 mm

No. of Functions:

1

No. of Terminals:

176

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.155 V

Minimum Supply Voltage (Vsup):

1.045 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

7 mm

Trade Compliance

DLPC3430ZVB General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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