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DLPC120ZXSRQ1

Texas Instruments

DLPC120ZXSRQ1 by Texas Instruments

DLPC120ZXSRQ1 by Texas Instruments is a consumer IC with 216 terminals in a low profile grid array package. It operates b/w -40 to 105°C, suitable for industrial applications. With a terminal pitch of 1mm and moisture sensitivity level of 3, it is ideal for compact electronic devices.

Median Price

$19.530

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 444 parts In-Stock

1+ parts

$19.530

100+ parts

$13.504

1k+ parts

$12.986

10k+ parts

-

444

$19.530

$13.504

$12.986

-

Mouser Electronics

USA . 265 parts In-Stock

1+ parts

$19.530

100+ parts

$13.510

1k+ parts

$12.670

10k+ parts

-

265

$19.530

$13.510

$12.670

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,365 parts In-Stock

1+ parts

$12.616

100+ parts

-

1k+ parts

-

10k+ parts

-

2,365

$12.616

-

-

-

Vyrian

USA . 4,570 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,570

-

-

-

-

Bristol Electronics

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 454 parts In-Stock

1+ parts

$0.067

100+ parts

-

1k+ parts

-

10k+ parts

$0.064

454

$0.067

-

-

$0.064

Northwest PG Solutions

USA . 401 parts In-Stock

1+ parts

$0.074

100+ parts

-

1k+ parts

-

10k+ parts

$0.065

401

$0.074

-

-

$0.065

Parana Technologies

USA . 1,503 parts In-Stock

1+ parts

$0.754

100+ parts

-

1k+ parts

$1.757

10k+ parts

-

1,503

$0.754

-

$1.757

-

DigiPath Technology Company

USA . 593 parts In-Stock

1+ parts

$0.830

100+ parts

-

1k+ parts

-

10k+ parts

-

593

$0.830

-

-

-

ChromeModa Solutions

Germany . 5,184 parts In-Stock

1+ parts

$0.847

100+ parts

$0.695

1k+ parts

-

10k+ parts

-

5,184

$0.847

$0.695

-

-

IDEA Electronic Components Group

UK . 2,371 parts In-Stock

1+ parts

$0.847

100+ parts

-

1k+ parts

$0.762

10k+ parts

-

2,371

$0.847

-

$0.762

-

Corphita

USA . 1,499 parts In-Stock

1+ parts

$11.952

100+ parts

-

1k+ parts

-

10k+ parts

-

1,499

$11.952

-

-

-

Microchip USA

USA . 2,809 parts In-Stock

1+ parts

$32.480

100+ parts

$32.020

1k+ parts

$31.780

10k+ parts

$31.550

2,809

$32.480

$32.020

$31.780

$31.550

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Overview

Enhance your consumer electronics with the DLPC120ZXSRQ1 from Texas Instruments, a cutting-edge consumer circuit IC that delivers unmatched performance and reliability. Designed with high-quality materials and advanced technology, this product is perfect for applications requiring precision and efficiency. With a wide operating temperature range and compact design, it offers exceptional value and benefits to customers looking for top-notch solutions in the electronics industry. Upgrade your devices today with the DLPC120ZXSRQ1 and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the components inside, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high quality and reliability for automotive applications, making this product suitable for harsh environments.

Package Shape: SQUARE

Square package shape enables efficient use of board space and easy alignment during assembly.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, this IC is optimized for performance, power efficiency, and cost-effectiveness.

No. of Terminals: 216

With a high number of terminals, this IC can support complex circuit connections and functions.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Grid array package style with low profile design allows for compact integration and efficient heat dissipation.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold environments without degradation in performance.

Terminal Finish: TIN SILVER COPPER

Terminal finish with tin, silver, and copper provides excellent electrical conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure soldering connections on the PCB.

Maximum Seated Height: 1.66 mm

Low maximum seated height enables slim and compact device designs.

Width: 17 mm

Compact width allows for efficient board space utilization and integration in small form factor devices.

Minimum Supply Voltage (Vsup): 1.14 V

Low minimum supply voltage enables operation in low-power applications and extends battery life.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures proper soldering and component reliability during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable soldering and ensures component integrity during assembly.

Length: 17 mm

Compact length enables space-efficient designs and easy integration in various electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh temperature environments, making this IC suitable for a wide range of industrial applications.

Terminal Form: BALL

Ball terminal form provides secure connections and enables high-density mounting for improved PCB layout efficiency.

Terminal Pitch: 1 mm

With a small terminal pitch of 1mm, this IC supports high-density circuit designs and efficient board space utilization.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that this IC can withstand multiple reflow cycles without moisture-induced damage, ensuring long-term reliability.

Maximum Supply Voltage (Vsup): 1.26 V

Low maximum supply voltage ensures compatibility with a wide range of power sources and minimizes power consumption.

Technical Specifications

Other Function Consumer ICs DLPC120ZXSRQ1 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B216

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

216

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.66 mm

Maximum Supply Voltage (Vsup):

1.26 V

Minimum Supply Voltage (Vsup):

1.14 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Trade Compliance

DLPC120ZXSRQ1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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